JP6494855B2 - 電子モジュール - Google Patents
電子モジュール Download PDFInfo
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- JP6494855B2 JP6494855B2 JP2018500751A JP2018500751A JP6494855B2 JP 6494855 B2 JP6494855 B2 JP 6494855B2 JP 2018500751 A JP2018500751 A JP 2018500751A JP 2018500751 A JP2018500751 A JP 2018500751A JP 6494855 B2 JP6494855 B2 JP 6494855B2
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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Description
絶縁性基板と、
前記絶縁性基板に設けられた導体層と、
前記導体層に設けられた電子素子と、
前記絶縁性基板の前記電子素子と反対側に設けられた放熱層と、
を備え、
前記放熱層が面方向で区分された複数の放熱層パターンを有してもよい。
前記電子素子はスイッチング素子を含んでもよい。
前記放熱層パターンは、前記放熱層パターン側から見たときに、前記電子素子が配置されている箇所の全体を含むようにして設けられてもよい。
前記放熱層パターンのうちの少なくとも一部は、前記放熱層パターン側から見たときに複数の電子素子の全体を覆ってもよい。
前記絶縁性基板は第一絶縁性基板及び第二絶縁性基板を有し、
前記電子素子は第一電子素子及び第二電子素子を有し、
前記放熱層は第一放熱層及び第二放熱層を有し、
前記第一絶縁性基板の一方側に第一電子素子が設けられ、
前記第一絶縁性基板の他方側に設けられた第一放熱層が設けられ、
前記第一電子素子の一方側に第二電子素子が設けられ、
前記第二電子素子の一方側に第二絶縁性基板が設けられ、
前記第二絶縁性基板の一方側に第二放熱層が設けられ、
前記第一電子素子及び前記第二電子素子のうちの少なくともいずれか一方はスイッチング素子を有し、前記第一電子素子がスイッチング素子を有する場合には、前記第一放熱層は面方向で区分された複数の第一放熱層パターンを有し、前記第二電子素子がスイッチング素子を有する場合には、前記第二放熱層は面方向で区分された複数の第二放熱層パターンを有してもよい。
前記導体層は、前記絶縁性基板から離隔した離隔部を有してもよい。
前記離隔部には前記電子素子が設けられていなくてもよい。
前記離隔部はグランド端子又は電源端子に接続されてもよい。
前記離隔部には前記電子素子が設けられてもよい。
前記絶縁性基板は第一絶縁性基板及び第二絶縁性基板を有し、
前記電子素子は第一電子素子及び第二電子素子を有し、
前記第一絶縁性基板の一方側に第一電子素子が設けられ、
前記第一電子素子の一方側に第二電子素子が設けられ、
前記第二電子素子の一方側に第二絶縁性基板が設けられ、
前記第一電子素子及び前記第二電子素子のうちの少なくともいずれか一方はスイッチング素子を有し、前記第一電子素子がスイッチング素子を有する場合には、前記離隔部は前記第一絶縁性基板から離隔した第一離隔部を有し、前記第二電子素子がスイッチング素子を有する場合には、前記離隔部は前記第二絶縁性基板から離隔した第二離隔部を有してもよい。
《構成》
図1に示すように、本実施の形態の電子モジュールは、絶縁性基板60と、絶縁性基板60のおもて面側に設けられた導体層20と、導体層20に設けられた電子素子40と、絶縁性基板60の裏面側(電子素子40と反対側)に設けられた放熱層10と、を有してもよい。放熱層10は面方向で区分された複数の放熱層パターン15を有してもよい。
次に、上述した構成からなる本実施の形態による作用・効果であって、未だ説明していないものについて説明する。「作用・効果」で記載するあらゆる構成も採用することができる。
次に、本発明の第2の実施の形態について説明する。第2の実施の形態において、第1の実施の形態と同じ又は同様の部材等については同じ符号を付し、その説明を省略する。
次に、本発明の第3の実施の形態について説明する。第3の実施の形態において、第1の実施の形態又は第2の実施の形態と同じ又は同様の部材等については同じ符号を付し、その説明を省略する。
次に、本発明の第4の実施の形態について説明する。第4の実施の形態において、第1の実施の形態、第2の実施の形態又は第3の実施の形態と同じ又は同様の部材等については同じ符号を付し、その説明を省略する。
11 第一放熱層
12 第二放熱層
15 放熱層パターン
16 第一放熱層パターン
20 導体層
25 離隔部
26 第一離隔部
27 第二離隔部
40 電子素子
41 第一電子素子
42 第二電子素子
60 絶縁性基板
61 第一絶縁性基板
62 第二絶縁性基板
70 グランド端子又は電源端子
Claims (7)
- 絶縁性基板と、
前記絶縁性基板に設けられた導体層と、
前記導体層に設けられた電子素子と、
前記絶縁性基板の前記電子素子と反対側に設けられた放熱層と、
少なくとも前記電子素子を封入する封止部と、
を備え、
前記導体層は、前記絶縁性基板から離隔した離隔部を有し、
前記離隔部には前記電子素子が設けられ、
前記離隔部の他方側であって、前記離隔部と前記絶縁性基板との間に前記封止部が設けられる電子モジュール。
- 前記絶縁性基板は第一絶縁性基板及び第二絶縁性基板を有し、
前記電子素子は第一電子素子及び第二電子素子を有し、
前記第一絶縁性基板の一方側に第一電子素子が設けられ、
前記第一電子素子の一方側に第二電子素子が設けられ、
前記第二電子素子の一方側に第二絶縁性基板が設けられ、
前記第一電子素子及び前記第二電子素子のうちの少なくともいずれか一方はスイッチング素子を有し、前記第一電子素子がスイッチング素子を有する場合には、前記離隔部は前記第一絶縁性基板から離隔した第一離隔部を有し、前記第二電子素子がスイッチング素子を有する場合には、前記離隔部は前記第二絶縁性基板から離隔した第二離隔部を有する請求項1に記載の電子モジュール。 - 前記電子素子はスイッチング素子を含むことを特徴とする請求項1又は2のいずれかに記載の電子モジュール。
- 前記放熱層は面方向で区分された複数の放熱層パターンを有し、
前記放熱層パターンは、前記放熱層パターン側から見たときに、前記電子素子が配置されている箇所の全体を含むようにして設けられていることを特徴とする請求項1乃至3のいずれか1項に記載の電子モジュール。 - 前記放熱層パターンのうちの少なくとも一部は、前記放熱層パターン側から見たときに複数の電子素子の全体を覆うことを特徴とする請求項4に記載の電子モジュール。
- 前記絶縁性基板は第一絶縁性基板及び第二絶縁性基板を有し、
前記電子素子は第一電子素子及び第二電子素子を有し、
前記放熱層は第一放熱層及び第二放熱層を有し、
前記第一絶縁性基板の一方側に第一電子素子が設けられ、
前記第一絶縁性基板の他方側に設けられた第一放熱層が設けられ、
前記第一電子素子の一方側に第二電子素子が設けられ、
前記第二電子素子の一方側に第二絶縁性基板が設けられ、
前記第二絶縁性基板の一方側に第二放熱層が設けられ、
前記第一電子素子及び前記第二電子素子のうちの少なくともいずれか一方はスイッチング素子を有し、前記第一電子素子がスイッチング素子を有する場合には、前記第一放熱層は面方向で区分された複数の第一放熱層パターンを有し、前記第二電子素子がスイッチング素子を有する場合には、前記第二放熱層は面方向で区分された複数の第二放熱層パターンを有することを特徴とする請求項1乃至5のいずれか1項に記載の電子モジュール。 - 前記離隔部はグランド端子又は電源端子に接続されることを特徴とする請求項1乃6のいずれか1項に記載の電子モジュール。
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PCT/JP2017/005155 WO2018146815A1 (ja) | 2017-02-13 | 2017-02-13 | 電子モジュール |
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JPWO2018146815A1 JPWO2018146815A1 (ja) | 2019-02-14 |
JP6494855B2 true JP6494855B2 (ja) | 2019-04-03 |
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US (1) | US20200258851A1 (ja) |
JP (1) | JP6494855B2 (ja) |
CN (1) | CN108738367B (ja) |
NL (1) | NL2020395B1 (ja) |
WO (1) | WO2018146815A1 (ja) |
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US5294826A (en) * | 1993-04-16 | 1994-03-15 | Northern Telecom Limited | Integrated circuit package and assembly thereof for thermal and EMI management |
JP4086963B2 (ja) * | 1997-06-25 | 2008-05-14 | 三菱電機株式会社 | パワーモジュール |
JP3575478B2 (ja) * | 2002-07-03 | 2004-10-13 | ソニー株式会社 | モジュール基板装置の製造方法、高周波モジュール及びその製造方法 |
JP2006211548A (ja) * | 2005-01-31 | 2006-08-10 | Alps Electric Co Ltd | 非可逆回路素子、及びこの非可逆回路素子を使用した送受信モジュール |
JP2008042124A (ja) * | 2006-08-10 | 2008-02-21 | Fuji Electric Holdings Co Ltd | 半導体パワーモジュール |
KR20140116911A (ko) * | 2012-01-13 | 2014-10-06 | 스미또모 베이크라이트 가부시키가이샤 | 회로 기판 및 전자 디바이스 |
JP2013157550A (ja) * | 2012-01-31 | 2013-08-15 | Rohm Co Ltd | パワーモジュール半導体装置およびその製造方法 |
WO2015005181A1 (ja) * | 2013-07-08 | 2015-01-15 | 株式会社 村田製作所 | 電力変換部品 |
JPWO2015107871A1 (ja) * | 2014-01-15 | 2017-03-23 | パナソニックIpマネジメント株式会社 | 半導体装置 |
WO2016067383A1 (ja) * | 2014-10-29 | 2016-05-06 | 新電元工業株式会社 | 放熱構造 |
JP6435794B2 (ja) * | 2014-11-12 | 2018-12-12 | 富士電機株式会社 | 半導体装置 |
WO2016174698A1 (ja) * | 2015-04-28 | 2016-11-03 | 新電元工業株式会社 | 半導体モジュール |
-
2017
- 2017-02-13 JP JP2018500751A patent/JP6494855B2/ja active Active
- 2017-02-13 WO PCT/JP2017/005155 patent/WO2018146815A1/ja active Application Filing
- 2017-02-13 CN CN201780003611.3A patent/CN108738367B/zh active Active
- 2017-02-13 US US15/763,062 patent/US20200258851A1/en not_active Abandoned
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US20200258851A1 (en) | 2020-08-13 |
CN108738367B (zh) | 2022-03-15 |
CN108738367A (zh) | 2018-11-02 |
JPWO2018146815A1 (ja) | 2019-02-14 |
NL2020395B1 (en) | 2018-10-29 |
NL2020395A (en) | 2018-08-22 |
WO2018146815A1 (ja) | 2018-08-16 |
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