JP2010103802A - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP2010103802A
JP2010103802A JP2008273970A JP2008273970A JP2010103802A JP 2010103802 A JP2010103802 A JP 2010103802A JP 2008273970 A JP2008273970 A JP 2008273970A JP 2008273970 A JP2008273970 A JP 2008273970A JP 2010103802 A JP2010103802 A JP 2010103802A
Authority
JP
Japan
Prior art keywords
substrate
side wall
frame
package
depth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008273970A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010103802A5 (enrdf_load_stackoverflow
Inventor
Kensaku Isohata
健作 磯畑
Masatoshi Yamada
雅敏 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyazaki Epson Corp
Original Assignee
Epson Toyocom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epson Toyocom Corp filed Critical Epson Toyocom Corp
Priority to JP2008273970A priority Critical patent/JP2010103802A/ja
Publication of JP2010103802A publication Critical patent/JP2010103802A/ja
Publication of JP2010103802A5 publication Critical patent/JP2010103802A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
JP2008273970A 2008-10-24 2008-10-24 電子装置 Withdrawn JP2010103802A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008273970A JP2010103802A (ja) 2008-10-24 2008-10-24 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008273970A JP2010103802A (ja) 2008-10-24 2008-10-24 電子装置

Publications (2)

Publication Number Publication Date
JP2010103802A true JP2010103802A (ja) 2010-05-06
JP2010103802A5 JP2010103802A5 (enrdf_load_stackoverflow) 2011-12-01

Family

ID=42294026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008273970A Withdrawn JP2010103802A (ja) 2008-10-24 2008-10-24 電子装置

Country Status (1)

Country Link
JP (1) JP2010103802A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101191075B1 (ko) 2011-06-15 2012-10-16 (주)에프씨아이 에스아이피 구현을 위한 패키지 및 그 제조방법
CN103856183A (zh) * 2012-11-30 2014-06-11 精工爱普生株式会社 振荡器、电子设备以及移动体
JP2015211361A (ja) * 2014-04-28 2015-11-24 日本電波工業株式会社 圧電デバイス
US10069499B2 (en) 2015-03-27 2018-09-04 Seiko Epson Corporation Method of manufacturing oscillator, oscillator, electronic apparatus, and moving object
US10090843B2 (en) 2015-03-27 2018-10-02 Seiko Epson Corporation Oscillator including first and second containers for housing resonator and semiconductor device
JP2018157377A (ja) * 2017-03-17 2018-10-04 セイコーエプソン株式会社 発振器、電子機器および移動体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214945A (ja) * 1998-01-22 1999-08-06 Seiko Epson Corp 電子部品
JP2003243934A (ja) * 2002-02-19 2003-08-29 Toyo Commun Equip Co Ltd 表面実装型圧電発振器、その製造方法及び金型
JP2005191042A (ja) * 2003-12-24 2005-07-14 Kyocera Corp 配線基板
JP2006050529A (ja) * 2004-02-17 2006-02-16 Seiko Epson Corp 圧電発振器、及びその製造方法
JP2006067552A (ja) * 2004-07-27 2006-03-09 Seiko Epson Corp 圧電発振器の製造方法、圧電発振器および電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11214945A (ja) * 1998-01-22 1999-08-06 Seiko Epson Corp 電子部品
JP2003243934A (ja) * 2002-02-19 2003-08-29 Toyo Commun Equip Co Ltd 表面実装型圧電発振器、その製造方法及び金型
JP2005191042A (ja) * 2003-12-24 2005-07-14 Kyocera Corp 配線基板
JP2006050529A (ja) * 2004-02-17 2006-02-16 Seiko Epson Corp 圧電発振器、及びその製造方法
JP2006067552A (ja) * 2004-07-27 2006-03-09 Seiko Epson Corp 圧電発振器の製造方法、圧電発振器および電子機器

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101191075B1 (ko) 2011-06-15 2012-10-16 (주)에프씨아이 에스아이피 구현을 위한 패키지 및 그 제조방법
CN103856183A (zh) * 2012-11-30 2014-06-11 精工爱普生株式会社 振荡器、电子设备以及移动体
US9362921B2 (en) 2012-11-30 2016-06-07 Seiko Epson Corporation Oscillator, electronic apparatus, and moving object
US9432026B2 (en) 2012-11-30 2016-08-30 Seiko Epson Corporation Oscillator, electronic apparatus, and moving object
CN103856183B (zh) * 2012-11-30 2018-04-27 精工爱普生株式会社 振荡器、电子设备以及移动体
JP2015211361A (ja) * 2014-04-28 2015-11-24 日本電波工業株式会社 圧電デバイス
US10069499B2 (en) 2015-03-27 2018-09-04 Seiko Epson Corporation Method of manufacturing oscillator, oscillator, electronic apparatus, and moving object
US10090843B2 (en) 2015-03-27 2018-10-02 Seiko Epson Corporation Oscillator including first and second containers for housing resonator and semiconductor device
JP2018157377A (ja) * 2017-03-17 2018-10-04 セイコーエプソン株式会社 発振器、電子機器および移動体

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