JP2011018714A - 電子部品ユニット及び補強用接着剤 - Google Patents

電子部品ユニット及び補強用接着剤 Download PDF

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Publication number
JP2011018714A
JP2011018714A JP2009161330A JP2009161330A JP2011018714A JP 2011018714 A JP2011018714 A JP 2011018714A JP 2009161330 A JP2009161330 A JP 2009161330A JP 2009161330 A JP2009161330 A JP 2009161330A JP 2011018714 A JP2011018714 A JP 2011018714A
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Prior art keywords
electronic component
circuit board
resin
metal powder
component unit
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JP2009161330A
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JP5115524B2 (ja
Inventor
Koji Motomura
耕治 本村
Seiichi Yoshinaga
誠一 吉永
Tadahiko Sakai
忠彦 境
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Panasonic Corp
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Panasonic Corp
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Priority to JP2009161330A priority Critical patent/JP5115524B2/ja
Priority to CN201080030708.1A priority patent/CN102474988B/zh
Priority to PCT/JP2010/003538 priority patent/WO2011004542A1/ja
Priority to US13/382,368 priority patent/US8686299B2/en
Publication of JP2011018714A publication Critical patent/JP2011018714A/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
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    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

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Abstract

【課題】電子部品と回路基板の間の接合強度の向上を図りつつ電子部品又は回路基板に熱的ダメージを与えることなくリペア作業を行うことができるようにした電子部品ユニット及び補強用接着剤を提供することを目的とする。
【解決手段】下面に複数の接続端子１２を備えた電子部品２と、上面に接続端子１２に対応する複数の電極２２を備えた回路基板３とを有し、接続端子１２と電極２２とが半田バンプ２３によって接合されるとともに、電子部品２と回路基板３が部分的に熱硬化性樹脂の熱硬化物から成る樹脂接合部２４によって接合された電子部品ユニット１において、樹脂接合部２４の内部に金属粉２５が分散状態で含まれている。金属粉２５は、電子部品２を回路基板３から除去する作業（リペア作業）を行う際に樹脂接合部２４を加熱する温度よりも低い融点を有する。
【選択図】図１

Description

本発明は、電子部品の接続端子と回路基板の電極が半田バンプによって接合されるとともに、電子部品と回路基板が熱硬化性樹脂の熱硬化物によって部分的に接合された電子部品ユニット及び補強用接着剤に関するものである。
従来、電子部品の接続端子と回路基板の電極が半田バンプによって接合されて成る電子部品ユニットの中には、電子部品の接続端子と回路基板の電極を接合させる前、或いは接続端子と電極を接合させた後に、電子部品と回路基板の間の一部に熱硬化性樹脂を供給してこれを熱硬化させ、電子部品と回路基板の間に柱状の樹脂接合部を形成して電子部品と回路基板が強固に接合されるようにしたものが知られている（特許文献１）。また、熱硬化性樹脂に予めシリカ粉末等の無機充填剤を加えておくことにより、熱硬化後の熱硬化樹脂の弾性率が高く（硬く）なるようにし、電子部品と回路基板の間の接合力を高めて接合信頼性を向上させるようにしたものも知られている。
特開２００４−３１１８９８号公報
しかしながら、熱硬化性樹脂にシリカ粉末等を加えてその熱硬化物の硬さを増大させると、不良な電子部品を回路基板から除去する作業（リペア作業）を行うときに樹脂接合部を軟化させるために必要な温度が高くなり、電子部品又は回路基板に熱的ダメージを与えるおそれがあるという問題点があった。
そこで本発明は、電子部品と回路基板の間の接合強度の向上を図りつつ電子部品又は回路基板に熱的ダメージを与えることなくリペア作業を行うことができるようにした電子部品ユニット及び補強用接着剤を提供することを目的とする。
請求項１に記載の電子部品ユニットは、下面に複数の接続端子を備えた電子部品と、上面に前記接続端子に対応する複数の電極を備えた回路基板とを有し、前記接続端子と前記電極とが半田バンプによって接合されるとともに、前記電子部品と前記回路基板が部分的に熱硬化性樹脂の熱硬化物から成る樹脂接合部によって接合された電子部品ユニットであって、前記樹脂接合部の内部に金属粉が分散状態で含まれている。
請求項２に記載の電子部品ユニットは、請求項１に記載の電子部品ユニットであって、前記金属粉は、前記電子部品を前記回路基板から除去する作業を行う際に前記樹脂接合部を加熱する温度よりも低い融点を有する。
請求項３に記載の電子部品ユニットは、請求項２に記載の電子部品ユニットであって、前記金属粉は、Ｓｎ、Ｂｉ、Ｉｎより成る単一金属、又は、Ｓｎ、Ｂｉ、Ｉｎ、Ｚｎ、Ｓｂ、Ｃｕ、Ｐｂ、Ｃｄ、Ａｇ、Ａｕを少なくとも２種類以上含む合金であって融点が３００℃以下であるものの何れかである。
請求項４に記載の補強用接着剤は、下面に複数の接続端子を備えた電子部品と、上面に
前記接続端子に対応する複数の電極を備えた回路基板とを有し、前記接続端子と前記電極とが半田バンプによって接合されるとともに、前記電子部品と前記回路基板が部分的に熱硬化性樹脂の熱硬化物から成る樹脂接合部によって接合された電子部品ユニットの前記樹脂接合部を形成するために用いられる補強用接着剤であって、熱硬化性樹脂の内部に金属粉が分散状態で含まれている。
請求項５に記載の補強用接着剤は、請求項４に記載の補強用接着剤であって、前記金属粉は、前記電子部品を前記回路基板から除去する作業を行う際に前記樹脂接合部を加熱する温度よりも低い融点を有する。
請求項６に記載の補強用接着剤は、請求項５に記載の補強用接着剤であって、前記金属粉は、Ｓｎ、Ｂｉ、Ｉｎより成る単一金属、又は、Ｓｎ、Ｂｉ、Ｉｎ、Ｚｎ、Ｓｂ、Ｃｕ、Ｐｂ、Ｃｄ、Ａｇ、Ａｕを少なくとも２種類以上含む合金であって融点が３００℃以下であるものの何れかである。
請求項７に記載の補強用接着剤は、請求項４乃至６の何れかに記載の補強用接着剤であって、前記金属粉は、前記電子部品を前記回路基板から除去する作業を行う際に前記樹脂接合部を加熱する温度よりも高い融点を有する膜で覆われている。
本発明では、電子部品と回路基板を部分的に接合する熱硬化性樹脂の熱硬化物から成る樹脂接合部（又はこの樹脂接合部を形成するために用いられる補強用接着剤の熱硬化性樹脂）が内部に金属粉を分散状態で含んでいるのであるが、分散した状態の金属粉が含まれている熱硬化性樹脂の熱硬化物は、常温では弾性率が高くなって硬さが増大する一方、半田の融点よりも高い温度にまで加熱されたときには弾性率が大きく低下して容易に軟化するという特性を有する。したがって、このような樹脂接合部（又は補強用接着剤で形成された樹脂接合部）を備えた電子部品ユニットは接合信頼性が高く、リペア作業を行うときに樹脂接合部を軟化させるために必要な温度を低く抑えることができるので、電子部品と回路基板の間の接合強度の向上を図りつつ、電子部品又は回路基板に熱的ダメージを与えることなくリペア作業を行うことができる。
本発明の実施の形態１における電子部品ユニットの側面図 本発明の実施の形態１における電子部品ユニットの樹脂接合部及び従来の電子部品ユニットの樹脂接合部それぞれの温度と弾性率との関係を示すグラフ （ａ）（ｂ）（ｃ）（ｄ）本発明の実施の形態１における電子部品実装ユニットの製造工程の説明図 本発明の実施の形態１における電子部品ユニットの平面図 本発明の実施の形態１における電子部品ユニットの平面図 本発明の実施の形態１における電子部品ユニットの平面図 本発明の実施の形態１における電子部品ユニットの平面図 （ａ）（ｂ）（ｃ）（ｄ）本発明の実施の形態２における電子部品実装ユニットの製造工程の説明図
（実施の形態１）
図１において、実施の形態１における電子部品ユニット１は電子部品２と回路基板３を備え、電子部品２の下面の端子形成面１１に形成された複数の接続端子１２が、回路基板３の上面の電極形成面２１に形成された複数の電極２２と半田バンプ２３によって接合されている。この半田バンプ２３は接続端子１２と電極２２が接合される前は接続端子１２
に形成されていたものであり、接続端子１２と電極２２が接合される際に加熱溶融されて接続端子１２と電極２２を接続している。
図１において、電子部品２の下面と回路基板３の上面の間の複数箇所には熱硬化性樹脂の熱硬化物から成る柱状の樹脂接合部２４が設けられており、上下に対向する電子部品２の端子形成面１１と回路基板３の電極形成面２１は、これら複数の樹脂接合部２４によって部分的に接合された状態となっている。
図１中の拡大図において、各樹脂接合部２４の内部には金属粉２５が分散状態で含まれている。この金属粉２５は、電子部品２を回路基板３から除去する作業（リペア作業）を行う際に樹脂接合部２４を加熱する温度（以下、説明の便宜上、「リペア作業温度」と称する）よりも低い融点を有している。この金属粉２５としては、例えば、Ｓｎ（錫）、Ｂｉ（ビスマス）、Ｉｎ（インジウム）より成る単一金属、又は、Ｓｎ、Ｂｉ、Ｉｎ、Ｚｎ（亜鉛）、Ｓｂ（アンチモン）、Ｃｕ（銅）、Ｐｂ（鉛）、Ｃｄ（カドミウム）、Ａｇ（銀）、Ａｕ（金）を少なくとも２種類以上含む合金であって融点が３００℃以下であるものの何れかが選択される。
金属粉２５が分散状態で含まれている樹脂接合部２４（熱硬化性樹脂の熱硬化物）は、常温では弾性率を高くなって硬さが増大するが、その一方で、半田の融点よりも高い温度にまで加熱されたときには弾性率が大きく低下して容易に軟化する。これは、金属粉２５が分散状態で含まれている熱硬化性樹脂の熱硬化物（樹脂接合部２４）が半田の融点よりも高い温度にまで加熱されると、金属粉２５が樹脂接合部２４の中で液状となり、しかもその液状となった金属粉２５が樹脂接合部２４内に点在する状態になることによるものと考えられる。図２中に実線で示すグラフはこの電子部品ユニット１における樹脂接合部２４の温度と弾性率（硬さ）の関係を示しており、図２中に破線で示すグラフは、分散状態の金属粉２５が含まれない従来の電子部品ユニットの樹脂接合部の温度と弾性率の関係を示している。
次に、図３を用いて電子部品ユニット１の製造手順について説明する。電子部品ユニット１の製造では先ず、回路基板３の電極形成面２１の電極２２を避けた複数の樹脂供給位置Ｒに、樹脂供給手段であるディスペンサ３１によって、内部に金属粉２５が分散状態で含まれている熱硬化性樹脂から成る補強用接着剤２４ａを供給する（図３（ａ）樹脂供給工程）。
回路基板３上における樹脂供給位置Ｒは、例えば、図４及び図５に示すように、回路基板３の四隅としてもよいし、図６に示すように、回路基板３の四辺に沿った位置としてもよい。或いは図７に示すように、回路基板３の四隅のほか、回路基板３の中央部の電極２２が存在しない位置としてもよい。
回路基板３の電極形成面２１上の各樹脂供給位置Ｒに補強用接着剤２４ａを供給したら、電子部品２の電極形成面２１、すなわち接続端子１２に形成された半田バンプ２３が下を向く姿勢で吸着ノズル３２によって電子部品２を吸着した後、電子部品２の各接続端子１２と回路基板３の対応する電極２２とが上下に合致するように位置合わせを行う（図３（ｂ）。位置合わせ工程）。そして、吸着ノズル３２を下降させ、回路基板３の上面に供給された補強用接着剤２４ａに電子部品２の下面（端子形成面１１）を接触させながら、電子部品２の各接続端子１２を、回路基板３の電極２２に上方から接触させる（端子・電極接触工程。図３（ｃ））。
接続端子１２と電極２２とを接触させたら、吸着ノズル３２による電子部品２の吸着を解除し、吸着ノズル３２を上昇させて吸着ノズル３２から電子部品２を分離した後、図示
しないリフロー炉において加熱し、半田バンプ２３を溶融させて接続端子１２と電極２２を半田接合するとともに、補強用接着剤２４ａを熱硬化させる（加熱工程。（図３（ｄ））。これにより電子部品２と回路基板３の間の補強用接着剤２４ａが熱硬化し、電子部品２と回路基板３の間に複数の補強用接着剤２４ａの熱硬化物、すなわち樹脂接合部２４が形成されて、電子部品２と回路基板３が接合され、電子部品２と回路基板３の結合体１ａが生成される。結合体１ａが生成したら、その結合体１ａを冷却して結合体１ａの各樹脂接合部２４を固化させる（冷却工程）。これにより電子部品ユニット１が完成する。
このようにして製造された電子部品ユニット１のリペア作業を行うときは、樹脂接合部２４を（電子部品ユニット１全体を）リペア作業に適した所定の温度（前述の「リペア作業温度」）にまで加熱する。リペア作業は半田バンプ２３を溶融させて行う必要があることから、リペア作業温度は少なくとも半田の融点よりも高い温度であるが（図２）、電子部品２を高温まで加熱することによって生じる不具合の影響を考慮して３００℃以下とする。なお、樹脂接合部２４の内部（補強用接着剤２４ａの熱硬化性樹脂の内部）に分散状態で含まれている金属粉２５の表面は、図１の拡大図に示すように、上記リペア作業温度よりも高い融点を有する膜（酸化膜）Ｍで覆われていても（すなわち酸化膜Ｍが除去されていななくても）構わない。これは、この金属粉２５を含む熱硬化性樹脂（補強用接着剤２４ａ）が、半田粒子を熱硬化性樹脂に混ぜて接続端子と電極の間の接合等に用いる半田ペーストとは明らかに用途が異なるものであることによる。
樹脂接合部２４をリペア作業温度にまで加熱すると、樹脂接合部２４に分散状態で含まれている金属粉２５は溶融し、樹脂接合部２４の弾性率を低くするように作用するので、リペア作業温度では、樹脂接合部２４は金属粉２５が含まれていない場合よりも軟化の程度が大きくなり、リペア作業を行い易くなる（図２参照）。また、樹脂接合部２４は、回路基板３の上面（電極形成面２１）との界面において容易に分離するので、リペア作業に好都合であるが、これは、樹脂接合部２４内に含まれている金属粉２５のうちの一部が、その重み（自重）によって樹脂接合部２４の下部に偏在するようになる（金属粉２５が下方に偏在した状態で熱硬化性樹脂が熱硬化している）ことによるものと考えられる（図１中の拡大図参照）。
（実施の形態２）
次に、図８を用いて実施の形態２について説明する。実施の形態２では、製造される電子部品ユニット１の構成は同じであるが、その製造手順が異なる。実施の形態２における電子部品ユニット１の製造では先ず、電子部品２の電極形成面２１が（すなわち、接続端子１２に形成された半田バンプ２３が）下を向くように、吸着ノズル３２によって電子部品２を吸着し、電子部品２の各接続端子１２と回路基板３の対応する電極２２とが上下に合致するように位置合わせを行った後（位置合わせ工程）、吸着ノズル３２を下降させ、電子部品２の各接続端子１２を、回路基板３の電極２２に上方から接触させる（図８（ａ）。端子・電極接触工程）。そして、吸着ノズル３２による電子部品２の吸着を解除し、吸着ノズル３２を上昇させて吸着ノズル３２から電子部品２を分離した後、図示しないリフロー炉において加熱し、半田バンプ２３を溶融させて電子部品２の接続端子１２と回路基板３の電極２２を半田接合させる（図８（ｂ）。端子・電極接合工程）。
電子部品２の接続端子１２と回路基板３の電極２２を半田接合させたら、その半田で接合された電子部品２と回路基板３をリフロー炉から取り出し、電子部品２の下面（端子形成面１１）と回路基板３の上面（電極形成面２１）の間の、接続端子１２と電極２２の接合箇所を避けた複数の樹脂供給位置Ｒに、ディスペンサ３１によって補強用接着剤２４ａを供給する（図８（ｃ）樹脂供給工程）。回路基板３上の樹脂供給位置Ｒは、実施の形態１の場合と同様である。
電子部品２の下面と回路基板３の上面の間に補強用接着剤２４ａを供給したら、間に補強用接着剤２４ａが供給された電子部品２及び回路基板３を加熱装置若しくはリフロー炉（ここで用いるリフロー炉は上記端子・電極接合工程において用いたリフロー炉と同一でなくてよい）において加熱し、補強用接着剤２４ａを熱硬化させる（図８（ｄ）。樹脂熱硬化工程）。これにより電子部品２と回路基板３の間の補強用接着剤２４ａが熱硬化し、電子部品２と回路基板３の間に複数の補強用接着剤２４ａの熱硬化物、すなわち樹脂接合部２４が形成されて、電子部品２と回路基板３が接合され、電子部品２と回路基板３の結合体１ａが生成される。
結合体１ａが生成したら、電子部品２と回路基板３の結合体１ａを冷却して結合体１ａの各樹脂接合部２４を固化させる（冷却工程）。これにより電子部品ユニット１が完成する。なお、このようにして完成した電子部品ユニット１についても、リペア作業の手順は実施の形態１の場合と同様である。
以上説明したように、本実施の形態における電子部品ユニット１は、下面に複数の接続端子１２を備えた電子部品２と、上面に接続端子１２に対応する複数の電極２２を備えた回路基板３とを有し、接続端子１２と電極２２とが半田バンプ２３によって接合されるとともに、電子部品２と回路基板３が部分的に補強用接着剤２４ａの熱硬化物から成る樹脂接合部２４によって接合されて成り、樹脂接合部２４の内部に金属粉２５が分散状態で含まれている。
また、実施の形態における補強用接着剤２４ａは、上記電子部品ユニット１の樹脂接合部２４を形成するために用いられるものであり、熱硬化性樹脂の内部に金属粉２５が分散状態で含まれたものとなっている。そして、電子部品ユニット１及び補強用接着剤２４ａにおいて、金属粉２５は、電子部品２を回路基板３から除去する作業（リペア作業）を行う際に樹脂接合部２４を加熱する温度（リペア作業温度）よりも低い融点を有するものとなっている。
本実施の形態では、電子部品２と回路基板３を部分的に接合する熱硬化性樹脂の熱硬化物から成る樹脂接合部２４（又はこの樹脂接合部２４を形成するために用いられる補強用接着剤２４ａの熱硬化性樹脂）が内部に金属粉２５を分散状態で含んでいるのであるが、分散した状態の金属粉２５が含まれている熱硬化性樹脂の熱硬化物（樹脂接合部２４）は、常温では弾性率が高くなって硬さが増大する一方、半田の融点よりも高い温度にまで加熱されたときには弾性率が大きく低下して容易に軟化するという特性を有する。
したがって、このような樹脂接合部２４（又は補強用接着剤２４ａで形成された樹脂接着部２４）を備えた電子部品ユニット１は接合信頼性が高く、リペア作業を行うときに樹脂接合部２４を軟化させるために必要な温度（リペア作業温度）を低く抑えることができるので、電子部品２と回路基板３の間の接合強度の向上を図りつつ、電子部品２又は回路基板３に熱的ダメージを与えることなくリペア作業を行うことができる。
電子部品と回路基板の間の接合強度の向上を図りつつ電子部品又は回路基板に熱的ダメージを与えることなくリペア作業を行うことができるようにした電子部品ユニット及び補強用接着剤を提供する。
１ 電子部品ユニット
２ 電子部品
３ 回路基板
１２ 接続端子
２２ 電極
２３ 半田バンプ
２４ 樹脂接合部
２４ａ 補強用接着剤
２５ 金属粉
Ｍ 膜

Claims (7)

  1. 下面に複数の接続端子を備えた電子部品と、上面に前記接続端子に対応する複数の電極を備えた回路基板とを有し、前記接続端子と前記電極とが半田バンプによって接合されるとともに、前記電子部品と前記回路基板が部分的に熱硬化性樹脂の熱硬化物から成る樹脂接合部によって接合された電子部品ユニットであって、
    前記樹脂接合部の内部に金属粉が分散状態で含まれていることを特徴とする電子部品ユニット。
  2. 前記金属粉は、前記電子部品を前記回路基板から除去する作業を行う際に前記樹脂接合部を加熱する温度よりも低い融点を有することを特徴とする請求項１に記載の電子部品ユニット。
  3. 前記金属粉は、Ｓｎ、Ｂｉ、Ｉｎより成る単一金属、又は、Ｓｎ、Ｂｉ、Ｉｎ、Ｚｎ、Ｓｂ、Ｃｕ、Ｐｂ、Ｃｄ、Ａｇ、Ａｕを少なくとも２種類以上含む合金であって融点が３００℃以下であるものの何れかであることを特徴とする請求項２に記載の電子部品ユニット。
  4. 下面に複数の接続端子を備えた電子部品と、上面に前記接続端子に対応する複数の電極を備えた回路基板とを有し、前記接続端子と前記電極とが半田バンプによって接合されるとともに、前記電子部品と前記回路基板が部分的に熱硬化性樹脂の熱硬化物から成る樹脂接合部によって接合された電子部品ユニットの前記樹脂接合部を形成するために用いられる補強用接着剤であって、
    熱硬化性樹脂の内部に金属粉が分散状態で含まれていることを特徴とする補強用接着剤。
  5. 前記金属粉は、前記電子部品を前記回路基板から除去する作業を行う際に前記樹脂接合部を加熱する温度よりも低い融点を有することを特徴とする請求項４に記載の補強用接着剤。
  6. 前記金属粉は、Ｓｎ、Ｂｉ、Ｉｎより成る単一金属、又は、Ｓｎ、Ｂｉ、Ｉｎ、Ｚｎ、Ｓｂ、Ｃｕ、Ｐｂ、Ｃｄ、Ａｇ、Ａｕを少なくとも２種類以上含む合金であって融点が３００℃以下であるものの何れかであることを特徴とする請求項５に記載の補強用接着剤。
  7. 前記金属粉は、前記電子部品を前記回路基板から除去する作業を行う際に前記樹脂接合部を加熱する温度よりも高い融点を有する膜で覆われていることを特徴とする請求項４乃至６の何れかに記載の補強用接着剤。
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