JP2010500779A - デバイスチップキャリア、モジュールおよびその製造方法 - Google Patents

デバイスチップキャリア、モジュールおよびその製造方法 Download PDF

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Publication number
JP2010500779A
JP2010500779A JP2009524637A JP2009524637A JP2010500779A JP 2010500779 A JP2010500779 A JP 2010500779A JP 2009524637 A JP2009524637 A JP 2009524637A JP 2009524637 A JP2009524637 A JP 2009524637A JP 2010500779 A JP2010500779 A JP 2010500779A
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JP
Japan
Prior art keywords
thick film
dielectric
conductive layer
layer
base material
Prior art date
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Pending
Application number
JP2009524637A
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English (en)
Japanese (ja)
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JP2010500779A5 (enExample
Inventor
スルトスキー ジョエル
ディー．ビーダー ブライアン
トーマス リン
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EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2010500779A publication Critical patent/JP2010500779A/ja
Publication of JP2010500779A5 publication Critical patent/JP2010500779A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Glass Compositions (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electroluminescent Light Sources (AREA)
JP2009524637A 2006-08-11 2007-08-10 デバイスチップキャリア、モジュールおよびその製造方法 Pending JP2010500779A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US83700506P 2006-08-11 2006-08-11
PCT/US2007/017844 WO2008021269A2 (en) 2006-08-11 2007-08-10 Device chip carriers, modules, and methods of forming thereof

Publications (2)

Publication Number Publication Date
JP2010500779A true JP2010500779A (ja) 2010-01-07
JP2010500779A5 JP2010500779A5 (enExample) 2010-09-30

Family

ID=38961497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009524637A Pending JP2010500779A (ja) 2006-08-11 2007-08-10 デバイスチップキャリア、モジュールおよびその製造方法

Country Status (5)

Country Link
US (1) US8710523B2 (enExample)
EP (1) EP2050129A2 (enExample)
JP (1) JP2010500779A (enExample)
TW (1) TW200824009A (enExample)
WO (1) WO2008021269A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013047876A1 (ja) * 2011-09-30 2013-04-04 富士フイルム株式会社 発光装置
WO2013046617A1 (ja) * 2011-09-28 2013-04-04 三洋電機株式会社 素子搭載用基板、半導体モジュールおよび素子搭載用基板の製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135725A (ja) * 2006-10-31 2008-06-12 Toshiba Corp 半導体発光装置
DE102010017711A1 (de) * 2009-07-07 2011-01-13 Siteco Beleuchtungstechnik Gmbh Dreidimensionales LED-Trägerelement mit thermischer Leitfähigkeit
KR101075738B1 (ko) * 2009-10-29 2011-10-26 삼성전기주식회사 방열 구조물 및 그 제조 방법
CN101887942A (zh) * 2010-06-07 2010-11-17 江苏鑫钻新材料科技有限公司 一种安装led的金属基板及其制造方法
WO2012054035A1 (en) * 2010-10-21 2012-04-26 Hewlett-Packard Development Company L.P. Adhesion-promoting surface
WO2015065654A1 (en) * 2013-10-28 2015-05-07 Ferro Corporation Dielectric pastes for aluminum substrates
DE102015107657A1 (de) 2015-05-15 2016-12-01 Alanod Gmbh & Co. Kg Verfahren zur Herstellung eines Anschlussträgers, Anschlussträger sowie optoelektronisches Halbleiterbauteil mit einem Anschlussträger
JP7234099B2 (ja) * 2019-11-12 2023-03-07 株式会社東芝 電子放出素子

Citations (3)

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JPS6265399A (ja) * 1985-09-17 1987-03-24 株式会社フジクラ ホ−ロ−基板への厚膜回路の形成方法
JPS6284942U (enExample) * 1985-11-19 1987-05-30
JPH07170041A (ja) * 1994-10-24 1995-07-04 Toshiba Corp 高熱伝導性回路基板及び高熱伝導性外囲器

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US3186588A (en) * 1963-02-27 1965-06-01 Marvin W Chapman Coin operated dispenser having a message means
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JPS6265399A (ja) * 1985-09-17 1987-03-24 株式会社フジクラ ホ−ロ−基板への厚膜回路の形成方法
JPS6284942U (enExample) * 1985-11-19 1987-05-30
JPH07170041A (ja) * 1994-10-24 1995-07-04 Toshiba Corp 高熱伝導性回路基板及び高熱伝導性外囲器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046617A1 (ja) * 2011-09-28 2013-04-04 三洋電機株式会社 素子搭載用基板、半導体モジュールおよび素子搭載用基板の製造方法
WO2013047876A1 (ja) * 2011-09-30 2013-04-04 富士フイルム株式会社 発光装置

Also Published As

Publication number Publication date
WO2008021269A2 (en) 2008-02-21
EP2050129A2 (en) 2009-04-22
WO2008021269A3 (en) 2008-04-10
TW200824009A (en) 2008-06-01
US20080035943A1 (en) 2008-02-14
US8710523B2 (en) 2014-04-29

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