JP2010192864A - 多層配線基板の製造方法 - Google Patents

多層配線基板の製造方法 Download PDF

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Publication number
JP2010192864A
JP2010192864A JP2009143642A JP2009143642A JP2010192864A JP 2010192864 A JP2010192864 A JP 2010192864A JP 2009143642 A JP2009143642 A JP 2009143642A JP 2009143642 A JP2009143642 A JP 2009143642A JP 2010192864 A JP2010192864 A JP 2010192864A
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JP
Japan
Prior art keywords
layer
insulating layer
thin film
porous thin
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009143642A
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English (en)
Japanese (ja)
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JP2010192864A5 (enExample
Inventor
Daisuke Matono
大輔 的野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009143642A priority Critical patent/JP2010192864A/ja
Publication of JP2010192864A publication Critical patent/JP2010192864A/ja
Publication of JP2010192864A5 publication Critical patent/JP2010192864A5/ja
Pending legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2009143642A 2009-01-21 2009-06-16 多層配線基板の製造方法 Pending JP2010192864A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009143642A JP2010192864A (ja) 2009-01-21 2009-06-16 多層配線基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009011127 2009-01-21
JP2009143642A JP2010192864A (ja) 2009-01-21 2009-06-16 多層配線基板の製造方法

Publications (2)

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JP2010192864A true JP2010192864A (ja) 2010-09-02
JP2010192864A5 JP2010192864A5 (enExample) 2012-05-24

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Family Applications (1)

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JP2009143642A Pending JP2010192864A (ja) 2009-01-21 2009-06-16 多層配線基板の製造方法

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JP (1) JP2010192864A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103327754A (zh) * 2012-03-20 2013-09-25 景硕科技股份有限公司 线路积层板的多层线路结构的制作方法
US20140041923A1 (en) * 2012-08-10 2014-02-13 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
US11462501B2 (en) 2019-10-25 2022-10-04 Shinko Electric Industries Co., Ltd. Interconnect substrate and method of making the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329959A (ja) * 2001-04-27 2002-11-15 Hitachi Chem Co Ltd プリント配線板およびその製造方法
JP2007027564A (ja) * 2005-07-20 2007-02-01 Shibaura Mechatronics Corp 表面処理方法及び表面処理装置
JP2007109706A (ja) * 2005-10-11 2007-04-26 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329959A (ja) * 2001-04-27 2002-11-15 Hitachi Chem Co Ltd プリント配線板およびその製造方法
JP2007027564A (ja) * 2005-07-20 2007-02-01 Shibaura Mechatronics Corp 表面処理方法及び表面処理装置
JP2007109706A (ja) * 2005-10-11 2007-04-26 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103327754A (zh) * 2012-03-20 2013-09-25 景硕科技股份有限公司 线路积层板的多层线路结构的制作方法
US20140041923A1 (en) * 2012-08-10 2014-02-13 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
US9603248B2 (en) * 2012-08-10 2017-03-21 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
US11462501B2 (en) 2019-10-25 2022-10-04 Shinko Electric Industries Co., Ltd. Interconnect substrate and method of making the same

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