JP2010186974A - 液処理装置、液処理方法及び記憶媒体 - Google Patents

液処理装置、液処理方法及び記憶媒体 Download PDF

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Publication number
JP2010186974A
JP2010186974A JP2009031889A JP2009031889A JP2010186974A JP 2010186974 A JP2010186974 A JP 2010186974A JP 2009031889 A JP2009031889 A JP 2009031889A JP 2009031889 A JP2009031889 A JP 2009031889A JP 2010186974 A JP2010186974 A JP 2010186974A
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JP
Japan
Prior art keywords
liquid
processing
nozzle
wafer
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009031889A
Other languages
English (en)
Japanese (ja)
Inventor
Yasushi Takiguchi
靖史 滝口
Yoshitaka Yoshimura
好貴 吉村
Yuichiro Miyata
雄一郎 宮田
Yusuke Yamamoto
裕介 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2009031889A priority Critical patent/JP2010186974A/ja
Priority to KR1020100009009A priority patent/KR101530959B1/ko
Priority to TW099104432A priority patent/TWI454318B/zh
Priority to CN2010101196410A priority patent/CN101807514B/zh
Publication of JP2010186974A publication Critical patent/JP2010186974A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3057—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the processing units other than the developing unit, e.g. washing units
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Public Health (AREA)
  • Manufacturing & Machinery (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2009031889A 2009-02-13 2009-02-13 液処理装置、液処理方法及び記憶媒体 Pending JP2010186974A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009031889A JP2010186974A (ja) 2009-02-13 2009-02-13 液処理装置、液処理方法及び記憶媒体
KR1020100009009A KR101530959B1 (ko) 2009-02-13 2010-02-01 액 처리 장치, 액 처리 방법 및 기억 매체
TW099104432A TWI454318B (zh) 2009-02-13 2010-02-11 Liquid handling devices, liquid handling methods and memory media
CN2010101196410A CN101807514B (zh) 2009-02-13 2010-02-20 液处理装置、液处理方法和存储介质

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009031889A JP2010186974A (ja) 2009-02-13 2009-02-13 液処理装置、液処理方法及び記憶媒体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011207933A Division JP5293790B2 (ja) 2011-09-22 2011-09-22 液処理装置、液処理方法及び記憶媒体

Publications (1)

Publication Number Publication Date
JP2010186974A true JP2010186974A (ja) 2010-08-26

Family

ID=42609251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009031889A Pending JP2010186974A (ja) 2009-02-13 2009-02-13 液処理装置、液処理方法及び記憶媒体

Country Status (4)

Country Link
JP (1) JP2010186974A (ko)
KR (1) KR101530959B1 (ko)
CN (1) CN101807514B (ko)
TW (1) TWI454318B (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012060137A (ja) * 2011-09-22 2012-03-22 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体
CN104952765A (zh) * 2014-03-26 2015-09-30 斯克林集团公司 基板处理装置、喷嘴以及基板处理方法
US9927760B2 (en) 2012-05-22 2018-03-27 Screen Semiconductor Solutions Co., Ltd. Development processing device
KR20190134475A (ko) 2018-05-24 2019-12-04 도쿄엘렉트론가부시키가이샤 액 처리 장치, 액 처리 방법, 및 컴퓨터 판독 가능한 기록 매체
KR20200125500A (ko) 2019-04-26 2020-11-04 도쿄엘렉트론가부시키가이샤 액 처리 장치 및 액 처리 방법
TWI840356B (zh) 2018-05-24 2024-05-01 日商東京威力科創股份有限公司 液處理裝置、液處理方法、及電腦可讀取的記錄媒體

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4893799B2 (ja) * 2009-10-23 2012-03-07 東京エレクトロン株式会社 現像装置、現像方法及び記憶媒体
JP5474853B2 (ja) 2011-03-08 2014-04-16 東京エレクトロン株式会社 液処理装置、液処理方法およびこの液処理方法を実行するためのコンピュータプログラムが記録された記録媒体
CN102937779A (zh) * 2012-11-22 2013-02-20 上海集成电路研发中心有限公司 一种显影液喷涂轨道机及其喷涂方法
JP5867462B2 (ja) * 2013-07-26 2016-02-24 東京エレクトロン株式会社 液処理装置
CN104347352B (zh) * 2013-07-31 2018-05-29 细美事有限公司 一种基板处理装置及基板处理方法
JP5934161B2 (ja) * 2013-09-09 2016-06-15 武蔵エンジニアリング株式会社 ノズルおよび該ノズルを備える液体材料吐出装置
KR102223764B1 (ko) * 2013-12-27 2021-03-05 세메스 주식회사 기판처리장치 및 방법
JP6680096B2 (ja) * 2016-06-13 2020-04-15 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
CN113759675A (zh) * 2020-06-05 2021-12-07 长鑫存储技术有限公司 半导体设备及其操作方法
JP7369227B2 (ja) * 2022-03-22 2023-10-25 株式会社Ｓｃｒｅｅｎホールディングス 現像装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430521A (ja) * 1990-05-28 1992-02-03 Dainippon Screen Mfg Co Ltd 基板用回転式表面処理装置
JPH1167622A (ja) * 1997-08-11 1999-03-09 Dainippon Screen Mfg Co Ltd 現像装置
JP2002124465A (ja) * 1994-09-29 2002-04-26 Tokyo Electron Ltd 現像装置
JP2004260214A (ja) * 1997-04-10 2004-09-16 Dainippon Screen Mfg Co Ltd 現像装置および現像方法
JP2008135679A (ja) * 2006-10-25 2008-06-12 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770424B2 (en) * 2002-12-16 2004-08-03 Asml Holding N.V. Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430521A (ja) * 1990-05-28 1992-02-03 Dainippon Screen Mfg Co Ltd 基板用回転式表面処理装置
JP2002124465A (ja) * 1994-09-29 2002-04-26 Tokyo Electron Ltd 現像装置
JP2004260214A (ja) * 1997-04-10 2004-09-16 Dainippon Screen Mfg Co Ltd 現像装置および現像方法
JPH1167622A (ja) * 1997-08-11 1999-03-09 Dainippon Screen Mfg Co Ltd 現像装置
JP2008135679A (ja) * 2006-10-25 2008-06-12 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012060137A (ja) * 2011-09-22 2012-03-22 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体
US9927760B2 (en) 2012-05-22 2018-03-27 Screen Semiconductor Solutions Co., Ltd. Development processing device
US10960426B2 (en) 2012-05-22 2021-03-30 Screen Semiconductor Solutions Co., Ltd. Development processing device
CN104952765A (zh) * 2014-03-26 2015-09-30 斯克林集团公司 基板处理装置、喷嘴以及基板处理方法
KR20190134475A (ko) 2018-05-24 2019-12-04 도쿄엘렉트론가부시키가이샤 액 처리 장치, 액 처리 방법, 및 컴퓨터 판독 가능한 기록 매체
TWI840356B (zh) 2018-05-24 2024-05-01 日商東京威力科創股份有限公司 液處理裝置、液處理方法、及電腦可讀取的記錄媒體
KR20200125500A (ko) 2019-04-26 2020-11-04 도쿄엘렉트론가부시키가이샤 액 처리 장치 및 액 처리 방법
US11161136B2 (en) 2019-04-26 2021-11-02 Tokyo Electron Limited Liquid processing apparatus and liquid processing method

Also Published As

Publication number Publication date
KR20100092881A (ko) 2010-08-23
KR101530959B1 (ko) 2015-06-23
CN101807514B (zh) 2011-12-28
CN101807514A (zh) 2010-08-18
TWI454318B (zh) 2014-10-01
TW201100177A (en) 2011-01-01

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