JP2010103802A5 - - Google Patents

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Publication number
JP2010103802A5
JP2010103802A5 JP2008273970A JP2008273970A JP2010103802A5 JP 2010103802 A5 JP2010103802 A5 JP 2010103802A5 JP 2008273970 A JP2008273970 A JP 2008273970A JP 2008273970 A JP2008273970 A JP 2008273970A JP 2010103802 A5 JP2010103802 A5 JP 2010103802A5
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JP
Japan
Prior art keywords
notch
electronic device
space
package
seals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008273970A
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English (en)
Japanese (ja)
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JP2010103802A (ja
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Publication date
Application filed filed Critical
Priority to JP2008273970A priority Critical patent/JP2010103802A/ja
Priority claimed from JP2008273970A external-priority patent/JP2010103802A/ja
Publication of JP2010103802A publication Critical patent/JP2010103802A/ja
Publication of JP2010103802A5 publication Critical patent/JP2010103802A5/ja
Withdrawn legal-status Critical Current

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JP2008273970A 2008-10-24 2008-10-24 電子装置 Withdrawn JP2010103802A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008273970A JP2010103802A (ja) 2008-10-24 2008-10-24 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008273970A JP2010103802A (ja) 2008-10-24 2008-10-24 電子装置

Publications (2)

Publication Number Publication Date
JP2010103802A JP2010103802A (ja) 2010-05-06
JP2010103802A5 true JP2010103802A5 (enrdf_load_stackoverflow) 2011-12-01

Family

ID=42294026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008273970A Withdrawn JP2010103802A (ja) 2008-10-24 2008-10-24 電子装置

Country Status (1)

Country Link
JP (1) JP2010103802A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101191075B1 (ko) 2011-06-15 2012-10-16 (주)에프씨아이 에스아이피 구현을 위한 패키지 및 그 제조방법
JP6083214B2 (ja) 2012-11-30 2017-02-22 セイコーエプソン株式会社 発振器、電子機器、及び移動体
JP2015211361A (ja) * 2014-04-28 2015-11-24 日本電波工業株式会社 圧電デバイス
JP2016187154A (ja) 2015-03-27 2016-10-27 セイコーエプソン株式会社 発振器、電子機器及び移動体
JP2016187152A (ja) 2015-03-27 2016-10-27 セイコーエプソン株式会社 発振器の製造方法、発振器、電子機器及び移動体
JP6942983B2 (ja) * 2017-03-17 2021-09-29 セイコーエプソン株式会社 発振器、電子機器および移動体

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3620260B2 (ja) * 1998-01-22 2005-02-16 セイコーエプソン株式会社 電子部品
JP2003243934A (ja) * 2002-02-19 2003-08-29 Toyo Commun Equip Co Ltd 表面実装型圧電発振器、その製造方法及び金型
JP4189312B2 (ja) * 2003-12-24 2008-12-03 京セラ株式会社 配線基板
JP3841304B2 (ja) * 2004-02-17 2006-11-01 セイコーエプソン株式会社 圧電発振器、及びその製造方法
JP2006067552A (ja) * 2004-07-27 2006-03-09 Seiko Epson Corp 圧電発振器の製造方法、圧電発振器および電子機器

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