JP2010062175A5 - - Google Patents
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- Publication number
- JP2010062175A5 JP2010062175A5 JP2008223171A JP2008223171A JP2010062175A5 JP 2010062175 A5 JP2010062175 A5 JP 2010062175A5 JP 2008223171 A JP2008223171 A JP 2008223171A JP 2008223171 A JP2008223171 A JP 2008223171A JP 2010062175 A5 JP2010062175 A5 JP 2010062175A5
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- oxide film
- removing step
- treatment liquid
- connection pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 6
- 239000007788 liquid Substances 0.000 claims 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 4
- 239000005751 Copper oxide Substances 0.000 claims 4
- 229910000431 copper oxide Inorganic materials 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000001312 dry etching Methods 0.000 claims 2
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims 2
- 229960002218 sodium chlorite Drugs 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008223171A JP2010062175A (ja) | 2008-09-01 | 2008-09-01 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008223171A JP2010062175A (ja) | 2008-09-01 | 2008-09-01 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010062175A JP2010062175A (ja) | 2010-03-18 |
| JP2010062175A5 true JP2010062175A5 (cg-RX-API-DMAC10.html) | 2011-05-19 |
Family
ID=42188701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008223171A Pending JP2010062175A (ja) | 2008-09-01 | 2008-09-01 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010062175A (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012114148A (ja) * | 2010-11-22 | 2012-06-14 | Fujitsu Semiconductor Ltd | 半導体装置の製造方法 |
| US9633924B1 (en) | 2015-12-16 | 2017-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and method for forming the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5953459B2 (ja) * | 1980-11-08 | 1984-12-25 | 松下電工株式会社 | 太陽熱吸収体 |
| JPH05175648A (ja) * | 1991-12-24 | 1993-07-13 | Matsushita Electric Works Ltd | 回路板の銅回路の処理方法 |
| JP3440070B2 (ja) * | 2000-07-13 | 2003-08-25 | 沖電気工業株式会社 | ウェハー及びウェハーの製造方法 |
| JP2004022699A (ja) * | 2002-06-14 | 2004-01-22 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| JP2006270031A (ja) * | 2005-02-25 | 2006-10-05 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
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2008
- 2008-09-01 JP JP2008223171A patent/JP2010062175A/ja active Pending