JP6589358B2 - 脆性材料基板の分断方法 - Google Patents
脆性材料基板の分断方法 Download PDFInfo
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- JP6589358B2 JP6589358B2 JP2015093254A JP2015093254A JP6589358B2 JP 6589358 B2 JP6589358 B2 JP 6589358B2 JP 2015093254 A JP2015093254 A JP 2015093254A JP 2015093254 A JP2015093254 A JP 2015093254A JP 6589358 B2 JP6589358 B2 JP 6589358B2
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- JP
- Japan
- Prior art keywords
- line
- brittle material
- material substrate
- trench
- crack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000758 substrate Substances 0.000 title claims description 89
- 239000000463 material Substances 0.000 title claims description 35
- 238000000034 method Methods 0.000 title claims description 35
- 238000005520 cutting process Methods 0.000 claims description 22
- 229910003460 diamond Inorganic materials 0.000 claims description 12
- 239000010432 diamond Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 description 44
- 238000011144 upstream manufacturing Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Description
11 刃先
12 シャンク
20 ガラス基板
TL1〜TL9 トレンチライン
AL,AL1,AL2 アシストライン
CL1〜CL9 クラックライン
Claims (5)
- 互いに対向する第1及び第2の辺を含む縁に囲まれた表面を有し、前記表面に垂直な厚さ方向を有する脆性材料基板に対して、前記第1,第2の辺のうち分断予定ライン上の前記第1の辺の近傍より第2の辺の近傍まで前記分断予定ラインに沿ってクラックを伴わない溝状の少なくとも1本のトレンチラインを形成し、
前記トレンチラインと70°以下又は110°以上の角度で交差するようにアシストラインを形成し、
前記アシストラインに沿って前記脆性材料基板を分断することにより、前記アシストラインと前記トレンチラインの交差位置から前記トレンチラインに沿って脆性材料基板の厚さ方向にクラックを進展させたクラックラインを形成し、
前記クラックラインに沿って前記脆性材料基板を分断する脆性材料基板の分断方法。 - 前記アシストラインは、直線状に形成されるものである請求項1記載の脆性材料基板の分断方法。
- 前記アシストラインは、複数の前記トレンチラインと交わる角度が変化する連続線状に形成されるものである請求項1記載の脆性材料基板の分断方法。
- 前記トレンチラインは、ダイヤモンドを用いたスクライビングツールを前記脆性材料基板に押し付け、前記脆性材料基板と前記スクライビングツールを相対的に移動させることによって形成される請求項1〜3のいずれか1項記載の脆性材料基板の分断方法。
- 前記トレンチラインは、スクライビングホイールを前記脆性材料基板に押し付け転動させることによって形成される請求項1〜3のいずれか1項記載の脆性材料基板の分断方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015093254A JP6589358B2 (ja) | 2015-04-30 | 2015-04-30 | 脆性材料基板の分断方法 |
TW105110017A TWI693138B (zh) | 2015-04-30 | 2016-03-30 | 脆性材料基板之分斷方法 |
CN201610214260.8A CN106079116B (zh) | 2015-04-30 | 2016-04-07 | 脆性材料基板的断开方法 |
KR1020160045401A KR102441635B1 (ko) | 2015-04-30 | 2016-04-14 | 취성 재료 기판의 분단 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015093254A JP6589358B2 (ja) | 2015-04-30 | 2015-04-30 | 脆性材料基板の分断方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016210026A JP2016210026A (ja) | 2016-12-15 |
JP6589358B2 true JP6589358B2 (ja) | 2019-10-16 |
Family
ID=57528954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015093254A Expired - Fee Related JP6589358B2 (ja) | 2015-04-30 | 2015-04-30 | 脆性材料基板の分断方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6589358B2 (ja) |
KR (1) | KR102441635B1 (ja) |
CN (1) | CN106079116B (ja) |
TW (1) | TWI693138B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220044112A (ko) | 2020-09-30 | 2022-04-06 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 가공방법 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6955754B2 (ja) * | 2017-07-25 | 2021-10-27 | 三星ダイヤモンド工業株式会社 | ダイヤモンド刃先および基板分断方法 |
JP7421162B2 (ja) * | 2020-01-08 | 2024-01-24 | 日本電気硝子株式会社 | ガラス板の製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0888201A (ja) * | 1994-09-16 | 1996-04-02 | Toyoda Gosei Co Ltd | サファイアを基板とする半導体素子 |
JP3074143B2 (ja) | 1995-11-06 | 2000-08-07 | 三星ダイヤモンド工業株式会社 | ガラスカッターホイール |
JP2003183040A (ja) * | 2001-12-18 | 2003-07-03 | Oputo System:Kk | ポイントカッター並びにその使用の方法及び装置 |
JP2004051394A (ja) * | 2002-07-17 | 2004-02-19 | Nippon Sheet Glass Co Ltd | ガラス板の切断方法及び切断装置 |
JP4890034B2 (ja) * | 2006-01-19 | 2012-03-07 | 富士吉田ティアック株式会社 | 光学部品の製造方法 |
JP5450964B2 (ja) * | 2008-02-29 | 2014-03-26 | 三星ダイヤモンド工業株式会社 | スクライブ装置及びスクライブ方法 |
JP5171522B2 (ja) * | 2008-09-30 | 2013-03-27 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のスクライブ方法 |
JP5528904B2 (ja) * | 2010-05-20 | 2014-06-25 | 株式会社ディスコ | サファイアウェーハの分割方法 |
JP5310787B2 (ja) * | 2011-05-31 | 2013-10-09 | 三星ダイヤモンド工業株式会社 | スクライブ方法 |
JP2013089622A (ja) * | 2011-10-13 | 2013-05-13 | Mitsuboshi Diamond Industrial Co Ltd | 半導体基板のブレイク方法 |
CN102643018B (zh) * | 2012-02-29 | 2014-07-02 | 京东方科技集团股份有限公司 | 裂片分离设备及方法 |
KR20150014458A (ko) * | 2012-04-24 | 2015-02-06 | 가부시키가이샤 토쿄 세이미쯔 | 다이싱 블레이드 |
TWI589420B (zh) * | 2012-09-26 | 2017-07-01 | Mitsuboshi Diamond Ind Co Ltd | Metal multilayer ceramic substrate breaking method and trench processing tools |
CN102910809B (zh) * | 2012-10-24 | 2015-04-15 | 深圳市华星光电技术有限公司 | 一种基板及其切裂方法 |
JP2015034111A (ja) * | 2013-08-09 | 2015-02-19 | 三星ダイヤモンド工業株式会社 | 積層セラミックス基板の分断方法 |
JP6201608B2 (ja) * | 2013-10-08 | 2017-09-27 | 三星ダイヤモンド工業株式会社 | スクライブ方法 |
CN111116029A (zh) * | 2014-05-30 | 2020-05-08 | 三星钻石工业股份有限公司 | 脆性基板的裂缝线形成方法及脆性基板 |
CN106795035B (zh) * | 2014-09-25 | 2019-08-27 | 三星钻石工业股份有限公司 | 脆性衬底的分断方法 |
-
2015
- 2015-04-30 JP JP2015093254A patent/JP6589358B2/ja not_active Expired - Fee Related
-
2016
- 2016-03-30 TW TW105110017A patent/TWI693138B/zh not_active IP Right Cessation
- 2016-04-07 CN CN201610214260.8A patent/CN106079116B/zh not_active Expired - Fee Related
- 2016-04-14 KR KR1020160045401A patent/KR102441635B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220044112A (ko) | 2020-09-30 | 2022-04-06 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성재료 기판의 가공방법 |
Also Published As
Publication number | Publication date |
---|---|
CN106079116A (zh) | 2016-11-09 |
KR102441635B1 (ko) | 2022-09-07 |
KR20160129722A (ko) | 2016-11-09 |
CN106079116B (zh) | 2020-07-28 |
JP2016210026A (ja) | 2016-12-15 |
TW201714720A (zh) | 2017-05-01 |
TWI693138B (zh) | 2020-05-11 |
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