JP2010102270A - 感光性樹脂組成物及びそれに用いる感光性樹脂の製造方法 - Google Patents
感光性樹脂組成物及びそれに用いる感光性樹脂の製造方法 Download PDFInfo
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- JP2010102270A JP2010102270A JP2008276084A JP2008276084A JP2010102270A JP 2010102270 A JP2010102270 A JP 2010102270A JP 2008276084 A JP2008276084 A JP 2008276084A JP 2008276084 A JP2008276084 A JP 2008276084A JP 2010102270 A JP2010102270 A JP 2010102270A
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- Prior art keywords
- photosensitive resin
- compound
- reacting
- resin composition
- zirconium
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- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
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- 125000001246 bromo group Chemical group Br* 0.000 description 1
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- 238000009833 condensation Methods 0.000 description 1
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- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
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- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
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- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical group C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- KCNSDMPZCKLTQP-UHFFFAOYSA-N tetraphenylen-1-ol Chemical compound C12=CC=CC=C2C2=CC=CC=C2C2=CC=CC=C2C2=C1C=CC=C2O KCNSDMPZCKLTQP-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/681—Metal alcoholates, phenolates or carboxylates
- C08G59/685—Carboxylates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
- C08F283/105—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule on to unsaturated polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/064—Polymers containing more than one epoxy group per molecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
- C08G59/1466—Acrylic or methacrylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Abstract
【解決手段】(A)三価の有機リン化合物とナフテン酸ジルコニウム及びオクチル酸ジルコニウムの少なくとも1種との存在下で、多官能エポキシ化合物と不飽和一塩基酸とを反応させ、更に多塩基酸無水物を反応させることにより生成したカルボキシル基に不飽和二重結合を有するモノエポキシ化合物及び水溶性モノエポキシ化合物を反応させて得られる感光性樹脂、(B)エポキシ樹脂、(C)光重合開始剤並びに(D)反応性希釈剤を含有することを特徴とする感光性樹脂組成物である。
【選択図】なし
Description
従って、本発明は、クロム化合物を含まず、紫外線露光及び希アルカリ水溶液による現像が可能であって、高感度であり、しかも熱安定性及び現像管理幅が良好で、塗膜が優れた性能を示すソルダーレジストインクとして好適な感光性樹脂組成物を提供することを目的とするものである。
すなわち、本発明は、(A)三価の有機リン化合物とナフテン酸ジルコニウム及びオクチル酸ジルコニウムの少なくとも1種との存在下で、多官能エポキシ化合物と不飽和一塩基酸とを反応させ、更に多塩基酸無水物を反応させることにより生成したカルボキシル基に不飽和二重結合を有するモノエポキシ化合物及び水溶性モノエポキシ化合物を反応させて得られる感光性樹脂、(B)エポキシ樹脂、(C)光重合開始剤並びに(D)反応性希釈剤を含有することを特徴とする感光性樹脂組成物である。
また、本発明は、三価の有機リン化合物とナフテン酸ジルコニウム及びオクチル酸ジルコニウムの少なくとも1種との存在下で、多官能エポキシ化合物と不飽和一塩基酸とを反応させる第一工程と、第一工程で得られた生成物に多塩基酸無水物を反応させる第二工程と、第二工程で得られた生成物に不飽和二重結合を有するモノエポキシ化合物及び水溶性モノエポキシ化合物を反応させる第三工程とを含むことを特徴とする感光性樹脂の製造方法である。
まず、本発明の感光性樹脂組成物について説明する。
本発明の感光性樹脂組成物における(A)成分は、三価の有機リン化合物とナフテン酸ジルコニウム及びオクチル酸ジルコニウムの少なくとも1種との存在下で、多官能エポキシ化合物と不飽和一塩基酸とを反応させ、更に多塩基酸無水物を反応させ、これにより生成したカルボキシル基に不飽和二重結合を有するモノエポキシ化合物及び水溶性モノエポキシ化合物を反応させて得られる感光性樹脂である。
で表される化合物(例えば、ナガセケムテックス株式会社製デナコール(登録商標)EX−145、EX−171等)、下記式(II)
第一工程では、三価の有機リン化合物とナフテン酸ジルコニウム及びオクチル酸ジルコニウムの少なくとも1種との存在下で、多官能エポキシ化合物と不飽和一塩基酸とを公知の方法で反応させる。また、この反応は、反応時の熱重合を防ぐという点から、ハイドロキノン、メチルハイドロキノンなどの公知の重合禁止剤を系内に添加したり、系内に空気を吹き込みながら行うことが好ましい。
第一工程における反応温度は、好ましくは60℃〜150℃であり、反応時間は、好ましくは5時間〜20時間である。多官能エポキシ化合物が液状の場合、無溶剤で反応させることが可能であるが、多官能エポキシ化合物が固形の場合、溶剤中で反応させることが好ましい。ここで使用する溶剤としては、例えば、メチルエチルケトン、シクロヘキサノン等のケトン類、トルエン、キシレン等の芳香族炭化水素類、ジプロピレングリコールジメチルエーテル等のグリコールエーテル類、酢酸エチル、ブチルセロソルブアセテート、カルビトールアセテート、エチルカルビトールアセテート、ブチルカルビトールアセテート、ジプロピレングリコールモノメチルエーテルアセテート等のエステル類、石油エーテル、石油ナフサ、ソルベントナフサ等の石油系溶剤が挙げられる。
攪拌機、気体導入管及び還流管を備えたフラスコ内に、エチルカルビトールアセテート192質量部を仕込み、そこにクレゾールノボラック型エポキシ樹脂(東都化成株式会社製エポトート(登録商標)YDCN704、エポキシ当量206]206質量部(1当量)を溶解させた。更に、アクリル酸72質量部(1.0モル)、ハイドロキノン0.23質量部、トリフェニルホスフィン0.4質量部及びナフテン酸ジルコニウム(金属含有量6質量%)2質量部を仕込み、液面下部の気体導入管から空気を吹き込みながら130℃で10時間反応を続け、酸価0.5mgKOH/gの反応物(エポキシアクリレート)を得た。これにテトラヒドロ無水フタル酸111.03質量部(0.73モル)を加え、120℃で更に2時間反応させ、固形分酸価105.3mgKOH/gの反応物を得た。これにグリシジルメタクリレート22.72質量部(0.16モル)及びデナコール(登録商標)EX−145(ナガセケムテックス株式会社製、エポキシ当量450)9質量部(0.02モル)を加え、120℃で更に3時間反応させ、更に不揮発分が60%になるようにエチルカルビトールアセテートを追加し、固形分酸価73.4mgKOH/gの感光性樹脂Aを得た。
ナフテン酸ジルコニウム(金属含有量6質量%)2質量部の代わりにオクチル酸ジルコニウム(金属含有量12質量)2質量部を用いる以外は、合成例1と同様の操作を行い、感光性樹脂Bを得た。
攪拌機、気体導入管及び還流管を備えたフラスコ内に、エチルカルビトールアセテート192質量部を仕込み、そこにクレゾールノボラック型エポキシ樹脂(東都化成株式会社製エポトート(登録商標)YDCN704、エポキシ当量206]206質量部(1当量)を溶解させた。更に、アクリル酸72質量部(1.0モル)、2、6−ジ−t−ブチル−4−メトキシフェノール2.17質量部、トリフェニルホスフィン0.415質量部を仕込み、液面下部の気体導入管から空気を吹き込みながら130℃で10時間反応を続け、酸価1.0mgKOH/gの反応物(エポキシアクリレート)を得た。これにテトラヒドロ無水フタル酸111.03質量部(0.73モル)及びナフテン酸リチウム(金属含有量3%)0.707質量部を加え、120℃で更に2時間反応させ、固形分酸価105.3mgKOH/gの反応物を得た。これにグリシジルメタクリレート22.72質量部(0.16モル)及びデナコール(登録商標)EX−145(ナガセケムテックス株式会社製、エポキシ当量450)9質量部(0.02モル)を加え、120℃で更に3時間反応させ、更に不揮発分が60%になるようにエチルカルビトールアセテートを追加し、固形分酸価73.4mgKOH/gの感光性樹脂Cを得た。
予備乾燥後の乾燥塗膜に感度測定用ステップタブレット(コダック21段)を設置し、オーク製作所製超高圧水銀灯露光装置を用いて250mJ/cm2で露光し、1%炭酸ナトリウム水溶液を用い、スプレー圧2.0kgf/mm2で60秒間現像を行なった後の露光部分の除去されない部分の段数を測定した。除去されない部分の段数が大きいほど高感度である。
予備乾燥時間を20分、40分、60分又は80分に変更した乾燥塗膜を用い、1%炭酸ナトリウム水溶液を用い、スプレー圧2.0kgf/mm2で現像を行い現像後の塗膜の有無を観察し、下記の基準で評価した。乾燥時間が長くても現像可能なものほど現像管理幅が良好である。
○:現像時間60秒後、目視で塗膜無し。
△:現像時間120秒後、目視で塗膜無し。
×:現像時間120秒後、目視で残膜有り。
硬化塗膜を、JIS C6481に準じて、全面が半田に浸かるように浮かべ、260℃の半田浴に10秒間、3回浮かせ、取り出した後、膨れ又は剥れなどの塗膜の状態を観察し、下記の基準で評価した。
○:外観変化無し。
×:外観変化有り。
硬化塗膜を塩化メチレンに30分浸せきした後の塗膜状態を評価した。
○:外観変化なし
△:外観わずかに変化あり
×:塗膜が剥離したもの
感光性樹脂A〜Cそれぞれの樹脂固形分100質量部に対して、トリメチロールプロパントリアクリレート10質量部を加えて十分混合し、試験管に入れ、120℃で流動性がなくなるまでの時間をゲル化時間として評価した。結果を表3に示した。
Claims (5)
- (A)三価の有機リン化合物とナフテン酸ジルコニウム及びオクチル酸ジルコニウムの少なくとも1種との存在下で、多官能エポキシ化合物と不飽和一塩基酸とを反応させ、更に多塩基酸無水物を反応させることにより生成したカルボキシル基に不飽和二重結合を有するモノエポキシ化合物及び水溶性モノエポキシ化合物を反応させて得られる感光性樹脂、(B)エポキシ樹脂、(C)光重合開始剤並びに(D)反応性希釈剤を含有することを特徴とする感光性樹脂組成物。
- 前記感光性樹脂が、前記カルボキシル基1モルに対して、前記不飽和二重結合を有するモノエポキシ化合物及び前記水溶性モノエポキシ化合物を総量で0.15モル〜0.25モル(但し、水溶性モノエポキシ化合物は0.03モル未満)反応させて得られたものであることを特徴とする請求項1に記載の感光性樹脂組成物。
- 前記ナフテン酸ジルコニウム及びオクチル酸ジルコニウムの少なくとも1種を、質量基準で、三価の有機リン化合物の少なくとも4倍使用することを特徴とする請求項1又は2に記載の感光性樹脂組成物。
- 三価の有機リン化合物とナフテン酸ジルコニウム及びオクチル酸ジルコニウムの少なくとも1種との存在下で、多官能エポキシ化合物と不飽和一塩基酸とを反応させる第一工程と、
第一工程で得られた生成物に多塩基酸無水物を反応させる第二工程と、
第二工程で得られた生成物に不飽和二重結合を有するモノエポキシ化合物及び水溶性モノエポキシ化合物を反応させる第三工程と
を含むことを特徴とする感光性樹脂の製造方法。 - 空気を吹き込みながら前記第一工程における反応を行うことを特徴とする請求項4に記載の感光性樹脂の製造方法。
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CN105086605B (zh) * | 2015-07-13 | 2018-07-27 | 深圳市容大感光科技股份有限公司 | 一种光固化热固化组合物油墨、用途及含有其的线路板 |
CN105086604A (zh) * | 2015-07-13 | 2015-11-25 | 深圳市容大感光科技股份有限公司 | 一种油墨组合物、其应用及印刷电路板 |
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