JP2010278444A - プリント配線板の製造方法 - Google Patents
プリント配線板の製造方法 Download PDFInfo
- Publication number
- JP2010278444A JP2010278444A JP2010124063A JP2010124063A JP2010278444A JP 2010278444 A JP2010278444 A JP 2010278444A JP 2010124063 A JP2010124063 A JP 2010124063A JP 2010124063 A JP2010124063 A JP 2010124063A JP 2010278444 A JP2010278444 A JP 2010278444A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- layer
- protective layer
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 74
- 239000010410 layer Substances 0.000 claims abstract description 51
- 239000011241 protective layer Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 239000000758 substrate Substances 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 238000005240 physical vapour deposition Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 229920001940 conductive polymer Polymers 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 230000007261 regionalization Effects 0.000 abstract description 15
- 238000005530 etching Methods 0.000 description 7
- 238000005553 drilling Methods 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】プリント配線板の製造方法であって、第1表面を含む基板を用意する、基板に対して第1回路パターン形成プロセスを行う、第1表面上にベース配線を形成する、ベース配線上に金属保護層を形成する、金属保護層に対して第2回路パターン形成プロセスを行う、パターン形成金属配線保護層を形成する、基板に対してビルドアッププロセスを行い、ベース配線及びパターン形成金属配線保護層上に第1ビルドアップ層を形成する、第1ビルドアップ層に対して第3回路パターン形成プロセスを行い、第1ビルドアップ層配線を形成する、第1ビルドアップ層配線に対してレーザープロセスを行い、キャビティ構造を形成する、パターン形成金属配線保護層を除去する、という工程を含む。
【選択図】図13
Description
110 第1表面
111 ベース配線
120 第2表面
121 第2表面配線
200 金属保護層
210 パターン形成金属配線保護層
300 第1ビルドアップ層
310 第3表面
311 第1ビルドアップ層配線
400、401 キャビティ構造
510、520 貫通孔
511、521 導電層
512 第1導電孔
5121、5221 充填剤
522 第2導電孔
Claims (10)
- プリント配線板の製造方法であって、
第1表面を含む基板を用意する、
前記基板に対して第1回路パターン形成プロセスを行い、前記第1表面上にベース配線を形成する、
前記ベース配線上に金属保護層を形成する、
前記金属保護層に対して第2回路パターン形成プロセスを行い、パターン形成金属配線保護層を形成する、
前記基板に対してビルドアッププロセスを行い、前記ベース配線及び前記パターン形成金属配線保護層上に第1ビルドアップ層を形成する、
前記第1ビルドアップ層に対して第3回路パターン形成プロセスを行い、第1ビルドアップ層配線を形成する、
前記第1ビルドアップ層配線に対してレーザープロセスを行い、キャビティ構造を形成する、
前記パターン形成金属配線保護層を除去する、
という工程を含むことを特徴とする、プリント配線板の製造方法。 - 前記金属保護層の厚さが実質上1ミクロン(μm)から10ミクロン(μm)の間であることを特徴とする、請求項1に記載のプリント配線板の製造方法。
- 前記金属保護層が実質上、金、銀、銅、ニッケル、錫、チタニウム、アルミニウム及びその合金から構成される材料群から選択した少なくとも1種類の材料、または2種類以上の材料から構成される複合層であることを特徴とする、請求項1に記載のプリント配線板の製造方法。
- 前記金属保護層が、ステンレス層または導電性高分子層であることを特徴とする、請求項1に記載のプリント配線板の製造方法。
- 前記基板が、コア基板または多層プリント配線板であることを特徴とする、請求項1に記載のプリント配線板の製造方法。
- 前記ベース配線上に前記金属保護層を形成する方法が、化学気相成長プロセス、物理気相成長プロセス、スパッタリングプロセス、化学めっきプロセスのいずれかであることを特徴とする、請求項1に記載のプリント配線板の製造方法。
- 前記基板がさらに第2表面を含み、且つ前記基板に対して前記第1回路パターン形成プロセスを行う工程がさらに前記第2表面上に第2表面配線を形成する工程を含むことを特徴とする、請求項1に記載のプリント配線板の製造方法。
- さらに、前記基板に少なくとも1つの第1導電孔を形成する、という工程を含むことを特徴とする、請求項1に記載のプリント配線板の製造方法。
- さらに、前記第1ビルドアップ層に少なくとも1つの第2導電孔を形成する、という工程を含むことを特徴とする、請求項1に記載のプリント配線板の製造方法。
- 前記キャビティ構造内に位置する前記ベース配線の上端が円弧状であることを特徴とする、請求項1に記載のプリント配線板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW098118050A TWI393516B (zh) | 2009-06-01 | 2009-06-01 | 印刷電路板的製造方法 |
TW098118050 | 2009-06-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010278444A true JP2010278444A (ja) | 2010-12-09 |
JP4988900B2 JP4988900B2 (ja) | 2012-08-01 |
Family
ID=43218576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010124063A Expired - Fee Related JP4988900B2 (ja) | 2009-06-01 | 2010-05-31 | プリント配線板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8296944B2 (ja) |
JP (1) | JP4988900B2 (ja) |
TW (1) | TWI393516B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5602584B2 (ja) * | 2010-10-28 | 2014-10-08 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
CN103187311B (zh) * | 2011-12-27 | 2016-02-03 | 深南电路有限公司 | 封装基板制作方法 |
CN103298245B (zh) * | 2013-06-14 | 2015-11-25 | 东莞生益电子有限公司 | 高频电路板的制作方法以及该方法制得的电路板 |
CN104427790B (zh) * | 2013-08-29 | 2017-06-09 | 北大方正集团有限公司 | 一种局部凹陷印刷电路板及其制作方法 |
TWI624205B (zh) * | 2016-06-16 | 2018-05-11 | 欣興電子股份有限公司 | 電路板及其製造方法 |
TWI626872B (zh) * | 2017-01-13 | 2018-06-11 | 元鼎音訊股份有限公司 | 印刷電路板製程之方法及其印刷電路板 |
CN112449478B (zh) * | 2019-08-27 | 2022-03-04 | 深南电路股份有限公司 | 线路板及其制作方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004055618A (ja) * | 2002-07-16 | 2004-02-19 | Kanegafuchi Chem Ind Co Ltd | 多層プリント配線板の製造方法 |
JP2005236194A (ja) * | 2004-02-23 | 2005-09-02 | Cmk Corp | プリント配線板の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003101222A (ja) * | 2001-09-21 | 2003-04-04 | Sony Corp | 薄膜回路基板装置及びその製造方法 |
TW200618705A (en) * | 2004-09-16 | 2006-06-01 | Tdk Corp | Multilayer substrate and manufacturing method thereof |
IL171378A (en) * | 2005-10-11 | 2010-11-30 | Dror Hurwitz | Integrated circuit support structures and the fabrication thereof |
-
2009
- 2009-06-01 TW TW098118050A patent/TWI393516B/zh not_active IP Right Cessation
-
2010
- 2010-05-26 US US12/787,426 patent/US8296944B2/en active Active
- 2010-05-31 JP JP2010124063A patent/JP4988900B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004055618A (ja) * | 2002-07-16 | 2004-02-19 | Kanegafuchi Chem Ind Co Ltd | 多層プリント配線板の製造方法 |
JP2005236194A (ja) * | 2004-02-23 | 2005-09-02 | Cmk Corp | プリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201044938A (en) | 2010-12-16 |
US20100299917A1 (en) | 2010-12-02 |
US8296944B2 (en) | 2012-10-30 |
JP4988900B2 (ja) | 2012-08-01 |
TWI393516B (zh) | 2013-04-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4988900B2 (ja) | プリント配線板の製造方法 | |
US10827608B2 (en) | Conformal 3D non-planar multi-layer circuitry | |
JP5993378B2 (ja) | 印刷回路基板 | |
TWI298613B (en) | Method for manufacturing via holes used in printed circuit boards | |
CN111970841A (zh) | 嵌入迹线 | |
KR101019150B1 (ko) | 비아-온-패드 구조를 갖는 인쇄회로기판 제조방법 | |
JP6214398B2 (ja) | 印刷回路基板 | |
WO2001089276A1 (fr) | Procede de fabrication d'une plaquette de circuit imprime | |
JP2002539630A (ja) | 両側に金属層を有する、電気的に絶縁したベース材料にコンタクトホールを設けるための方法 | |
US20160338192A1 (en) | Fine line 3d non-planar conforming circuit | |
WO2015029319A1 (ja) | 配線基板及びその製造方法 | |
CN103717014B (zh) | 基板结构的制作方法 | |
JP2018019076A (ja) | プリント回路基板 | |
JP2008235655A (ja) | 基板及びこの基板の製造方法 | |
JP2009176897A (ja) | 多層プリント配線板の製造方法、多層プリント配線板 | |
KR20110093406A (ko) | 인쇄회로기판 및 그 제조방법 | |
JP2005236194A (ja) | プリント配線板の製造方法 | |
KR101231273B1 (ko) | 인쇄회로기판 및 그의 제조 방법 | |
CN101925267B (zh) | 印刷电路板的制造方法 | |
KR100770168B1 (ko) | 회로기판 제조방법 | |
WO2012148332A1 (en) | Manufacturing method for printed circuit boards | |
JP2007288102A (ja) | プリント配線板及び多層プリント配線板並びにそれらの製造方法 | |
JP2017147362A (ja) | プリント配線板の製造方法 | |
JP4176105B2 (ja) | プリント配線板 | |
JP2022093811A (ja) | プリント配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120404 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120426 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4988900 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150511 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |