JP2010277856A - 有機el表示装置 - Google Patents
有機el表示装置 Download PDFInfo
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- JP2010277856A JP2010277856A JP2009129498A JP2009129498A JP2010277856A JP 2010277856 A JP2010277856 A JP 2010277856A JP 2009129498 A JP2009129498 A JP 2009129498A JP 2009129498 A JP2009129498 A JP 2009129498A JP 2010277856 A JP2010277856 A JP 2010277856A
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- 238000007789 sealing Methods 0.000 claims abstract description 97
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000000853 adhesive Substances 0.000 claims abstract description 65
- 230000001070 adhesive effect Effects 0.000 claims abstract description 65
- 239000000463 material Substances 0.000 claims abstract description 21
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 9
- 239000011810 insulating material Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 description 14
- 239000011521 glass Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229910001182 Mo alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】画素を構成する複数の有機EL素子を基板上に二次元的に配列させた表示部と、基板に対し接着剤により接着され表示部を覆う封止板と、表示部から封止板の外部に引き出されるように基板上に配された複数の引出配線とを有する有機EL表示装置で、封止板の周縁部が接着される基板上の接着領域に沿って引出配線が配された領域に引出配線に交差して延びる線状突起を備える。線状突起は、表示部に配される絶縁材と同一材料のパターニング可能な材料(例えばフォトレジスト)で形成することが好ましい。また、線状突起の一方又は双方の側面を、上端から下端に向け下り勾配となる傾斜面とすることが好ましい。
【選択図】図3
Description
図1から図3に示すように本発明の一実施形態に係る有機EL表示装置10は、透光性を有する平板状のガラス基板11(以下、単に基板と言うことがある)と、このガラス基板11の表面に形成した有機EL表示部12(以下、表示部と言う)と、表示部12を覆ってこれを封止する封止板13と、表示部12を駆動するIC(Integrated Circuit/集積回路)15と、IC15に接続されたFPC(Flexible Printed Circuit board/フレキシブルプリント基板)16とを備える。
11 ガラス基板
12 有機EL表示部
13 封止板
13a 封止板の周縁部
14 接着領域
14a 接着剤
15 表示部駆動用IC
16 FPC
21 陽極(透明電極/ITO)
22 陰極
23 開口
24 絶縁膜(フォトレジスト膜)
25 陽極側補助電極
26 陰極側補助電極
31,32,33,34,35a,35b 線状突起
Claims (12)
- 画素を構成する複数の有機EL素子を基板上に二次元的に配列させた表示部と、
前記基板に対し接着剤により接着され前記表示部を覆う封止板と、
前記表示部から前記封止板の外部に引き出されるように前記基板上に配された複数の引出配線と、
を有する有機EL表示装置であって、
前記封止板の周縁部が接着される基板上の接着領域に沿って前記引出配線が配された領域に前記引出配線に交差して延びる線状突起を備えた
ことを特徴とする有機EL表示装置。 - 前記線状突起は、パターニング可能な材料からなる
請求項1に記載の有機EL表示装置。 - 前記線状突起は、前記表示部に配される絶縁材と同一の材料からなる
請求項1または2に記載の有機EL表示装置。 - 前記線状突起は、フォトレジストからなる
請求項1から3のいずれか一項に記載の有機EL表示装置。 - 前記線状突起の一方または双方の側面が、当該側面の上端から下端に向け下り勾配となる傾斜面となっている
請求項1から4のいずれか一項に記載の有機EL表示装置。 - 前記引出配線の一方または双方の側面が、少なくとも前記接着領域において、当該側面の上端から下端に向け下り勾配となる傾斜面となっている
請求項5に記載の有機EL表示装置。 - 前記線状突起は、前記引出配線より肉厚である
請求項1から6のいずれか一項に記載の有機EL表示装置。 - 前記線状突起の基板表面からの高さが、接着状態における封止板周縁部下面の基板表面からの高さより低い
請求項1から7のいずれか一項に記載の有機EL表示装置。 - 前記線状突起は、その幅が前記接着領域の幅の2分の1以下である
請求項1から8のいずれか一項に記載の有機EL表示装置。 - 前記線状突起は、前記接着領域の幅方向の略中央位置において当該接着領域に沿って延在する
請求項9に記載の有機EL表示装置。 - 互いに略平行に延びる複数本の前記線状突起を備えた
請求項1から10のいずれか一項に記載の有機EL表示装置。 - 前記線状突起として、長さ方向に断続的に形成された2本以上の線状突起を含み、かつ
これら2本以上の線状突起は、前記接着領域の延在方向に直交する方向から見たときに少なくとも1本の線状突起が存在するように互い違いに配置してある
請求項11に記載の有機EL表示装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009129498A JP4849279B2 (ja) | 2009-05-28 | 2009-05-28 | 有機el表示装置 |
US12/786,977 US8159132B2 (en) | 2009-05-28 | 2010-05-25 | Organic electro-luminescense display apparatus |
KR1020100049480A KR101176097B1 (ko) | 2009-05-28 | 2010-05-27 | 유기 el 표시장치 |
CN2010102290674A CN101924126B (zh) | 2009-05-28 | 2010-05-27 | 有机el显示装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009129498A JP4849279B2 (ja) | 2009-05-28 | 2009-05-28 | 有機el表示装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010277856A true JP2010277856A (ja) | 2010-12-09 |
JP4849279B2 JP4849279B2 (ja) | 2012-01-11 |
Family
ID=43219430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009129498A Expired - Fee Related JP4849279B2 (ja) | 2009-05-28 | 2009-05-28 | 有機el表示装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8159132B2 (ja) |
JP (1) | JP4849279B2 (ja) |
KR (1) | KR101176097B1 (ja) |
CN (1) | CN101924126B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014041614A1 (ja) * | 2012-09-11 | 2014-03-20 | パイオニア株式会社 | 有機el装置 |
WO2014199673A1 (ja) * | 2013-06-11 | 2014-12-18 | シャープ株式会社 | 有機エレクトロルミネッセンス表示装置 |
JP2016152148A (ja) * | 2015-02-18 | 2016-08-22 | 日本精機株式会社 | 有機elパネル |
JP2020531885A (ja) * | 2017-08-31 | 2020-11-05 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | 表示基板及びその製造方法、表示パネル |
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KR101704686B1 (ko) * | 2010-04-01 | 2017-02-09 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
WO2012007893A1 (en) * | 2010-07-16 | 2012-01-19 | Koninklijke Philips Electronics N.V. | An oled device and a method of manufacturing the same |
WO2012115466A2 (ko) * | 2011-02-25 | 2012-08-30 | 주성엔지니어링(주) | 발광 장치 |
KR101989940B1 (ko) | 2012-05-11 | 2019-06-17 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 발광 장치의 제작 방법 |
WO2014017075A1 (ja) * | 2012-07-26 | 2014-01-30 | パナソニック株式会社 | 有機el装置 |
CN106062989A (zh) * | 2014-02-28 | 2016-10-26 | 康宁股份有限公司 | 挠性显示器装置封装以及制造方法 |
CN205723639U (zh) | 2016-04-19 | 2016-11-23 | 鄂尔多斯市源盛光电有限责任公司 | 一种封框胶结构、显示面板和显示装置 |
KR102462530B1 (ko) * | 2017-08-31 | 2022-11-02 | 엘지디스플레이 주식회사 | 비발광 영역 상에 위치하는 신호 배선을 포함하는 유기 발광 표시 장치 |
KR101958393B1 (ko) * | 2018-05-18 | 2019-03-15 | 주성엔지니어링(주) | 유기 발광 다이오드 장치 |
CN208781850U (zh) * | 2018-10-31 | 2019-04-23 | 京东方科技集团股份有限公司 | 显示基板、显示面板及显示装置 |
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JP2000030858A (ja) * | 1998-07-08 | 2000-01-28 | Tdk Corp | 有機el表示装置 |
JP2003100446A (ja) * | 2001-09-21 | 2003-04-04 | Sanyo Electric Co Ltd | 有機エレクトロルミネッセンスパネルおよびその製造方法 |
JP2004030974A (ja) * | 2002-06-21 | 2004-01-29 | Samsung Nec Mobile Display Co Ltd | 電子発光素子及びその製造方法 |
JP2004103337A (ja) * | 2002-09-06 | 2004-04-02 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
JP2005038837A (ja) * | 2003-06-30 | 2005-02-10 | Semiconductor Energy Lab Co Ltd | 発光装置 |
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JP2009020129A (ja) * | 2007-06-13 | 2009-01-29 | Sony Corp | 表示装置およびその製造方法 |
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JP4623068B2 (ja) * | 2007-09-12 | 2011-02-02 | ソニー株式会社 | 表示パネル、表示パネルモジュール及び電子機器 |
-
2009
- 2009-05-28 JP JP2009129498A patent/JP4849279B2/ja not_active Expired - Fee Related
-
2010
- 2010-05-25 US US12/786,977 patent/US8159132B2/en not_active Expired - Fee Related
- 2010-05-27 KR KR1020100049480A patent/KR101176097B1/ko active IP Right Grant
- 2010-05-27 CN CN2010102290674A patent/CN101924126B/zh not_active Expired - Fee Related
Patent Citations (7)
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JP2000030858A (ja) * | 1998-07-08 | 2000-01-28 | Tdk Corp | 有機el表示装置 |
JP2003100446A (ja) * | 2001-09-21 | 2003-04-04 | Sanyo Electric Co Ltd | 有機エレクトロルミネッセンスパネルおよびその製造方法 |
JP2004030974A (ja) * | 2002-06-21 | 2004-01-29 | Samsung Nec Mobile Display Co Ltd | 電子発光素子及びその製造方法 |
JP2004103337A (ja) * | 2002-09-06 | 2004-04-02 | Semiconductor Energy Lab Co Ltd | 発光装置およびその作製方法 |
JP2005038837A (ja) * | 2003-06-30 | 2005-02-10 | Semiconductor Energy Lab Co Ltd | 発光装置 |
JP2009020129A (ja) * | 2007-06-13 | 2009-01-29 | Sony Corp | 表示装置およびその製造方法 |
JP2008311239A (ja) * | 2008-08-29 | 2008-12-25 | Seiko Epson Corp | 発光装置および電子機器 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014041614A1 (ja) * | 2012-09-11 | 2014-03-20 | パイオニア株式会社 | 有機el装置 |
WO2014199673A1 (ja) * | 2013-06-11 | 2014-12-18 | シャープ株式会社 | 有機エレクトロルミネッセンス表示装置 |
US9692008B2 (en) | 2013-06-11 | 2017-06-27 | Sharp Kabushiki Kaisha | Organic electroluminescent display device |
JP2016152148A (ja) * | 2015-02-18 | 2016-08-22 | 日本精機株式会社 | 有機elパネル |
WO2016132948A1 (ja) * | 2015-02-18 | 2016-08-25 | 日本精機株式会社 | 有機elパネル |
JP2020531885A (ja) * | 2017-08-31 | 2020-11-05 | 京東方科技集團股▲ふん▼有限公司Boe Technology Group Co.,Ltd. | 表示基板及びその製造方法、表示パネル |
JP7196098B2 (ja) | 2017-08-31 | 2022-12-26 | 京東方科技集團股▲ふん▼有限公司 | 表示基板及びその製造方法、表示パネル |
Also Published As
Publication number | Publication date |
---|---|
CN101924126B (zh) | 2012-09-19 |
JP4849279B2 (ja) | 2012-01-11 |
CN101924126A (zh) | 2010-12-22 |
US20100301743A1 (en) | 2010-12-02 |
KR101176097B1 (ko) | 2012-08-22 |
KR20100129199A (ko) | 2010-12-08 |
US8159132B2 (en) | 2012-04-17 |
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