JP2010103802A5 - - Google Patents

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Publication number
JP2010103802A5
JP2010103802A5 JP2008273970A JP2008273970A JP2010103802A5 JP 2010103802 A5 JP2010103802 A5 JP 2010103802A5 JP 2008273970 A JP2008273970 A JP 2008273970A JP 2008273970 A JP2008273970 A JP 2008273970A JP 2010103802 A5 JP2010103802 A5 JP 2010103802A5
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JP
Japan
Prior art keywords
notch
electronic device
space
package
seals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008273970A
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Japanese (ja)
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JP2010103802A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2008273970A priority Critical patent/JP2010103802A/en
Priority claimed from JP2008273970A external-priority patent/JP2010103802A/en
Publication of JP2010103802A publication Critical patent/JP2010103802A/en
Publication of JP2010103802A5 publication Critical patent/JP2010103802A5/ja
Withdrawn legal-status Critical Current

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Claims (4)

枠状側壁の一方の開口を基板にて塞ぐように構成されているパッケージと、
前記パッケージに収容されている圧電振動子および電子部品と、を含む電子装置であって、
前記パッケージの外側面には、前記基板の側面に第１の切欠部と、前記枠状側壁の側面に前記第１の切欠部と連結しており前記第１の切欠部よりも深さが浅い第２の切欠部と、を備ていることを特徴とする電子装置。 A package configured to close one opening of the frame-shaped side wall with a substrate;
An electronic device including a piezoelectric vibrator and an electronic component housed in the package,
The outer surface of the package is connected to the first notch on the side surface of the substrate and the first notch on the side surface of the frame-shaped side wall, and is shallower than the first notch. An electronic device comprising a second notch . 前記第１の切欠部と前記第２の切欠部のうち、少なくとも前記第１の切欠部にメッキを施していることを特徴とする請求項１に記載の電子装置。 It said first and notch of the second notch, the electronic device according to claim 1, characterized in that plated on at least the first notch. 前記空間に不活性ガスが入った状態、または真空の状態であって、前記空間を蓋体により封止していることを特徴とする請求項１に記載の電子装置。 The status inert gas enters the space or a vacuum state, the electronic device according to claim 1, characterized in that seals the space by the lid. 前記空間に樹脂を注入して前記空間を封止していることを特徴とする請求項１に記載の電子装置。 Electronic device according to claim 1, characterized in that it seals the space by injecting resin into the space.
JP2008273970A 2008-10-24 2008-10-24 Electronic device Withdrawn JP2010103802A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008273970A JP2010103802A (en) 2008-10-24 2008-10-24 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008273970A JP2010103802A (en) 2008-10-24 2008-10-24 Electronic device

Publications (2)

Publication Number Publication Date
JP2010103802A JP2010103802A (en) 2010-05-06
JP2010103802A5 true JP2010103802A5 (en) 2011-12-01

Family

ID=42294026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008273970A Withdrawn JP2010103802A (en) 2008-10-24 2008-10-24 Electronic device

Country Status (1)

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JP (1) JP2010103802A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101191075B1 (en) 2011-06-15 2012-10-16 (주)에프씨아이 Sip package and manufacturing method
JP6083214B2 (en) 2012-11-30 2017-02-22 セイコーエプソン株式会社 Oscillator, electronic device, and moving object
JP2015211361A (en) * 2014-04-28 2015-11-24 日本電波工業株式会社 Piezoelectric device
JP2016187152A (en) 2015-03-27 2016-10-27 セイコーエプソン株式会社 Method of manufacturing oscillator, oscillator, electronic apparatus, and mobile body
JP2016187154A (en) 2015-03-27 2016-10-27 セイコーエプソン株式会社 Oscillator, electronic apparatus, and mobile body
JP6942983B2 (en) * 2017-03-17 2021-09-29 セイコーエプソン株式会社 Oscillators, electronics and mobiles

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3620260B2 (en) * 1998-01-22 2005-02-16 セイコーエプソン株式会社 Electronic components
JP2003243934A (en) * 2002-02-19 2003-08-29 Toyo Commun Equip Co Ltd Surface mount type piezoelectric oscillator, its manufacturing method and metallic die
JP4189312B2 (en) * 2003-12-24 2008-12-03 京セラ株式会社 Wiring board
JP3841304B2 (en) * 2004-02-17 2006-11-01 セイコーエプソン株式会社 Piezoelectric oscillator and manufacturing method thereof
JP2006067552A (en) * 2004-07-27 2006-03-09 Seiko Epson Corp Piezoelectric oscillator, manufacturing method therefor and electronic equipment

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