JP2010537437A5 - - Google Patents

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Publication number
JP2010537437A5
JP2010537437A5 JP2010522178A JP2010522178A JP2010537437A5 JP 2010537437 A5 JP2010537437 A5 JP 2010537437A5 JP 2010522178 A JP2010522178 A JP 2010522178A JP 2010522178 A JP2010522178 A JP 2010522178A JP 2010537437 A5 JP2010537437 A5 JP 2010537437A5
Authority
JP
Japan
Prior art keywords
casing
led
connection
led casing
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010522178A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010537437A (ja
Filing date
Publication date
Priority claimed from DE102007041136A external-priority patent/DE102007041136A1/de
Application filed filed Critical
Publication of JP2010537437A publication Critical patent/JP2010537437A/ja
Publication of JP2010537437A5 publication Critical patent/JP2010537437A5/ja
Pending legal-status Critical Current

Links

JP2010522178A 2007-08-30 2008-08-06 Ｌｅｄケーシング Pending JP2010537437A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007041136A DE102007041136A1 (de) 2007-08-30 2007-08-30 LED-Gehäuse
PCT/DE2008/001293 WO2009026876A1 (de) 2007-08-30 2008-08-06 Led-gehäuse

Publications (2)

Publication Number Publication Date
JP2010537437A JP2010537437A (ja) 2010-12-02
JP2010537437A5 true JP2010537437A5 (enExample) 2011-06-30

Family

ID=40085583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010522178A Pending JP2010537437A (ja) 2007-08-30 2008-08-06 Ｌｅｄケーシング

Country Status (8)

Country Link
US (1) US8487323B2 (enExample)
EP (1) EP2183794B1 (enExample)
JP (1) JP2010537437A (enExample)
KR (1) KR20100047339A (enExample)
CN (2) CN102664219B (enExample)
DE (1) DE102007041136A1 (enExample)
TW (1) TW200917533A (enExample)
WO (1) WO2009026876A1 (enExample)

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US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
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