CN107112401B - 具有直接安装在散热器上的led的效率提高的照明装置 - Google Patents

具有直接安装在散热器上的led的效率提高的照明装置 Download PDF

Info

Publication number
CN107112401B
CN107112401B CN201580069721.0A CN201580069721A CN107112401B CN 107112401 B CN107112401 B CN 107112401B CN 201580069721 A CN201580069721 A CN 201580069721A CN 107112401 B CN107112401 B CN 107112401B
Authority
CN
China
Prior art keywords
conductive pad
led
conductive
heat
led group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580069721.0A
Other languages
English (en)
Other versions
CN107112401A (zh
Inventor
安东尼·马格利卡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AMERICAN LIGHT TOOL CORP
Original Assignee
AMERICAN LIGHT TOOL CORP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMERICAN LIGHT TOOL CORP filed Critical AMERICAN LIGHT TOOL CORP
Publication of CN107112401A publication Critical patent/CN107112401A/zh
Application granted granted Critical
Publication of CN107112401B publication Critical patent/CN107112401B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/005—Electric lighting devices with self-contained electric batteries or cells the device being a pocket lamp
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02—Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022—Pocket lamps
    • F21L4/027—Pocket lamps the light sources being a LED
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21L—LIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00—Electric lighting devices with self-contained electric batteries or cells
    • F21L4/08—Electric lighting devices with self-contained electric batteries or cells characterised by means for in situ recharging of the batteries or cells
    • F21L4/085—Pocket lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/04—Resilient mountings, e.g. shock absorbers 
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0414—Arrangement of electric circuit elements in or on lighting devices the elements being switches specially adapted to be used with portable lighting devices
    • F21V23/0428—Arrangement of electric circuit elements in or on lighting devices the elements being switches specially adapted to be used with portable lighting devices the switch being part of, or disposed on the lamp head portion thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/623—Portable devices, e.g. mobile telephones, cameras or pacemakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/64—Heating or cooling; Temperature control characterised by the shape of the cells
    • H01M10/643—Cylindrical cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/213—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0481—Compression means other than compression means for stacks of electrodes and separators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/30—Batteries in portable systems, e.g. mobile phone, laptop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/509—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing characterised by the type of connection, e.g. mixed connections
    • H01M50/51—Connection only in series
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/514—Methods for interconnecting adjacent batteries or cells
    • H01M50/516—Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

例如铝制手电筒筒体的照明装置的LED效率通过在不使用PCB的情况下将LED直接安装在散热器上而增加，该散热器与外壳体热接触且电接触从而散热，使得LED的运行更低温并且因此更有效。

Description

具有直接安装在散热器上的LED的效率提高的照明装置
背景技术
LED的效率和光输出随着运行过程中装置的发热而下降。通常，LED安装在层压印刷电路板上。有些LED安装在特殊的金属基或陶瓷的印刷电路板上，从而试图将热量从LED传导出去。
发明内容
本发明大体涉及一种照明装置，其中至少一个LED安装在散热器的顶表面上，散热器被保持在导热和导电的外壳内，该LED具有第一导电构件和第二导电构件，第一导电构件在不使用印刷电路板的情况下被直接热连接且电连接到散热器，第二导电构件通过保持在散热器内的电绝缘材料与散热器电隔离。
LED的第二导电构件可以钎焊到保持在电绝缘材料内的端子上，而LED的第一导电构件也可以钎焊到散热器上，并且所得到的散热器组件可以压配合到管体或筒体(例如，铝制手电筒筒体)内或插入管体或筒体内，然后通过机械装置(例如拧到管体或筒体上的螺母)可拆卸地保持。可替代地，散热器可以与管体或筒体一体形成。
因此，本发明的主要目的是提供一种通过将LED直接安装在散热器上而具有提高的效率的照明装置。
结合附图以及下面给出的本发明的详细描述，上述及另外的目的以及优点对于本领域的技术人员而言将是显而易见的。
附图说明
下文将通过简要参照附图以及之后对附图中标识的用数字表示的元件的描述来描述附图。
图1A至图1D示出了安装在金属管体或手电筒筒体中的散热器和绝缘芯，其中具有下述标出的元件：
1.管体或筒体
2.散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
图1B是图1D中分解示出的内容的剖视图，而图1A和图1C各自是往里观察图1B中以剖面示出的装置的顶视图和底视图。
图2A至图2D示出了散热器和绝缘芯安装在金属管体或手电筒筒体中的图1A至图1D的变型，其中具有下述标出的元件：
1.管体或筒体
2.散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
图2B是图2D中分解示出的内容的剖视图，而图2A和图2C各自是往里观察图2B中以剖面示出的装置的顶视图和底视图。
图3A至图3D示出了与图2A至图2D中所示的散热器类似的单体式散热器，其中具有下述标出的元件：
1.一体式的管体或筒体与散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
图3B是图3D中分解示出的内容的剖视图，而图3A和图3C各自是往里观察图3B中以剖面示出的装置的顶视图和底视图。
图4A至图4D示出了图1A至图1D中散热器和绝缘芯的变型。在这个示例中，在LED与组件的另一端部之间存在印刷电路板，其中具有下述标出的元件：
1.管体或筒体
2.散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
8.印刷电路板
9.绝缘体
10.触头
图4B是图4D中分解示出的内容的剖视图，而图4A和图4C各自是往里观察图4B中以剖面示出的装置的顶视图和底视图。
图5A至图5D示出了图4A至图4D所示的组件的变型，其中具有下述标出的元件：
1.管体或筒体
2.散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
8.印刷电路板
9.绝缘体
10.触头
图5B是图5D中分解示出的内容的剖视图，而图5A和图5C各自是往里观察图5B中以示出所示的装置的顶视图和底视图。
图6A至图6D示出了与图3A至图3D类似但是包含印刷电路板的散热器，其中具有下述标出的元件：
1.一体式的管体或筒体与散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
8.印刷电路板
9.绝缘体
10.触头
图6B是图6D中分解示出的内容的剖视图，而图6A和图6C各自是往里观察图6B中以剖面示出的装置的顶视图和底视图。
图7A至图7D示出了安装在常见的散热器上的LED的圆形阵列。在此示出了4个LED，但是可以存在任何数量的LED。图7A至图7D具有下述标出的元件：
1.管体或筒体
2.散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
图7B是图7D中分解示出的内容的剖视图，而图7A和图7C各自是往里观察图7B中以剖面示出的装置的顶视图和底视图。
图8A至图8D示出了安装在常见的散热器上的LED的圆形阵列，其中印刷电路板在绝缘构件中。在此示出4个LED，但可以存在任何数量的LED。图8A至图8D具有下述标出的元件：
1.管体或筒体
2.散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
8.印刷电路板
9.绝缘体
10.触头
图8B是图8D中分解示出的内容的剖视图，而图8A和图8C各自是往里观察图8B中以剖面所示的装置的顶视图和底视图。
图9A至图9C示出了在常见散热器上的LED的线性阵列。在此示出4个LED，但是可以存在任何数量的LED。图9A至图9C具有下述标出的元件：
2.散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
图9B是单个LED的剖视图，图9A和图9C各自是4个LED的线性阵列的顶视图和底视图。
图10A至图10C示出了与图9A和图9C类似但是包含印刷电路板的LED的线性阵列。在此示出4个LED，但是可以存在任何数量的LED。图10A至图10C具有下述标出的元件：
2.散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
8.印刷电路板
9.绝缘体
10.触头
图10B是单个LED的剖视图，图10A和图10C各自是4个LED的线性阵列的顶视图和底视图。
图11是来自图1B的放大的剖视图，其示出了没有放置LED的散热器5的顶部，其中具有下述标出的元件：
6.LED与散热器之间的热接合部和第一电连接部
7.第二电连接部
图12A至图12E示出了典型的现有技术的LED组件，示出了钎焊到PC板上的LED以及将热量传导到环境空气中所需的多个热接合部，其中具有下述标出的元件：
101.管体或筒体
102.散热器
103.绝缘体
104.用于将电力施加给印刷电路板的触头
105.LED
106.壳体
107.绝缘体
108.用于将印刷电路板111连接到PCB 109的触头
109.多层印刷电路板
110.环形触头
111.印刷电路板
图12B是图12E中分解示出的内容的剖视图，而图12A和图12C各自是往里观察图12B中以剖面示出的装置的顶视图和底视图，并且图12D是图12B的放大的局部视图。
图13A至图13D示出了广泛使用的、现有技术的安装有LED的星形、金属和陶瓷底板的PC板以及将热量传导到环境空气中所需的多个热接合部，其中具有下述标出的元件：
101.管体或筒体
102.散热器
105.LED
106.第一电力连接部
107.第二电力连接部
108.星形PC板
图13B是图13D中分解示出的内容的剖视图，而图13A和图13C各自是往里观察图13B中以剖面示出的装置的顶视图和底视图。
图14是具有正极性散热器的、典型的安装有散热器的LED的框图。
图15是具有负极性散热器的、典型的安装有散热器的LED的框图。
图16是具有正极性散热器的、典型的安装有散热器的LED的框图，其包括具有LED驱动电子器件的PC板。
图17是具有负极性散热器的、典型的安装有散热器的LED的框图，其包括具有LED驱动电子器件的PC板。
图18是4种不同的散热方法或系统的性能的比较。图2曲线用于本发明，并且证实了流明输出随时间推移下降最小的优越性能。
1.标注为图1的曲线是图1A至图1D的系统的流明输出随时间推移的图形表示，其示出了当LED发热并且效率下降时性能的下降。
2.标注为图2的曲线是图2A至图2D的系统的流明输出随时间推移的图形表示，其示出了当LED发热并且效率下降时极小的性能下降。
3.标注为图13的曲线是图13A至图13D的系统的流明输出随时间推移的图形表示，其示出了当LED发热并且效率下降时性能的下降。
4.标注为图12的曲线是图12A至图12E的系统的流明输出随时间推移的图形表示，其示出了当LED发热并且效率下降时性能的下降。
图19A至图19B示出了用于制造根据本发明的散热器组件的工序，其中焊料S1和S2用于将LED5的垫钎焊到散热器2的顶表面上，以形成散热器组件200。图19C至图19D示出了将散热组件200插入管体或筒体1中的压配合步骤。
图20A和图20B示出了图19C至图19D的变型，其中散热器和绝缘芯安装在金属管体或手电筒筒体中，其中具有下述标出的元件：
1.管体或筒体
1A.管体或筒体1的肩部
1AT.肩部1A的顶表面
1B.螺母
2.散热器
3.绝缘体
4.用于将电力连接到LED的端子
5.LED
具体实施方式
本发明利用导热和导电的金属外构件，即散热器。散热器的内部或芯是电绝缘材料，其定位和电隔离第二导电构件，该第二导电构件从与LED相对的端部伸出以提供电连接点。该组件的顶表面提供LED的安装表面。通过钎焊或一些其他的导热和导电的方法或材料将LED的阳极侧或阴极侧并且在某些情况下将专用的导热垫结合到散热器的顶表面上。LED组组的电相对侧结合到隔离的第二构件上。来自合适的电路的电力被施加到散热器和隔离的端子，以打开LED。由LED产生的热量通过与散热器的对接而传导到环境空气中。与安装在印刷电路板上的那些的可能情况相比，LED在所述系统中的运行更低温且更有效。图1A至图11描绘了有关上述设计的变型。如所示，散热器可以根据应用具有不同形状。散热器还可以支撑多个不同构造的LED，圆形阵列和线性阵列只是多种可能性中的两种。具有合适的互连方法的电子器件也可以悬在绝缘芯中。在所有情况下也可以提供定位和电隔离两个导电构件的电绝缘材料，这两个导电构件从与LED相对的端部伸出以提供电连接点。在这些情况下，阴极和阳极LED垫被结合到对应的隔离垫上，并且LED导热垫被结合到本发明的散热器表面上。
图1A至图11描绘的改进的散热方法不使用PC板来安装LED，相反，LED直接安装在散热器的金属表面上。与安装LED的PC板设计相比，这种方法产生大大改善的热传递以及更低温运行的更高流明的LED。
本发明提供将热量从LED传导到手电筒或任何其他照明装置(例如，头灯、挂灯或聚光灯)以及使用大功率LED作为光源的所有类型的区域照明装置外部的环境空气中的直接有效的路径。其他散热方法产生被大量热接合部中断的导热路径，其中一些具有差的导热性或高的热阻。现有技术的散热方法的示例在图12A至图13D中示出。本发明的独特之处在于能够将端子和散热器直接钎焊到LED的导电和导热垫上。不需要导热膏或粘合剂。在其他设计中，等同的散热和电接触垫在PC板上，这产生更多不太有效的热接合部以及到环境空气的更长、截面更小的导热路径。在这些不太有效的设计中使用导热膏和粘合剂在一定程度上有助于热传递，但是没有达到将LED直接附接于散热器的程度。能够使用本发明大大改善的热传递的结果是LED运行起来更低温并且因此更有效。与传统系统相比，能够在不增加功率的情况下具有更高的流明。还可以将流明保持在与其他不太有效的系统相同的水平，但是消耗远远更少的功率。在电池供电的照明系统中这一点特别重要，因为在不降低流明的情况下延长了工作时间。通过向LED施加恒定的4安培电流之后60秒的流明输出证实了本发明的优越性能。本发明与其他系统相比的优点如下：
本发明(图2A至图2D)比图13A至图13D中的系统(典型的安装有星形金属底板的PC板的LED)多产生19％的流明；并且
本发明(图2A至图2D)比图12A至图12D中的系统(具有额外的铜迹线和导通孔以试图将热量从LED传导出去的多层传统PC板)多产生93％的流明。
值得注意的是，通过增加或最大化散热器与导热和导电外壳体之间的暴露表面积同时还将散热器设计为在散热器和外壳体之间具有有效地且高效地导热的足够物质，可以借助于本公开而增大或优化本发明的效率。因此，例如，图2A至图2D的散热器2将比图1A至图1D的散热器2具有更好的效果，而图3A至图3D示出了散热器与外壳体一体形成的实施方式，其应该比图2A-2D的散热器产生更好的效果。
还值得注意的是，在图1至图11中描绘的示例性实施方式中作为管体或筒体示出的外壳体不必在其整个外表面上导热和导电，尽管在其整个外表面上导热和导电的外壳体可以实现更好的效果。
还值得注意的是，通过更有效地冷却一个或多个通过本发明得到的LED得到的优点可以用于产生使用增大流明的手电筒模式，或具有增加的工作时间的手电筒模式，或这样的模式之间交替的一种或多种模式，或这样的两种模式的组合元件。
本发明本身适合于更有效、花费更少的、可以通过自动装置经济地制造的照明装置。在图19C至图19D和图20A至图20B所示的说明性实施方式中，通过将LED5的两个导电构件钎焊到散热器2的顶表面上产生散热器组件200。商业上可获得的LED通常具有三个垫(例如参见图11D，其中第二电连接部7具有一个矩形垫，而LED5与散热器2之间的热接合部和第一点连接部具有两个矩形垫)，这三个垫都可用于钎焊(图19A中的焊料S1用于一个垫，而图19A中的焊料S2用于两个垫)。在产生散热器组件200之后，其可以如图19C和图19D中所示压配合到管体或筒体1内或者其可以可拆卸地插入管体或筒体1内然后通过可拆卸的保持机构保持到位，该保持机构的示例是图20A和图20B所示的螺母1B。在图20A和图20B所示的实施方式中，在特别优选的实施方式中，管体或筒体1与散热器2由铝制成，散热器2涂覆有有助于促进焊接工序的金属镀膜(例如，镍)，并且表皮切口由铝制成，在此处散热器2与形成在管体或筒体1中的肩部1A的顶表面1AT接触(以促进更有效的热传递)。
尽管体本文已经参照某些优选的实施方式描述了本发明，但是这些实施方式仅仅是通过举例的方式给出，并不用于限制本发明的范围。对于本领域技术人员而言显而易见的是本发明的另外的实施方式具有所述详细说明的益处。
因此，对于本领域技术人员显而易见的是，在不背离本发明的主旨和范围的情况下仍然可以容易地对本文描述的实际构思作进一步的修改和变型。

Claims (3)

1.一种照明装置，包括：
导热的外壳体；
LED组，其被包含在外壳体内，所述LED组包括：
基板；
LED晶片，其被基板保持，所述LED晶片被构造为从LED组的正面向外发光；
第一导电垫；
第二导电垫；以及
导热垫，其被构造为将来自LED晶片的热量移除到LED组的外部，其中，第一导电垫和第二导电垫被构造为提供电力，以使LED晶片发光；
其中，第一导电垫和第二导电垫以及导热垫位于LED组的、与LED晶片相对的后表面上；以及
散热器组件，其容纳在外壳体中，所述散热器组件包括：
外导电构件，其是导热的并且机械地连接到外壳体；
电绝缘材料的芯，其被保持在形成在外导电构件中的腔内；以及
内导电构件，其通过芯定位并且与外导电构件电隔离；
其中，第一导电垫和导热垫在不使用印刷电路板的情况下被热结合且电结合到外导电构件的第一顶表面上，并且第二导电垫被电结合到内导电构件的第二顶表面上，其中，第一导电垫和导热垫被钎焊到第一顶表面上，并且第二导电垫被钎焊到第二顶表面上。
2.根据权利要求1所述的照明装置，其中，照明装置由手电筒构成，并且外壳体由手电筒筒体构成。
3.一种用于产生具有增大的流明或具有增加的工作时间的手电筒模式的方法，其包括：
将保持内导电构件的芯插入形成在外导电构件中的腔内，使得内导电构件的第二顶表面定位在外导电构件的第一顶表面中的开口内，并且内导电构件和外导电构件彼此电隔离；
将LED组的第一导电垫和导热垫在不使用印刷电路板的情况下钎焊到第一顶表面上并且将LED组的第二导电垫钎焊到第二顶表面上，以形成散热器组件，其中所述LED组由第一导电垫、第二导电垫和导热垫构成，其中第一导电垫和第二导电垫被构造为提供电力，以使得LED组内的晶片从LED组的正面向外发光，其中导热垫被构造为从LED组除去热量，并且其中第一导电垫和第二导电垫以及导热垫位于LED组的、与晶片相对的后表面上；以及
将散热器组件插入手电筒筒体，使得散热器组件通过与筒体的机械接触而被保持，并且在手电筒筒体与LED组的第一导电垫和导热垫之间产生导热路径，该导热路径仅被手电筒筒体与外导电构件之间的第一热接合部以及外导电构件与每个LED组的第一导电垫和导热垫之间的第二热接合部中断，其中为LED组的第一导电垫和第二导电垫提供电力使得LED组中的晶片发光。
CN201580069721.0A 2014-12-22 2015-12-16 具有直接安装在散热器上的led的效率提高的照明装置 Active CN107112401B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462095733P 2014-12-22 2014-12-22
US62/095,733 2014-12-22
PCT/US2015/066201 WO2016106053A1 (en) 2014-12-22 2015-12-16 Improved efficiency lighting apparatus with led directly mounted to a heatsink

Publications (2)

Publication Number Publication Date
CN107112401A CN107112401A (zh) 2017-08-29
CN107112401B true CN107112401B (zh) 2019-05-17

Family

ID=56128968

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580069721.0A Active CN107112401B (zh) 2014-12-22 2015-12-16 具有直接安装在散热器上的led的效率提高的照明装置

Country Status (8)

Country Link
US (5) US20160178182A1 (zh)
EP (1) EP3238278B1 (zh)
JP (2) JP2018505537A (zh)
CN (1) CN107112401B (zh)
CA (1) CA2971717C (zh)
DK (1) DK3238278T3 (zh)
HR (1) HRP20200833T1 (zh)
WO (1) WO2016106053A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD938095S1 (en) * 2013-04-01 2021-12-07 Pathy Medical, Llc Lighting device
EP3238278B1 (en) * 2014-12-22 2020-03-04 MAG Instrument, Inc. Improved efficiency lighting apparatus with led directly mounted to a heatsink
US10260733B2 (en) 2017-07-13 2019-04-16 Armament Systems And Procedures, Inc. High power flashlight with polymer shell
DE102017126044A1 (de) * 2017-11-08 2019-05-09 HELLA GmbH & Co. KGaA Schaltungsanordnung einer Leuchteinheit eines Scheinwerfers für ein Fahrzeug
USD921947S1 (en) * 2019-02-08 2021-06-08 Jian Shan Search direct charge LED flashlight
USD899646S1 (en) * 2019-02-08 2020-10-20 Jian Shan Utility direct charge LED flashlight
USD899647S1 (en) * 2019-02-08 2020-10-20 Jian Shan Tactical direct charge LED flashlight
EP3734144B1 (en) * 2019-04-29 2022-11-09 Black & Decker Inc. Shed light
CN110260193B (zh) * 2019-06-28 2021-05-14 商洛市虎之翼科技有限公司 具有散热功能的照明装置
US11512818B2 (en) 2020-07-10 2022-11-29 Junming Ding Multi-mode portable lighting device with novel battery charging unit
US11384930B1 (en) * 2021-03-05 2022-07-12 Mag Instrument, Inc Heat sink for lighting devices

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4871628A (en) * 1988-10-14 1989-10-03 Parker David H Battery terminal post protector
US5795675A (en) * 1994-02-15 1998-08-18 Mag Instrument, Inc. Battery device
US6361183B1 (en) * 1991-06-21 2002-03-26 Mag Instrument, Inc. Flashlight
US7093954B2 (en) * 2003-12-19 2006-08-22 Streamlight, Inc. Flashlight having LED assembly and method for producing same
US8215790B2 (en) * 2007-10-03 2012-07-10 The Gillette Company Light-emitting product
US8733966B2 (en) * 2004-08-20 2014-05-27 Mag Instrument, Inc. LED flashlight

Family Cites Families (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4286311A (en) 1978-04-07 1981-08-25 Anthony Maglica Flashlight
US5871272A (en) * 1997-01-28 1999-02-16 Streamlight, Incorporated Flashlight with rotatable lamp head
JP2000235808A (ja) * 1999-02-15 2000-08-29 Matsushita Electric Works Ltd 光源装置
JP4452495B2 (ja) 2001-05-26 2010-04-21 ルミネイション リミテッド ライアビリティ カンパニー スポット照明用高パワーｌｅｄモジュール
US6685584B2 (en) * 2001-11-30 2004-02-03 Wilson Sporting Goods Co. Dual embossed cover material for sporting goods and method of making same
US6974234B2 (en) 2001-12-10 2005-12-13 Galli Robert D LED lighting assembly
US6966677B2 (en) 2001-12-10 2005-11-22 Galli Robert D LED lighting assembly with improved heat management
US7118255B2 (en) 2001-12-10 2006-10-10 Galli Robert D LED lighting assembly with improved heat exchange
US7083305B2 (en) 2001-12-10 2006-08-01 Galli Robert D LED lighting assembly with improved heat management
US7055989B2 (en) 2001-12-10 2006-06-06 Robert Galli LED lighting assembly
US7121680B2 (en) * 2001-12-10 2006-10-17 Galli Robert D LED lighting assembly with improved heat management
US6942365B2 (en) * 2002-12-10 2005-09-13 Robert Galli LED lighting assembly
US7652303B2 (en) 2001-12-10 2010-01-26 Galli Robert D LED lighting assembly
US6827468B2 (en) 2001-12-10 2004-12-07 Robert D. Galli LED lighting assembly
US6971762B2 (en) * 2002-02-01 2005-12-06 Robert Galli Dual mode switch mechanism for flashlights
US6942358B2 (en) 2002-03-29 2005-09-13 Arista Enterprises, Inc. Light emitting diode (LED) flashlight
US6685336B1 (en) 2002-03-29 2004-02-03 Gabe Neiser Light emitting diode (LED) flashlight
US6666565B2 (en) 2002-03-29 2003-12-23 Arista Enterprises Inc. Light emitting diode (LED) flashlight
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
US8093620B2 (en) 2002-12-10 2012-01-10 Galli Robert D LED lighting assembly with improved heat management
US7153004B2 (en) * 2002-12-10 2006-12-26 Galli Robert D Flashlight housing
US20040130894A1 (en) * 2003-01-03 2004-07-08 Galli Robert D. Lighting head assembly with reverse polarity protection
US7170151B2 (en) * 2003-01-16 2007-01-30 Philips Lumileds Lighting Company, Llc Accurate alignment of an LED assembly
US6903380B2 (en) * 2003-04-11 2005-06-07 Weldon Technologies, Inc. High power light emitting diode
US7798667B2 (en) 2003-07-07 2010-09-21 Brasscorp Limited LED spotlight
CA2634475C (en) 2003-07-07 2014-05-20 Brasscorp Limited Led-based inspection lamp with improved collimation optics
US7300173B2 (en) * 2004-04-08 2007-11-27 Technology Assessment Group, Inc. Replacement illumination device for a miniature flashlight bulb
US7321161B2 (en) 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
US7188978B2 (en) 2004-11-15 2007-03-13 Streamlight, Inc. Light mountable on a mounting rail
US8371729B2 (en) 2004-11-15 2013-02-12 Streamlight, Inc. Light with keying arrangement mountable on a mounting rail
US7850345B2 (en) 2005-08-17 2010-12-14 Illumination Management Solutions Inc. Optic for LEDs and other light sources
US7618155B2 (en) * 2005-11-15 2009-11-17 Jeff Jianhua Chen Flashlights utilizing unique LED light sources
KR100736891B1 (ko) 2006-01-13 2007-07-10 서울반도체 주식회사 Ｌｅｄ 램프
US7674003B2 (en) * 2006-04-20 2010-03-09 Streamlight, Inc. Flashlight having plural switches and a controller
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US9222632B2 (en) 2013-01-31 2015-12-29 Cree, Inc. LED lighting fixture
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US7771087B2 (en) 2006-09-30 2010-08-10 Ruud Lighting, Inc. LED light fixture with uninterruptible power supply
US9212812B2 (en) 2013-02-11 2015-12-15 Cree, Inc. LED light fixture with integrated light shielding
US7808013B2 (en) 2006-10-31 2010-10-05 Cree, Inc. Integrated heat spreaders for light emitting devices (LEDs) and related assemblies
US8376577B2 (en) 2007-11-05 2013-02-19 Xicato, Inc. Modular solid state lighting device
US9593837B2 (en) 2008-04-04 2017-03-14 Cree, Inc. Systems and methods for high output, high color quality light
CN102027290B (zh) * 2008-05-25 2012-09-26 青研科技有限公司 可调节的照明装置
US8492179B2 (en) 2008-07-11 2013-07-23 Koninklijke Philips N.V. Method of mounting a LED module to a heat sink
US8157407B2 (en) * 2008-08-07 2012-04-17 Xenonics Holdings, Inc. Long-range, handheld searchlight
US9022612B2 (en) 2008-08-07 2015-05-05 Mag Instrument, Inc. LED module
US8760085B2 (en) 2009-01-14 2014-06-24 Mag Instrument, Inc. Multi-mode portable lighting device
US20110012535A1 (en) 2009-07-14 2011-01-20 Mag Instrument, Inc. Portable lighting devices
US9247598B2 (en) 2009-01-16 2016-01-26 Mag Instrument, Inc. Portable lighting devices
US8269248B2 (en) * 2009-03-02 2012-09-18 Thompson Joseph B Light emitting assemblies and portions thereof
DE102009016876B4 (de) 2009-04-08 2019-09-05 Osram Gmbh Beleuchtungseinheit für Fahrzeugscheinwerfer und Fahrzeugscheinwerfer
US8106569B2 (en) 2009-05-12 2012-01-31 Remphos Technologies Llc LED retrofit for miniature bulbs
DE102009052930A1 (de) 2009-09-14 2011-03-24 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung und Verfahren zum Herstellen eines Kühlkörpers der Leuchtvorrichtung und der Leuchtvorrichtung
US8152327B2 (en) 2009-10-02 2012-04-10 Coast Cutlery Company Focusing lens system
CN102082309B (zh) * 2009-11-27 2014-09-17 尹学军 电动车辆快速补充电能的方法及其供电装置
JP2011146187A (ja) * 2010-01-13 2011-07-28 Tsutomu Seisakusho:Kk 発光ダイオード蛍光灯用連続基板の製造方法
US8395058B2 (en) * 2010-04-23 2013-03-12 Surefire, Llc Metal core circuit board with conductive pins
CN102893418B (zh) 2010-04-26 2015-07-22 松下电器产业株式会社 发光单元、照明装置
US8896015B2 (en) 2010-06-25 2014-11-25 Axlen, Inc. LED package and method of making the same
EP2724079B1 (en) 2011-06-24 2017-05-31 Organo Bulb Inc. Led candle bulb and led candle light
US8692473B2 (en) 2011-08-23 2014-04-08 Mag Instrument, Inc. Portable lighting device
US9052066B2 (en) 2011-09-30 2015-06-09 The Artak Ter-Hovhanissian Patent Trust LED light bulb with integrated heat sink
JP6315343B2 (ja) * 2012-02-21 2018-04-25 カール ツァイス エスエムエス リミテッド 光学系の少なくとも１つの欠陥を補償する方法
US9115885B2 (en) 2012-04-12 2015-08-25 Amerlux Inc. Water tight LED assembly with connector through lens
US20140056438A1 (en) 2012-08-21 2014-02-27 Harman International Industries, Incorporated System for vehicle sound synthesis
FI20125932A (fi) * 2012-09-08 2014-03-09 Lighttherm Oy Menetelmä LED valaisinlaitteiden valmistamiseksi ja LED valaisinlaitteet
WO2014110533A2 (en) * 2013-01-13 2014-07-17 Mag Instrument, Inc. Improved lighting devices
KR101343794B1 (ko) * 2013-05-22 2013-12-20 이슬기 다기능 방열 플랜지를 구비한 발광다이오드 조명기구
EP3238278B1 (en) 2014-12-22 2020-03-04 MAG Instrument, Inc. Improved efficiency lighting apparatus with led directly mounted to a heatsink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4871628A (en) * 1988-10-14 1989-10-03 Parker David H Battery terminal post protector
US6361183B1 (en) * 1991-06-21 2002-03-26 Mag Instrument, Inc. Flashlight
US5795675A (en) * 1994-02-15 1998-08-18 Mag Instrument, Inc. Battery device
US7093954B2 (en) * 2003-12-19 2006-08-22 Streamlight, Inc. Flashlight having LED assembly and method for producing same
US8733966B2 (en) * 2004-08-20 2014-05-27 Mag Instrument, Inc. LED flashlight
US8215790B2 (en) * 2007-10-03 2012-07-10 The Gillette Company Light-emitting product

Also Published As

Publication number Publication date
US20160178182A1 (en) 2016-06-23
US20160356480A1 (en) 2016-12-08
EP3238278A1 (en) 2017-11-01
US20160252221A1 (en) 2016-09-01
US10012376B2 (en) 2018-07-03
US20170023227A1 (en) 2017-01-26
EP3238278B1 (en) 2020-03-04
EP3238278A4 (en) 2018-06-06
HRP20200833T1 (hr) 2020-08-07
DK3238278T3 (da) 2020-06-08
CA2971717A1 (en) 2016-06-30
JP2018505537A (ja) 2018-02-22
US20170248299A1 (en) 2017-08-31
US9494308B1 (en) 2016-11-15
JP2021036527A (ja) 2021-03-04
US9453625B2 (en) 2016-09-27
CN107112401A (zh) 2017-08-29
JP7036883B2 (ja) 2022-03-15
US9671102B2 (en) 2017-06-06
WO2016106053A1 (en) 2016-06-30
CA2971717C (en) 2021-08-24

Similar Documents

Publication Publication Date Title
CN107112401B (zh) 具有直接安装在散热器上的led的效率提高的照明装置
JP4651701B2 (ja) 照明装置
US20100271834A1 (en) Led lighting system
JP4236544B2 (ja) 照明装置
JP5002408B2 (ja) 照明装置
JP4651702B2 (ja) 照明装置
TW201232855A (en) LED light source utilizing magnetic attachment
JP2010114435A (ja) 放熱表面を有する発光装置
TWM498387U (zh) 熱電分離的發光二極體封裝模組及電連接模組
US10364970B2 (en) LED lighting assembly having electrically conductive heat sink for providing power directly to an LED light source
US8476645B2 (en) LED thermal management
JP2011096594A (ja) 電球型ｌｅｄランプ
TW201122348A (en) Array of scalable ceramic diode carriers having LEDs
KR200430821Y1 (ko) 발광다이오드램프 구성체 발열장치
TWI373592B (en) Light source module
RU2650076C1 (ru) Способ установки мощных светодиодов на печатную плату
JP2011181252A (ja) 照明器具
JP2010272736A (ja) 発光装置
US20150123559A1 (en) Optical semiconductor lighting apparatus
US11384930B1 (en) Heat sink for lighting devices
JP5450707B2 (ja) 照明装置
JP2012099486A (ja) 照明装置
JP2011060772A (ja) 照明装置
JP6212866B2 (ja) 発光ユニット及び照明器具
TW201723379A (zh) 發光二極體燈絲燈泡的構造

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant