JP2010016415A - 基板を支持するための方法及び装置 - Google Patents
基板を支持するための方法及び装置 Download PDFInfo
- Publication number
- JP2010016415A JP2010016415A JP2009244616A JP2009244616A JP2010016415A JP 2010016415 A JP2010016415 A JP 2010016415A JP 2009244616 A JP2009244616 A JP 2009244616A JP 2009244616 A JP2009244616 A JP 2009244616A JP 2010016415 A JP2010016415 A JP 2010016415A
- Authority
- JP
- Japan
- Prior art keywords
- lift pin
- lift
- susceptor
- substrate
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】
基板を持ち上げる間、リフトピンの垂直の向きを維持する摩擦プレート及び/又は磁界と係合する軸受面を有する垂直に整列したリフトピンを含んでいる。ある実施態様においては、磁界及び/又は重量を、或いは又は更に、用いることができる。
【選択図】 図2
Description
Claims (15)
- 第一端が基板と該第一端に対向する下軸受面を支持するように適合したリフトピンと、
該下軸受面と係合するように適合したプレートと、
を備え、該リフトピンの垂直の向きを、該プレートと係合している該下軸受面によって該基板を持ち上げる間、維持することができる装置。 - 該プレートが摩擦プレート、または、磁気的に敏感なプレートであり、該リフトピンが磁石を含んでいる、請求項1に記載の装置。
- 該リフトピンに磁界を適用するように適合した磁界生成手段を更に含み、該リフトピンが磁気的に敏感な材料を含んでいる、請求項1に記載の装置。
- 該リフトピンに結合した重り、または、該リフトピンに結合した磁石を更に含む、請求項1に記載の装置。
- 該リフトピンの長さに沿って単一環状点で該リフトピンとわずかに接触しているブッシュによって該リフトピンがサセプタを通ってガイドされる、請求項1に記載の装置。
- 接触の該単一環状点が該サセプタの上面に接近した該ブッシュに配置されている、請求項5に記載の装置。
- 該リフトピンの下端によってリフトピンの垂直の向きを制御するステップと、
該リフトピンに加えた下向きの力によって該リフトピンの結合を防止するステップと、
を含む方法。 - 処理チャンバと、
処理中、該処理チャンバ内に基板を支持するように適合したサセプタであって、該サセプタが複数のボアを含んでいる、前記サセプタと、
装填/非装填中、該処理チャンバ内に基板を支持するように適合した複数のリフトピンであって、各リフトピンが該複数のボアの異なる1つを通って垂直にすべるように配置されている、前記リフトピンと、
各磁石が該リフトピンの異なる1つに結合した、複数の磁石と、
を備えたシステム。 - 処理チャンバと、
処理中、該処理チャンバ内に基板を支持するためのサセプタであって、該サセプタが複数のボアを含んでいる、前記サセプタと、
装填/非装填中、該処理チャンバ内に基板を支持するための複数のリフトピンであって、各リフトピンが該複数のボアの異なる1つを通って垂直にすべるように配置されている、前記リフトピンと、
各磁石が該リフトピンの異なる1つに結合している複数の磁石と、
を含むシステムを準備するステップと、
該複数のリフトピン上に該処理チャンバへ基板を装填するステップと、
該サセプタを上げて該基板を該リフトピンから持ち上げるステップと、
該基板を処理するステップと、
該サセプタを下げて該リフトピンを上げると共に該基板を該サセプタから持ち上げるステップと、
該基板を該チャンバから取り外すステップと、
を含み、該基板が1つ以上のフラットパネルディスプレイ用の基板である、方法。 - 該リフトピンの垂直の向きを維持するとともに該リフトピンがサセプタに結合するのを防止するように磁気リフトピンの下のチャンバ壁内に配置されるように適合した磁気的に敏感なプレート、
を含む装置。 - 該リフトピンがサセプタに結合するのを防止するとともに該リフトピンの垂直の向きを維持するように磁気的に敏感なリフトピンの下のチャンバ壁内に配置されるように適合した磁気プレート、
を含む装置。 - 磁気リフトピンの下のチャンバ壁内に配置された磁気的に敏感なプレートを保護するように適合したカバー、
を含み、該カバーが該磁気的に敏感なプレートに向かって該リフトピンを偏らせることができるように適合している、装置。 - チャンバ壁に組込まれるように適合し、磁気リフトピンの下の該チャンバ壁内に配置された磁気的に敏感なプレートを支持するように更に適合したプラグ、
を含む装置。 - 磁気リフトピンと磁気的に敏感なプレートを用いるシステムにおいて、
サセプタ内のボアに組込まれるとともに該サセプタが上下するにつれて該磁気リフトピンをガイドして、該リフトピンが該サセプタに結合するのを防止するように適合したブッシュ、
を含む装置。 - リフトピンに結合するように適合した磁気キャップであって、該磁気キャップが、該リフトピンがサセプタに結合するのを防止するとともに該リフトピンの垂直の向きを維持するように適合している、前記磁気キャップ、
を含む装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57586904P | 2004-06-01 | 2004-06-01 | |
US60/575869 | 2004-06-01 | ||
US58729404P | 2004-07-12 | 2004-07-12 | |
US60/587294 | 2004-07-12 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005161844A Division JP4484769B2 (ja) | 2004-06-01 | 2005-06-01 | 基板を支持するための装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010016415A true JP2010016415A (ja) | 2010-01-21 |
JP4859971B2 JP4859971B2 (ja) | 2012-01-25 |
Family
ID=35499784
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005161844A Active JP4484769B2 (ja) | 2004-06-01 | 2005-06-01 | 基板を支持するための装置 |
JP2009244616A Expired - Fee Related JP4859971B2 (ja) | 2004-06-01 | 2009-10-23 | 基板を支持するための方法及び装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005161844A Active JP4484769B2 (ja) | 2004-06-01 | 2005-06-01 | 基板を支持するための装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8365682B2 (ja) |
JP (2) | JP4484769B2 (ja) |
KR (1) | KR100725592B1 (ja) |
TW (1) | TWI307133B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016154196A (ja) * | 2015-02-20 | 2016-08-25 | 株式会社Sumco | エピタキシャル成長装置及びサセプタサポートシャフト |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5073230B2 (ja) * | 2006-06-20 | 2012-11-14 | 東京応化工業株式会社 | 支持ピン |
US20090314211A1 (en) * | 2008-06-24 | 2009-12-24 | Applied Materials, Inc. | Big foot lift pin |
JP5155790B2 (ja) * | 2008-09-16 | 2013-03-06 | 東京エレクトロン株式会社 | 基板載置台およびそれを用いた基板処理装置 |
KR101146150B1 (ko) * | 2009-12-28 | 2012-05-16 | 엘아이지에이디피 주식회사 | 기판처리장치 |
KR101146149B1 (ko) | 2009-12-28 | 2012-05-16 | 엘아이지에이디피 주식회사 | 리프트 핀 모듈 |
KR20130107964A (ko) * | 2012-03-23 | 2013-10-02 | 에이에스엠 아이피 홀딩 비.브이. | 증착 장치 |
US10535549B2 (en) * | 2017-10-27 | 2020-01-14 | Applied Materials, Inc. | Lift pin holder |
KR102640172B1 (ko) | 2019-07-03 | 2024-02-23 | 삼성전자주식회사 | 기판 처리 장치 및 이의 구동 방법 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52121571A (en) * | 1976-04-02 | 1977-10-13 | Kuraray Co | Naturallleatherrlike textile with excellent hand |
JPH06318630A (ja) * | 1993-02-26 | 1994-11-15 | Applied Materials Inc | サセプタ駆動及びウエハ変位機構 |
JPH1092916A (ja) * | 1996-07-24 | 1998-04-10 | Applied Materials Inc | 処理チャンバのリフトピン及びサポートピン装置 |
WO1998032571A1 (fr) * | 1997-01-29 | 1998-07-30 | Kabushiki Kaisha Yaskawa Denki | Dispositif d'etalonnage de robot et methode afferente |
JP2000294620A (ja) * | 1999-04-09 | 2000-10-20 | Nippon Asm Kk | 半導体処理装置 |
JP2000323556A (ja) * | 1999-05-13 | 2000-11-24 | Komatsu Electronic Metals Co Ltd | エピタキシャルウェーハ製造装置 |
JP2001015574A (ja) * | 1999-07-01 | 2001-01-19 | Matsushita Electronics Industry Corp | ウェハ搬送装置 |
JP2002231794A (ja) * | 2001-02-02 | 2002-08-16 | Tokyo Electron Ltd | 被処理体の載置機構 |
JP2003100855A (ja) * | 2001-09-27 | 2003-04-04 | Shin Etsu Handotai Co Ltd | シリコン単結晶ウェーハ処理装置、シリコン単結晶ウェーハおよびシリコンエピタキシャルウェーハの製造方法 |
JP2003124297A (ja) * | 2001-10-19 | 2003-04-25 | Applied Materials Inc | ウエハリフト機構 |
JP2003197719A (ja) * | 2001-12-21 | 2003-07-11 | Komatsu Electronic Metals Co Ltd | 半導体製造装置および基板支持構造 |
JP2004063865A (ja) * | 2002-07-30 | 2004-02-26 | Shin Etsu Handotai Co Ltd | サセプタ、気相成長装置およびエピタキシャルウェーハの製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3890710A (en) * | 1974-04-12 | 1975-06-24 | Charles G Jaeger | Dental dowel pin positioning and aligning apparatus |
US4790258A (en) * | 1987-04-03 | 1988-12-13 | Tegal Corporation | Magnetically coupled wafer lift pins |
ES2123804T3 (es) * | 1993-08-04 | 1999-01-16 | Care Tec Gmbh | Dispositivo para la representacion de relieves transitorios. |
JP3028462B2 (ja) * | 1995-05-12 | 2000-04-04 | 東京エレクトロン株式会社 | 熱処理装置 |
JP3773561B2 (ja) | 1995-05-19 | 2006-05-10 | 富士通株式会社 | ウェハ処理装置 |
JPH09205130A (ja) * | 1996-01-17 | 1997-08-05 | Applied Materials Inc | ウェハ支持装置 |
US5848670A (en) * | 1996-12-04 | 1998-12-15 | Applied Materials, Inc. | Lift pin guidance apparatus |
US6190113B1 (en) * | 1997-04-30 | 2001-02-20 | Applied Materials, Inc. | Quartz pin lift for single wafer chemical vapor deposition/etch process chamber |
JP3234576B2 (ja) * | 1998-10-30 | 2001-12-04 | アプライド マテリアルズ インコーポレイテッド | 半導体製造装置におけるウェハ支持装置 |
US6149365A (en) * | 1999-09-21 | 2000-11-21 | Applied Komatsu Technology, Inc. | Support frame for substrates |
US6572708B2 (en) * | 2000-02-28 | 2003-06-03 | Applied Materials Inc. | Semiconductor wafer support lift-pin assembly |
US6419438B1 (en) * | 2000-11-28 | 2002-07-16 | Asyst Technologies, Inc. | FIMS interface without alignment pins |
KR100459788B1 (ko) * | 2002-01-14 | 2004-12-04 | 주성엔지니어링(주) | 2단 웨이퍼 리프트 핀 |
KR100446792B1 (ko) | 2002-01-14 | 2004-09-04 | 주성엔지니어링(주) | 웨이퍼의 슬라이딩 방지를 위한 상하 수직운동 가능한가이드 핀 |
US20030178145A1 (en) * | 2002-03-25 | 2003-09-25 | Applied Materials, Inc. | Closed hole edge lift pin and susceptor for wafer process chambers |
US6887317B2 (en) * | 2002-09-10 | 2005-05-03 | Applied Materials, Inc. | Reduced friction lift pin |
JP2005015574A (ja) | 2003-06-24 | 2005-01-20 | Asahi Kasei Chemicals Corp | 樹脂製配管 |
JP2005197380A (ja) | 2004-01-06 | 2005-07-21 | Sumitomo Mitsubishi Silicon Corp | ウェーハ支持装置 |
KR200361557Y1 (ko) | 2004-04-13 | 2004-09-14 | 주식회사 눅스 | 용도가 다양한 조명등기구 |
US7638003B2 (en) * | 2006-01-12 | 2009-12-29 | Asm Japan K.K. | Semiconductor processing apparatus with lift pin structure |
-
2005
- 2005-05-31 US US11/140,777 patent/US8365682B2/en not_active Expired - Fee Related
- 2005-06-01 KR KR1020050046710A patent/KR100725592B1/ko active IP Right Grant
- 2005-06-01 TW TW094118030A patent/TWI307133B/zh not_active IP Right Cessation
- 2005-06-01 JP JP2005161844A patent/JP4484769B2/ja active Active
-
2009
- 2009-10-23 JP JP2009244616A patent/JP4859971B2/ja not_active Expired - Fee Related
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52121571A (en) * | 1976-04-02 | 1977-10-13 | Kuraray Co | Naturallleatherrlike textile with excellent hand |
JPH06318630A (ja) * | 1993-02-26 | 1994-11-15 | Applied Materials Inc | サセプタ駆動及びウエハ変位機構 |
JPH1092916A (ja) * | 1996-07-24 | 1998-04-10 | Applied Materials Inc | 処理チャンバのリフトピン及びサポートピン装置 |
WO1998032571A1 (fr) * | 1997-01-29 | 1998-07-30 | Kabushiki Kaisha Yaskawa Denki | Dispositif d'etalonnage de robot et methode afferente |
JP2000294620A (ja) * | 1999-04-09 | 2000-10-20 | Nippon Asm Kk | 半導体処理装置 |
JP2000323556A (ja) * | 1999-05-13 | 2000-11-24 | Komatsu Electronic Metals Co Ltd | エピタキシャルウェーハ製造装置 |
JP2001015574A (ja) * | 1999-07-01 | 2001-01-19 | Matsushita Electronics Industry Corp | ウェハ搬送装置 |
JP2002231794A (ja) * | 2001-02-02 | 2002-08-16 | Tokyo Electron Ltd | 被処理体の載置機構 |
JP2003100855A (ja) * | 2001-09-27 | 2003-04-04 | Shin Etsu Handotai Co Ltd | シリコン単結晶ウェーハ処理装置、シリコン単結晶ウェーハおよびシリコンエピタキシャルウェーハの製造方法 |
JP2003124297A (ja) * | 2001-10-19 | 2003-04-25 | Applied Materials Inc | ウエハリフト機構 |
JP2003197719A (ja) * | 2001-12-21 | 2003-07-11 | Komatsu Electronic Metals Co Ltd | 半導体製造装置および基板支持構造 |
JP2004063865A (ja) * | 2002-07-30 | 2004-02-26 | Shin Etsu Handotai Co Ltd | サセプタ、気相成長装置およびエピタキシャルウェーハの製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016154196A (ja) * | 2015-02-20 | 2016-08-25 | 株式会社Sumco | エピタキシャル成長装置及びサセプタサポートシャフト |
Also Published As
Publication number | Publication date |
---|---|
TW200613814A (en) | 2006-05-01 |
US20050265818A1 (en) | 2005-12-01 |
TWI307133B (en) | 2009-03-01 |
JP2005347751A (ja) | 2005-12-15 |
JP4859971B2 (ja) | 2012-01-25 |
KR20060046373A (ko) | 2006-05-17 |
KR100725592B1 (ko) | 2007-06-08 |
US8365682B2 (en) | 2013-02-05 |
JP4484769B2 (ja) | 2010-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4859971B2 (ja) | 基板を支持するための方法及び装置 | |
JP6316402B2 (ja) | 基板スタックを取り扱うための、収容システム及び装置及び方法 | |
JP4781893B2 (ja) | 磁気マスクホルダー | |
KR20210143921A (ko) | 마이크로 발광 다이오드 표시패널 및 이의 제조방법 | |
US20150010381A1 (en) | Wafer processing chamber and method for transferring wafer in the same | |
JP2013229552A (ja) | 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法 | |
JP2006057185A (ja) | 蒸着システム用の基板ホルダ | |
US20220016748A1 (en) | Suction device and suction disc | |
JP2017220561A (ja) | ノズルユニット、およびノズルユニットを備える雰囲気置換装置、ならびに雰囲気置換方法 | |
KR20160032501A (ko) | 기판안착장치 및 이를 포함한 기판처리장치 | |
KR20190077973A (ko) | 터치 플레이트와 일체로 되고 스위칭 마그넷을 구비한 마그넷 플레이트 및 이를 적용한 얼라인먼트 시스템 | |
KR101652852B1 (ko) | 기판안착장치 및 이를 포함하는 기판처리장치 | |
US20030075387A1 (en) | Wafer loading device | |
CN110931410A (zh) | 一种用于反应室的晶片传动装置和传动方法 | |
KR20050091919A (ko) | 자석을 이용한 마스크의 고정장치 | |
KR101316296B1 (ko) | 자석 척 | |
CN1725464B (zh) | 支承基板的方法和装置 | |
US20090045550A1 (en) | Transcription mold fixation apparatus and substrate removing method | |
KR101570073B1 (ko) | 기판 이송캐리어 및 그를 이용하는 기판 이송장치 | |
KR100468792B1 (ko) | 기판과 쉐도우 마스크 고정장치 | |
KR102669029B1 (ko) | 리프트핀 어셈블리 | |
JP2018085539A (ja) | 基板スタックを取り扱うための、収容システム及び装置及び方法 | |
JP2006137535A (ja) | 吊上げ電磁石装置 | |
KR102009564B1 (ko) | 스위칭 마그넷의 자력을 이용한 기판홀딩장치 | |
CN1725464A (zh) | 支承基板的方法和装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20091026 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20101130 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101210 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110315 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110614 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110617 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110713 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110714 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110720 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20111025 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111101 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4859971 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141111 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |