JP2010080457A5 - - Google Patents

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Publication number
JP2010080457A5
JP2010080457A5 JP2008242066A JP2008242066A JP2010080457A5 JP 2010080457 A5 JP2010080457 A5 JP 2010080457A5 JP 2008242066 A JP2008242066 A JP 2008242066A JP 2008242066 A JP2008242066 A JP 2008242066A JP 2010080457 A5 JP2010080457 A5 JP 2010080457A5
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JP
Japan
Prior art keywords
resin layer
lead
opening
resin
solder
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JP2008242066A
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English (en)
Japanese (ja)
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JP5079646B2 (ja
JP2010080457A (ja
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Priority to JP2008242066A priority Critical patent/JP5079646B2/ja
Priority claimed from JP2008242066A external-priority patent/JP5079646B2/ja
Priority to US12/512,277 priority patent/US8120166B2/en
Publication of JP2010080457A publication Critical patent/JP2010080457A/ja
Publication of JP2010080457A5 publication Critical patent/JP2010080457A5/ja
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Publication of JP5079646B2 publication Critical patent/JP5079646B2/ja
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JP2008242066A 2008-08-26 2008-09-22 半導体パッケージ及びその製造方法と半導体装置 Active JP5079646B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008242066A JP5079646B2 (ja) 2008-08-26 2008-09-22 半導体パッケージ及びその製造方法と半導体装置
US12/512,277 US8120166B2 (en) 2008-08-26 2009-07-30 Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008216325 2008-08-26
JP2008216325 2008-08-26
JP2008242066A JP5079646B2 (ja) 2008-08-26 2008-09-22 半導体パッケージ及びその製造方法と半導体装置

Publications (3)

Publication Number Publication Date
JP2010080457A JP2010080457A (ja) 2010-04-08
JP2010080457A5 true JP2010080457A5 (enExample) 2011-08-18
JP5079646B2 JP5079646B2 (ja) 2012-11-21

Family

ID=41724089

Family Applications (1)

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JP2008242066A Active JP5079646B2 (ja) 2008-08-26 2008-09-22 半導体パッケージ及びその製造方法と半導体装置

Country Status (2)

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US (1) US8120166B2 (enExample)
JP (1) JP5079646B2 (enExample)

Families Citing this family (38)

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US7688237B2 (en) * 2006-12-21 2010-03-30 Broadcom Corporation Apparatus and method for analog-to-digital converter calibration
KR20110058938A (ko) * 2009-11-27 2011-06-02 삼성전기주식회사 반도체 패키지용 리드핀 및 반도체 패키지
JP5590985B2 (ja) * 2010-06-21 2014-09-17 新光電気工業株式会社 半導体装置及びその製造方法
JP2012009586A (ja) * 2010-06-24 2012-01-12 Shinko Electric Ind Co Ltd 配線基板、半導体装置及び配線基板の製造方法
JP5548062B2 (ja) * 2010-08-11 2014-07-16 株式会社日立製作所 配管用モジュール向け仮設部材の施工方法及び配管モジュールの搬送方法
JP2012164965A (ja) 2011-01-21 2012-08-30 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
JP2012169591A (ja) * 2011-01-24 2012-09-06 Ngk Spark Plug Co Ltd 多層配線基板
US8952540B2 (en) 2011-06-30 2015-02-10 Intel Corporation In situ-built pin-grid arrays for coreless substrates, and methods of making same
US8872358B2 (en) * 2012-02-07 2014-10-28 Shin-Etsu Chemical Co., Ltd. Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
US9354748B2 (en) 2012-02-13 2016-05-31 Microsoft Technology Licensing, Llc Optical stylus interaction
USRE48963E1 (en) 2012-03-02 2022-03-08 Microsoft Technology Licensing, Llc Connection device for computing devices
US9064654B2 (en) 2012-03-02 2015-06-23 Microsoft Technology Licensing, Llc Method of manufacturing an input device
US9360893B2 (en) 2012-03-02 2016-06-07 Microsoft Technology Licensing, Llc Input device writing surface
US9870066B2 (en) * 2012-03-02 2018-01-16 Microsoft Technology Licensing, Llc Method of manufacturing an input device
US9426905B2 (en) 2012-03-02 2016-08-23 Microsoft Technology Licensing, Llc Connection device for computing devices
US9075566B2 (en) 2012-03-02 2015-07-07 Microsoft Technoogy Licensing, LLC Flexible hinge spine
US8935774B2 (en) 2012-03-02 2015-01-13 Microsoft Corporation Accessory device authentication
US8873227B2 (en) 2012-03-02 2014-10-28 Microsoft Corporation Flexible hinge support layer
US9460029B2 (en) 2012-03-02 2016-10-04 Microsoft Technology Licensing, Llc Pressure sensitive keys
US20130300590A1 (en) 2012-05-14 2013-11-14 Paul Henry Dietz Audio Feedback
US10031556B2 (en) 2012-06-08 2018-07-24 Microsoft Technology Licensing, Llc User experience adaptation
US9019615B2 (en) 2012-06-12 2015-04-28 Microsoft Technology Licensing, Llc Wide field-of-view virtual image projector
US9073123B2 (en) 2012-06-13 2015-07-07 Microsoft Technology Licensing, Llc Housing vents
US8964379B2 (en) 2012-08-20 2015-02-24 Microsoft Corporation Switchable magnetic lock
US8654030B1 (en) 2012-10-16 2014-02-18 Microsoft Corporation Antenna placement
WO2014059624A1 (en) 2012-10-17 2014-04-24 Microsoft Corporation Metal alloy injection molding protrusions
WO2014059618A1 (en) 2012-10-17 2014-04-24 Microsoft Corporation Graphic formation via material ablation
EP2908971B1 (en) 2012-10-17 2018-01-03 Microsoft Technology Licensing, LLC Metal alloy injection molding overflows
JP2014103176A (ja) * 2012-11-16 2014-06-05 Shin Etsu Chem Co Ltd 支持基材付封止材、封止後半導体素子搭載基板、封止後半導体素子形成ウエハ、半導体装置、及び半導体装置の製造方法
US8946884B2 (en) * 2013-03-08 2015-02-03 Xilinx, Inc. Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product
US9304549B2 (en) 2013-03-28 2016-04-05 Microsoft Technology Licensing, Llc Hinge mechanism for rotatable component attachment
US10120420B2 (en) 2014-03-21 2018-11-06 Microsoft Technology Licensing, Llc Lockable display and techniques enabling use of lockable displays
US10324733B2 (en) 2014-07-30 2019-06-18 Microsoft Technology Licensing, Llc Shutdown notifications
JP6358431B2 (ja) * 2014-08-25 2018-07-18 新光電気工業株式会社 電子部品装置及びその製造方法
US9424048B2 (en) 2014-09-15 2016-08-23 Microsoft Technology Licensing, Llc Inductive peripheral retention device
JP7107120B2 (ja) * 2018-09-14 2022-07-27 富士電機株式会社 半導体装置、半導体装置の製造方法
US11427466B2 (en) * 2019-07-19 2022-08-30 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same
EP3859776A1 (en) * 2020-01-31 2021-08-04 Infineon Technologies AG Power semiconductor device and method for fabricating a power semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01100958A (ja) 1987-10-14 1989-04-19 Hitachi Ltd 樹脂被覆セラミック配線基板
JP2000058736A (ja) * 1998-08-07 2000-02-25 Sumitomo Kinzoku Electro Device:Kk 樹脂基板へのピン接続方法
JP2001148441A (ja) 1999-11-19 2001-05-29 Shinko Electric Ind Co Ltd 半導体パッケージ及びその製造方法
JP2006216631A (ja) * 2005-02-02 2006-08-17 Ngk Spark Plug Co Ltd 配線基板およびその製造方法
JP4993754B2 (ja) * 2008-02-22 2012-08-08 新光電気工業株式会社 Ｐｇａ型配線基板及びその製造方法

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