JP2010192864A5 - - Google Patents

Download PDF

Info

Publication number
JP2010192864A5
JP2010192864A5 JP2009143642A JP2009143642A JP2010192864A5 JP 2010192864 A5 JP2010192864 A5 JP 2010192864A5 JP 2009143642 A JP2009143642 A JP 2009143642A JP 2009143642 A JP2009143642 A JP 2009143642A JP 2010192864 A5 JP2010192864 A5 JP 2010192864A5
Authority
JP
Japan
Prior art keywords
thin film
porous thin
insulating layer
wiring board
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009143642A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010192864A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009143642A priority Critical patent/JP2010192864A/ja
Priority claimed from JP2009143642A external-priority patent/JP2010192864A/ja
Publication of JP2010192864A publication Critical patent/JP2010192864A/ja
Publication of JP2010192864A5 publication Critical patent/JP2010192864A5/ja
Pending legal-status Critical Current

Links

JP2009143642A 2009-01-21 2009-06-16 多層配線基板の製造方法 Pending JP2010192864A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009143642A JP2010192864A (ja) 2009-01-21 2009-06-16 多層配線基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009011127 2009-01-21
JP2009143642A JP2010192864A (ja) 2009-01-21 2009-06-16 多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2010192864A JP2010192864A (ja) 2010-09-02
JP2010192864A5 true JP2010192864A5 (enExample) 2012-05-24

Family

ID=42818529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009143642A Pending JP2010192864A (ja) 2009-01-21 2009-06-16 多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JP2010192864A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103327754A (zh) * 2012-03-20 2013-09-25 景硕科技股份有限公司 线路积层板的多层线路结构的制作方法
KR101412225B1 (ko) * 2012-08-10 2014-06-25 이비덴 가부시키가이샤 배선판 및 그 제조 방법
US11462501B2 (en) 2019-10-25 2022-10-04 Shinko Electric Industries Co., Ltd. Interconnect substrate and method of making the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002329959A (ja) * 2001-04-27 2002-11-15 Hitachi Chem Co Ltd プリント配線板およびその製造方法
JP4702938B2 (ja) * 2005-07-20 2011-06-15 芝浦メカトロニクス株式会社 表面処理方法及び表面処理装置
JP2007109706A (ja) * 2005-10-11 2007-04-26 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法

Similar Documents

Publication Publication Date Title
JP2011521459A5 (enExample)
US10500546B2 (en) Processes for forming composite structures with a two-dimensional material using a porous, non-sacrificial supporting layer
TWI675942B (zh) 製造多孔銅箔的方法及由其製造的多孔銅箔
JP2018536617A (ja) 高伝導性グラフェインメタルコンポジット及びその製造法
JP2010503205A5 (enExample)
JP2013257593A5 (ja) 転写用マスクの製造方法及び半導体装置の製造方法
JP2008540167A5 (enExample)
US9586826B2 (en) Method of growing high-quality single layer graphene by using Cu/Ni multi-layer metalic catalyst, and graphene device using the same
TW200710926A (en) Method for fabricating semiconductor device and semiconductor device
JP2016529085A5 (enExample)
JP2010192864A5 (enExample)
KR101563231B1 (ko) 나노시트-무기물 적층 다공성 나노구조체 및 이의 제조 방법
CN102573335B (zh) 起始层芯板的方法
CN105621353B (zh) 一种基于多层阳极氧化铝模板的大面积纳米图形化方法
JP2014063950A5 (enExample)
JP2012101196A5 (enExample)
CN101762978A (zh) 抗蚀剂
JP2008232806A5 (enExample)
JP2008041648A5 (enExample)
CN109402580B (zh) 一种超致密Cu(OH)2纳米线的制备方法及产品
KR20120009326A (ko) 3차원 그래핀 패턴 형성방법
JP2009086094A5 (enExample)
KR20110115864A (ko) 마이크로 부품 및 금형의 제조방법
JP4808824B1 (ja) パターン構造体の製造方法
WO2012042203A3 (en) Method of metal deposition