JP2010126423A - シリコン単結晶引き上げ用石英ガラスルツボ及びその製造方法 - Google Patents
シリコン単結晶引き上げ用石英ガラスルツボ及びその製造方法 Download PDFInfo
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- JP2010126423A JP2010126423A JP2008305329A JP2008305329A JP2010126423A JP 2010126423 A JP2010126423 A JP 2010126423A JP 2008305329 A JP2008305329 A JP 2008305329A JP 2008305329 A JP2008305329 A JP 2008305329A JP 2010126423 A JP2010126423 A JP 2010126423A
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 106
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 101
- 239000010703 silicon Substances 0.000 title claims abstract description 101
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 100
- 239000013078 crystal Substances 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title description 8
- 239000010453 quartz Substances 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 20
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 50
- 239000007789 gas Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 229920005591 polysilicon Polymers 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/09—Other methods of shaping glass by fusing powdered glass in a shaping mould
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/09—Other methods of shaping glass by fusing powdered glass in a shaping mould
- C03B19/095—Other methods of shaping glass by fusing powdered glass in a shaping mould by centrifuging, e.g. arc discharge in rotating mould
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B35/00—Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure
- C30B35/002—Crucibles or containers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1052—Seed pulling including a sectioned crucible [e.g., double crucible, baffle]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1056—Seed pulling including details of precursor replenishment
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Glass Melting And Manufacturing (AREA)
Abstract
【解決手段】シリコン単結晶引き上げ用石英ガラスルツボ10は、多数の気泡を含む不透明石英ガラス層11からなる外層と、実質的に気泡を含まない透明石英ガラス層12からなる内層とを備えている。ルツボ直胴部10A及び湾曲部10Cの内表面の少なくとも一部は、深さ50μm以上450μm以下の多数の傷が形成された凹凸面12aであり、ルツボ底部10Bの内表面のうち、底部10Bの中心から一定範囲内の領域は、実質的に傷が形成されていない平滑面12bである。ルツボ直胴部10Aの内表面に形成された傷を起点として発生したSiOガスの気泡はほぼ垂直に浮上するため、引き上げ中のシリコン単結晶に取り込まることなく、炉内空間に放出される。
【選択図】図1
Description
10A ルツボの直胴部
10B ルツボの底部
10C ルツボの湾曲部
11 不透明石英ガラス層
12 透明石英ガラス層
12a 凹凸面
12b 平滑面
21 シリコン単結晶
21S シリコン単結晶の投影面
22 シリコン融液
Claims (6)
- 直胴部、湾曲部及び底部を有するシリコン単結晶引き上げ用石英ガラスルツボであって、
多数の気泡を含む不透明石英ガラス層からなる外層と、
実質的に気泡を含まない透明石英ガラス層からなる内層とを備え、
前記直胴及び湾曲部の内表面の少なくとも一部は、深さ50μm以上450μm以下の多数の傷が形成された凹凸面であり、
前記底部の内表面のうち、前記底部の中心から一定範囲内の領域は、実質的に傷が形成されていない平滑面であることを特徴とするシリコン単結晶引き上げ用石英ガラスルツボ。 - 前記底部の中心から一定範囲内の領域は、前記シリコン単結晶の投影面を含むことを特徴とする請求項1に記載のシリコン単結晶引き上げ用石英ガラスルツボ。
- 前記底部の中心から一定範囲内の領域は、前記ルツボ底部の中心からルツボ口径の50%以内の領域を含むことを特徴とする請求項1に記載のシリコン単結晶引き上げ用石英ガラスルツボ。
- 前記湾曲部の内表面に形成された傷の個数は、前記直胴部の内表面に形成された傷の個数よりも多いことを特徴とする請求項1乃至3のいずれか一項に記載のシリコン単結晶引き上げ用石英ガラスルツボ。
- 直胴部、湾曲部及び底部を有するシリコン単結晶引き上げ用石英ガラスルツボであって、
多数の気泡を含む不透明石英ガラス層からなる外層と、
実質的に気泡を含まない透明石英ガラス層からなる内層とを備え、
前記直胴部及び前記湾曲部の内表面の少なくとも一部の粗さが前記底部の内表面よりも粗いことを特徴とするシリコン単結晶引き上げ用石英ガラスルツボ。 - 石英粉を溶融してガラス化することにより石英ガラスルツボを成形する工程と、
前記石英ガラスルツボの直胴部及び湾曲部の内表面の少なくとも一部に深さ50μm以上450μm以下の傷を形成する工程とを備えることを特徴とするシリコン単結晶引き上げ用石英ガラスルツボの製造方法。
Priority Applications (3)
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JP2008305329A JP5042971B2 (ja) | 2008-11-28 | 2008-11-28 | シリコン単結晶引き上げ用石英ガラスルツボ及びその製造方法 |
US12/626,713 US8394198B2 (en) | 2008-11-28 | 2009-11-27 | Silica glass crucible for pulling up silicon single crystal and method for manufacturing thereof |
KR1020090115881A KR101234109B1 (ko) | 2008-11-28 | 2009-11-27 | 실리콘 단결정 인상용 석영 유리 도가니 및 그의 제조 방법 |
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JP2008305329A JP5042971B2 (ja) | 2008-11-28 | 2008-11-28 | シリコン単結晶引き上げ用石英ガラスルツボ及びその製造方法 |
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JP5042971B2 JP5042971B2 (ja) | 2012-10-03 |
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KR (1) | KR101234109B1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013088617A1 (ja) | 2011-12-12 | 2013-06-20 | 信越石英株式会社 | 単結晶シリコン引き上げ用シリカ容器及びその製造方法 |
WO2013140706A1 (ja) | 2012-03-23 | 2013-09-26 | 信越石英株式会社 | 単結晶シリコン引き上げ用シリカ容器及びその製造方法 |
US9376761B2 (en) | 2012-01-13 | 2016-06-28 | Shin-Etsu Quartz Products Co., Ltd. | Single-crystal silicon pulling silica container and method for producing the same |
JP2018043903A (ja) * | 2016-09-14 | 2018-03-22 | 株式会社Sumco | シリコン単結晶の製造方法 |
KR20200106528A (ko) | 2018-02-23 | 2020-09-14 | 가부시키가이샤 사무코 | 석영 유리 도가니 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101623176B1 (ko) * | 2011-12-30 | 2016-05-20 | 가부시키가이샤 섬코 | 실리카 유리 도가니 및 그를 이용한 단결정 실리콘 생산 방법 |
USD808799S1 (en) | 2015-11-17 | 2018-01-30 | Hunter Fan Company | Carton with color striping |
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JPH0255285A (ja) | 1988-08-19 | 1990-02-23 | Nippon Kojundo Sekiei Kk | 石英ルツボの製造方法 |
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2008
- 2008-11-28 JP JP2008305329A patent/JP5042971B2/ja active Active
-
2009
- 2009-11-27 KR KR1020090115881A patent/KR101234109B1/ko active IP Right Grant
- 2009-11-27 US US12/626,713 patent/US8394198B2/en active Active
Patent Citations (4)
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JP2000327478A (ja) * | 1999-04-16 | 2000-11-28 | Shinetsu Quartz Prod Co Ltd | 石英ガラスるつぼ及び前記るつぼの製法 |
JP2005320241A (ja) * | 2003-05-01 | 2005-11-17 | Shinetsu Quartz Prod Co Ltd | シリコン単結晶引上げ用石英ガラスルツボ及びその製造方法 |
JP2005272178A (ja) * | 2004-03-23 | 2005-10-06 | Toshiba Ceramics Co Ltd | シリカガラスルツボ |
JP2008162865A (ja) * | 2006-12-28 | 2008-07-17 | Japan Siper Quarts Corp | 石英ガラスルツボ |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013088617A1 (ja) | 2011-12-12 | 2013-06-20 | 信越石英株式会社 | 単結晶シリコン引き上げ用シリカ容器及びその製造方法 |
US9382640B2 (en) | 2011-12-12 | 2016-07-05 | Shin-Etsu Quartz Products Co., Ltd. | Single crystal silicon pulling silica container and manufacturing method thereof |
US9376761B2 (en) | 2012-01-13 | 2016-06-28 | Shin-Etsu Quartz Products Co., Ltd. | Single-crystal silicon pulling silica container and method for producing the same |
WO2013140706A1 (ja) | 2012-03-23 | 2013-09-26 | 信越石英株式会社 | 単結晶シリコン引き上げ用シリカ容器及びその製造方法 |
JP2018043903A (ja) * | 2016-09-14 | 2018-03-22 | 株式会社Sumco | シリコン単結晶の製造方法 |
KR20200106528A (ko) | 2018-02-23 | 2020-09-14 | 가부시키가이샤 사무코 | 석영 유리 도가니 |
US11466381B2 (en) | 2018-02-23 | 2022-10-11 | Sumco Corporation | Quartz glass crucible |
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US20100132608A1 (en) | 2010-06-03 |
KR101234109B1 (ko) | 2013-02-19 |
US8394198B2 (en) | 2013-03-12 |
JP5042971B2 (ja) | 2012-10-03 |
KR20100061399A (ko) | 2010-06-07 |
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