JP2010103349A - 発光装置の製造方法 - Google Patents

発光装置の製造方法 Download PDF

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Publication number
JP2010103349A
JP2010103349A JP2008274254A JP2008274254A JP2010103349A JP 2010103349 A JP2010103349 A JP 2010103349A JP 2008274254 A JP2008274254 A JP 2008274254A JP 2008274254 A JP2008274254 A JP 2008274254A JP 2010103349 A JP2010103349 A JP 2010103349A
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JP
Japan
Prior art keywords
light
wavelength
mixed
primary
light emitting
Prior art date
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Pending
Application number
JP2008274254A
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English (en)
Japanese (ja)
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JP2010103349A5 (https=
Inventor
Reiji Ono
玲司 小野
Tetsuo Komatsu
哲郎 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2008274254A priority Critical patent/JP2010103349A/ja
Priority to US12/867,145 priority patent/US8268644B2/en
Priority to KR1020107018221A priority patent/KR101226777B1/ko
Priority to PCT/JP2009/000544 priority patent/WO2009118985A2/en
Priority to EP09723886.9A priority patent/EP2257999B1/en
Priority to TW098108070A priority patent/TWI445202B/zh
Publication of JP2010103349A publication Critical patent/JP2010103349A/ja
Publication of JP2010103349A5 publication Critical patent/JP2010103349A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
JP2008274254A 2008-03-25 2008-10-24 発光装置の製造方法 Pending JP2010103349A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008274254A JP2010103349A (ja) 2008-10-24 2008-10-24 発光装置の製造方法
US12/867,145 US8268644B2 (en) 2008-03-25 2009-02-10 Light emitting device, and method and apparatus for manufacturing same
KR1020107018221A KR101226777B1 (ko) 2008-03-25 2009-02-10 발광 장치와, 그 제조 방법 및 장치
PCT/JP2009/000544 WO2009118985A2 (en) 2008-03-25 2009-02-10 Light emitting device, and method and apparatus for manufacturing same
EP09723886.9A EP2257999B1 (en) 2008-03-25 2009-02-10 Light emitting device, and method and apparatus for manufacturing same
TW098108070A TWI445202B (zh) 2008-03-25 2009-03-12 製造發光裝置之方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008274254A JP2010103349A (ja) 2008-10-24 2008-10-24 発光装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014006619A Division JP2014064046A (ja) 2014-01-17 2014-01-17 発光装置の製造方法

Publications (2)

Publication Number Publication Date
JP2010103349A true JP2010103349A (ja) 2010-05-06
JP2010103349A5 JP2010103349A5 (https=) 2011-07-21

Family

ID=42293731

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JP2008274254A Pending JP2010103349A (ja) 2008-03-25 2008-10-24 発光装置の製造方法

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JP (1) JP2010103349A (https=)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012032693A1 (ja) * 2010-09-09 2012-03-15 パナソニック株式会社 Ｌｅｄパッケージ製造システムにおける樹脂塗布装置
WO2012032691A1 (ja) * 2010-09-09 2012-03-15 パナソニック株式会社 Ｌｅｄパッケージ製造システム
WO2012032694A1 (ja) * 2010-09-09 2012-03-15 パナソニック株式会社 Ｌｅｄパッケージ製造システムにおける樹脂塗布装置
WO2012032692A1 (ja) * 2010-09-09 2012-03-15 パナソニック株式会社 Ｌｅｄパッケージ製造システム
WO2012036486A3 (ko) * 2010-09-15 2012-06-14 (주)라이타이저코리아 발광다이오드 및 그 제조방법
JP2012174968A (ja) * 2011-02-23 2012-09-10 Mitsubishi Electric Corp 発光装置及び発光装置群及び製造方法
WO2013038611A1 (ja) * 2011-09-16 2013-03-21 パナソニック株式会社 発光素子の製造システムおよび製造方法ならびに発光素子パッケージの製造システムおよび製造方法
WO2013051260A1 (ja) * 2011-10-06 2013-04-11 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
WO2013129071A1 (ja) * 2012-02-27 2013-09-06 シャープ株式会社 発光装置
JP2014003093A (ja) * 2012-06-15 2014-01-09 Sharp Corp 発光装置の製造方法及び色計測装置
US9117980B2 (en) 2012-01-27 2015-08-25 Kabushiki Kaisha Toshiba Light-emitting device including sealing units with different phosphor concentrations

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007053368A (ja) * 2005-08-12 2007-03-01 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 配光均一性の改善された燐光変換ｌｅｄデバイス
JP2007066969A (ja) * 2005-08-29 2007-03-15 Toshiba Lighting & Technology Corp 白色発光ダイオード装置とその製造方法
US20070111344A1 (en) * 2003-06-18 2007-05-17 Tridonic Optoelectronics Gmbh Method for the production of white leds and white led light source
JP2008091458A (ja) * 2006-09-29 2008-04-17 Rohm Co Ltd 照明素子の評価方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070111344A1 (en) * 2003-06-18 2007-05-17 Tridonic Optoelectronics Gmbh Method for the production of white leds and white led light source
JP2007053368A (ja) * 2005-08-12 2007-03-01 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 配光均一性の改善された燐光変換ｌｅｄデバイス
JP2007066969A (ja) * 2005-08-29 2007-03-15 Toshiba Lighting & Technology Corp 白色発光ダイオード装置とその製造方法
JP2008091458A (ja) * 2006-09-29 2008-04-17 Rohm Co Ltd 照明素子の評価方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102782890B (zh) * 2010-09-09 2015-10-21 松下电器产业株式会社 Led封装件制造系统中的树脂涂覆装置
WO2012032691A1 (ja) * 2010-09-09 2012-03-15 パナソニック株式会社 Ｌｅｄパッケージ製造システム
WO2012032694A1 (ja) * 2010-09-09 2012-03-15 パナソニック株式会社 Ｌｅｄパッケージ製造システムにおける樹脂塗布装置
WO2012032692A1 (ja) * 2010-09-09 2012-03-15 パナソニック株式会社 Ｌｅｄパッケージ製造システム
JP2012059917A (ja) * 2010-09-09 2012-03-22 Panasonic Corp Ｌｅｄパッケージ製造システムにおける樹脂塗布装置
JP2012059916A (ja) * 2010-09-09 2012-03-22 Panasonic Corp Ｌｅｄパッケージ製造システム
JP2012059918A (ja) * 2010-09-09 2012-03-22 Panasonic Corp Ｌｅｄパッケージ製造システムにおける樹脂塗布装置
JP2012059915A (ja) * 2010-09-09 2012-03-22 Panasonic Corp Ｌｅｄパッケージ製造システム
WO2012032693A1 (ja) * 2010-09-09 2012-03-15 パナソニック株式会社 Ｌｅｄパッケージ製造システムにおける樹脂塗布装置
US9324906B2 (en) 2010-09-09 2016-04-26 Panasonic Intellectual Property Management Co., Ltd. LED package manufacturing system
CN102782890A (zh) * 2010-09-09 2012-11-14 松下电器产业株式会社 Led 封装件制造系统中的树脂涂覆装置
WO2012036486A3 (ko) * 2010-09-15 2012-06-14 (주)라이타이저코리아 발광다이오드 및 그 제조방법
JP2012174968A (ja) * 2011-02-23 2012-09-10 Mitsubishi Electric Corp 発光装置及び発光装置群及び製造方法
WO2013038611A1 (ja) * 2011-09-16 2013-03-21 パナソニック株式会社 発光素子の製造システムおよび製造方法ならびに発光素子パッケージの製造システムおよび製造方法
WO2013051260A1 (ja) * 2011-10-06 2013-04-11 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
US9117980B2 (en) 2012-01-27 2015-08-25 Kabushiki Kaisha Toshiba Light-emitting device including sealing units with different phosphor concentrations
WO2013129071A1 (ja) * 2012-02-27 2013-09-06 シャープ株式会社 発光装置
JP2014003093A (ja) * 2012-06-15 2014-01-09 Sharp Corp 発光装置の製造方法及び色計測装置

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