JP2010118046A - 画像処理方法、画像処理装置及び該画像処理装置を用いた表面検査装置 - Google Patents

画像処理方法、画像処理装置及び該画像処理装置を用いた表面検査装置 Download PDF

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Publication number
JP2010118046A
JP2010118046A JP2009237631A JP2009237631A JP2010118046A JP 2010118046 A JP2010118046 A JP 2010118046A JP 2009237631 A JP2009237631 A JP 2009237631A JP 2009237631 A JP2009237631 A JP 2009237631A JP 2010118046 A JP2010118046 A JP 2010118046A
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rectangular
processed
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JP2009237631A
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Japanese (ja)
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JP2010118046A5 (ko
Inventor
Hiroyuki Wakaba
博之 若葉
Yoshinori Hayashi
義典 林
Koichi Miyazono
浩一 宮園
Shozo Kawasaki
祥三 川崎
Hideki Mori
秀樹 森
Kazuhiko Hamaya
和彦 浜谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOKOHAMA SOGO KENKYUSHO KK
Shibaura Mechatronics Corp
Original Assignee
YOKOHAMA SOGO KENKYUSHO KK
Shibaura Mechatronics Corp
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Application filed by YOKOHAMA SOGO KENKYUSHO KK, Shibaura Mechatronics Corp filed Critical YOKOHAMA SOGO KENKYUSHO KK
Priority to JP2009237631A priority Critical patent/JP2010118046A/ja
Publication of JP2010118046A publication Critical patent/JP2010118046A/ja
Publication of JP2010118046A5 publication Critical patent/JP2010118046A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30121—CRT, LCD or plasma display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2009237631A 2008-10-14 2009-10-14 画像処理方法、画像処理装置及び該画像処理装置を用いた表面検査装置 Pending JP2010118046A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009237631A JP2010118046A (ja) 2008-10-14 2009-10-14 画像処理方法、画像処理装置及び該画像処理装置を用いた表面検査装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008265808 2008-10-14
JP2009237631A JP2010118046A (ja) 2008-10-14 2009-10-14 画像処理方法、画像処理装置及び該画像処理装置を用いた表面検査装置

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JP2010118046A true JP2010118046A (ja) 2010-05-27
JP2010118046A5 JP2010118046A5 (ko) 2012-11-29

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JP2009237631A Pending JP2010118046A (ja) 2008-10-14 2009-10-14 画像処理方法、画像処理装置及び該画像処理装置を用いた表面検査装置

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JP (1) JP2010118046A (ko)
KR (1) KR101227706B1 (ko)
CN (1) CN102177428B (ko)
WO (1) WO2010044433A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103930925A (zh) * 2011-08-22 2014-07-16 佛克有限及两合公司 用于检查棒状烟草产品的方法和设备
CN115775241A (zh) * 2022-12-04 2023-03-10 武汉惠强新能源材料科技有限公司 用于锂电池隔膜生产的流延厚度均匀性检测方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103149215B (zh) * 2013-02-27 2016-04-13 中国计量学院 一种钢化玻璃绝缘子缺陷检测方法与装置
CN103530885B (zh) * 2013-10-23 2015-10-07 北京倍肯恒业科技发展有限责任公司 一种一维图像自适应分层边缘检测提取方法
CN106767425B (zh) * 2016-11-07 2019-07-26 无锡市莱科自动化科技有限公司 一种轴承卡簧豁口的视觉测量方法
CN107680048B (zh) * 2017-09-05 2020-11-10 信利（惠州）智能显示有限公司 一种边缘显示效果处理方法
CN108844471B (zh) * 2018-08-02 2019-05-07 成都天衡智造科技有限公司 一种对圆形工件边缘凹陷区域向圆心延伸长度的测量方法及装置
CN112884769B (zh) * 2021-04-12 2021-09-28 深圳中科飞测科技股份有限公司 图像处理方法、装置、光学系统和计算机可读存储介质

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02242382A (ja) * 1989-03-15 1990-09-26 Matsushita Electric Works Ltd 欠陥検査方法
JPH05143731A (ja) * 1991-11-22 1993-06-11 Sankyo Seiki Mfg Co Ltd 円形パターン識別方法および装置
JPH1115975A (ja) * 1997-06-25 1999-01-22 Matsushita Electric Works Ltd 外観検査方法
JP2002139449A (ja) * 2001-08-27 2002-05-17 Toshiba Eng Co Ltd 円形体の形状検査装置
JP2002325246A (ja) * 2001-04-25 2002-11-08 Univ Waseda 競技場用中継システム
JP2007147441A (ja) * 2005-11-28 2007-06-14 Nikon Corp 検査装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0772097A (ja) * 1993-09-03 1995-03-17 Dainippon Printing Co Ltd 欠陥検査方法
JPH0968502A (ja) * 1995-08-30 1997-03-11 Dainippon Screen Mfg Co Ltd 透孔板の検査方法および検査装置
JPH10311776A (ja) * 1997-03-13 1998-11-24 Asahi Optical Co Ltd 光学部材検査装置
EP1001460B1 (en) * 1998-10-15 2001-05-02 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Method and apparatus for detecting, monitoring and characterizing edge defects on semiconductor wafers
JP2001221749A (ja) * 2000-02-10 2001-08-17 Hitachi Ltd 観察装置及び観察方法
JP2002328094A (ja) * 2001-05-02 2002-11-15 Nidec Tosok Corp Ｌｅｄリング照明及びそれを備えた画像検査装置
JP2007234932A (ja) * 2006-03-02 2007-09-13 Olympus Corp 外観検査装置
DE102007010225B4 (de) * 2007-02-28 2018-08-23 Vistec Semiconductor Systems Gmbh Verfahren zur Aufnahme von hochauflösenden Bildern von Defekten auf der Oberseite des Waferrandes
US7636156B2 (en) * 2007-06-15 2009-12-22 Qimonda Ag Wafer inspection system and method
JP5128920B2 (ja) * 2007-12-03 2013-01-23 芝浦メカトロニクス株式会社 基板表面検査装置及び基板表面検査方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02242382A (ja) * 1989-03-15 1990-09-26 Matsushita Electric Works Ltd 欠陥検査方法
JPH05143731A (ja) * 1991-11-22 1993-06-11 Sankyo Seiki Mfg Co Ltd 円形パターン識別方法および装置
JPH1115975A (ja) * 1997-06-25 1999-01-22 Matsushita Electric Works Ltd 外観検査方法
JP2002325246A (ja) * 2001-04-25 2002-11-08 Univ Waseda 競技場用中継システム
JP2002139449A (ja) * 2001-08-27 2002-05-17 Toshiba Eng Co Ltd 円形体の形状検査装置
JP2007147441A (ja) * 2005-11-28 2007-06-14 Nikon Corp 検査装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103930925A (zh) * 2011-08-22 2014-07-16 佛克有限及两合公司 用于检查棒状烟草产品的方法和设备
CN103930925B (zh) * 2011-08-22 2016-10-26 佛克有限及两合公司 用于检查棒状烟草产品的方法和设备
CN115775241A (zh) * 2022-12-04 2023-03-10 武汉惠强新能源材料科技有限公司 用于锂电池隔膜生产的流延厚度均匀性检测方法

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KR20110057170A (ko) 2011-05-31
WO2010044433A1 (ja) 2010-04-22
KR101227706B1 (ko) 2013-01-29
CN102177428A (zh) 2011-09-07
CN102177428B (zh) 2013-01-02

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