JP2010280043A - ブレイクバー - Google Patents
ブレイクバー Download PDFInfo
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- JP2010280043A JP2010280043A JP2009136427A JP2009136427A JP2010280043A JP 2010280043 A JP2010280043 A JP 2010280043A JP 2009136427 A JP2009136427 A JP 2009136427A JP 2009136427 A JP2009136427 A JP 2009136427A JP 2010280043 A JP2010280043 A JP 2010280043A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
【解決手段】ブレイクバー10の両端に回転軸11a,11bを設け、その間に多角柱状のブレイク部12を設ける。多角柱状のブレイク部の稜線部に夫々長さが異なる刃先13a,14a,15aを設ける。こうすればブレイクバー10を回転軸11a,11bに沿って回転させることによって、刃先の長さを容易に選択することができる。
【選択図】図3
Description
11a,11b,21a,21b,31a,31b,41a,41b,71a,71b 回転軸
13a,14a,15a,23a,24a,25a,26a,33a,34a,35a,36a,37a,42a,43a,44a,46a,47a,48a,73,74・・・76 刃先
13b,13c,14b,14c,15b,15c,23b,23c,24b,24c,25b,25c,26b,26c,33b,33c,34b,34c,35b,35c,36b,36c,37b,37c,42b,42c,43b,43c,44b,44c,46b,46c,47b,47c,48b,48c 切欠き
Claims (5)
- 両端に形成された一対の回転軸と、
前記回転軸の間に形成された柱形状のブレイク部と、を有し、
前記ブレイク部は前記柱状の外周面に、前記回転軸の中心軸に平行に複数の異なる特性を有する刃先を形成したブレイクバー。 - 前述ブレイク部は多角柱状であり、
前記ブレイク部は前記多角柱状の各稜線部を夫々刃先とし、各稜線毎に刃先の仕様を異ならせた請求項1記載のブレイクバー。 - 前記多角形状部の稜線は、夫々両端に切欠きを有し、その間を刃先とすると共に、各稜線毎に刃先の長さを異ならせた請求項2記載のブレイクバー。
- 前記ブレイク部の長手方向における刃先の中央部を同一位置とした請求項4記載のブレイクバー。
- 前記ブレイク部の刃先は、夫々先端に溝を有する請求項1〜4のいずれか1項記載のブレイクバー。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009136427A JP5310278B2 (ja) | 2009-06-05 | 2009-06-05 | ブレイクバー |
TW099116543A TWI437626B (zh) | 2009-06-05 | 2010-05-24 | Break bar |
KR1020100052803A KR101103260B1 (ko) | 2009-06-05 | 2010-06-04 | 브레이크 바 |
CN2010101982606A CN101905490B (zh) | 2009-06-05 | 2010-06-04 | 断裂棒 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009136427A JP5310278B2 (ja) | 2009-06-05 | 2009-06-05 | ブレイクバー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010280043A true JP2010280043A (ja) | 2010-12-16 |
JP5310278B2 JP5310278B2 (ja) | 2013-10-09 |
Family
ID=43261150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009136427A Expired - Fee Related JP5310278B2 (ja) | 2009-06-05 | 2009-06-05 | ブレイクバー |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5310278B2 (ja) |
KR (1) | KR101103260B1 (ja) |
CN (1) | CN101905490B (ja) |
TW (1) | TWI437626B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012183644A (ja) * | 2011-03-03 | 2012-09-27 | Denso Corp | 基板の分割方法及び分割装置 |
JP2014120508A (ja) * | 2012-12-13 | 2014-06-30 | Disco Abrasive Syst Ltd | 分割装置および分割方法 |
JP2015066832A (ja) * | 2013-09-30 | 2015-04-13 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法並びにブレイク装置 |
KR20160026634A (ko) * | 2014-08-28 | 2016-03-09 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 브레이크 장치 및 브레이크 장치에 있어서의 취성 재료 기판의 분단 방법 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102658055B (zh) * | 2012-06-07 | 2015-09-09 | 王洪福 | 多棱柱搅拌棒 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0817766A (ja) * | 1994-06-28 | 1996-01-19 | Hitachi Ltd | 半導体ウエハのブレーキング装置 |
JP2007220703A (ja) * | 2006-02-14 | 2007-08-30 | Enzan Seisakusho Co Ltd | 半導体チップ分離装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI228780B (en) * | 2000-05-11 | 2005-03-01 | Disco Corp | Semiconductor wafer dividing method |
JP3792508B2 (ja) * | 2000-12-19 | 2006-07-05 | 三星ダイヤモンド工業株式会社 | 貼り合わせ脆性基板の分断方法 |
CN1330596C (zh) * | 2002-04-01 | 2007-08-08 | 三星钻石工业股份有限公司 | 脆性材料基板的分断方法以及采用该方法的分断装置 |
JP5037138B2 (ja) * | 2005-01-05 | 2012-09-26 | Thk株式会社 | ワークのブレイク方法及び装置、スクライブ及びブレイク方法、並びにブレイク機能付きスクライブ装置 |
JP5058451B2 (ja) * | 2005-06-02 | 2012-10-24 | コーニングジャパン株式会社 | 板材の分断ユニット、この分断ユニットを有する分断装置、および、この分断装置を有する分断設備 |
US20090230102A1 (en) * | 2005-10-28 | 2009-09-17 | Masanobu Soyama | Method for Creating Scribe Line on Brittle Material Substrate and Apparatus for Creating Scribe Line |
-
2009
- 2009-06-05 JP JP2009136427A patent/JP5310278B2/ja not_active Expired - Fee Related
-
2010
- 2010-05-24 TW TW099116543A patent/TWI437626B/zh not_active IP Right Cessation
- 2010-06-04 KR KR1020100052803A patent/KR101103260B1/ko not_active IP Right Cessation
- 2010-06-04 CN CN2010101982606A patent/CN101905490B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0817766A (ja) * | 1994-06-28 | 1996-01-19 | Hitachi Ltd | 半導体ウエハのブレーキング装置 |
JP2007220703A (ja) * | 2006-02-14 | 2007-08-30 | Enzan Seisakusho Co Ltd | 半導体チップ分離装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012183644A (ja) * | 2011-03-03 | 2012-09-27 | Denso Corp | 基板の分割方法及び分割装置 |
JP2014120508A (ja) * | 2012-12-13 | 2014-06-30 | Disco Abrasive Syst Ltd | 分割装置および分割方法 |
JP2015066832A (ja) * | 2013-09-30 | 2015-04-13 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法並びにブレイク装置 |
KR20160026634A (ko) * | 2014-08-28 | 2016-03-09 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 브레이크 장치 및 브레이크 장치에 있어서의 취성 재료 기판의 분단 방법 |
JP2016047628A (ja) * | 2014-08-28 | 2016-04-07 | 三星ダイヤモンド工業株式会社 | ブレーク装置およびブレーク装置における脆性材料基板の分断方法 |
KR102351927B1 (ko) | 2014-08-28 | 2022-01-14 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 브레이크 장치 및 브레이크 장치에 있어서의 취성 재료 기판의 분단 방법 |
Also Published As
Publication number | Publication date |
---|---|
TW201104733A (en) | 2011-02-01 |
KR101103260B1 (ko) | 2012-01-09 |
JP5310278B2 (ja) | 2013-10-09 |
CN101905490B (zh) | 2013-06-05 |
KR20100131384A (ko) | 2010-12-15 |
TWI437626B (zh) | 2014-05-11 |
CN101905490A (zh) | 2010-12-08 |
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