JP2010011736A - 電池保護装置 - Google Patents
電池保護装置 Download PDFInfo
- Publication number
- JP2010011736A JP2010011736A JP2009233079A JP2009233079A JP2010011736A JP 2010011736 A JP2010011736 A JP 2010011736A JP 2009233079 A JP2009233079 A JP 2009233079A JP 2009233079 A JP2009233079 A JP 2009233079A JP 2010011736 A JP2010011736 A JP 2010011736A
- Authority
- JP
- Japan
- Prior art keywords
- fet
- protection device
- battery
- charging
- battery protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Protection Of Static Devices (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
- Secondary Cells (AREA)
Abstract
【解決手段】 リチウムイオン電池における過充電及び過放電を防止するための電池保護装置であり、充電制御用スイッチとしてのFET(充電用FET)1と、放電制御用スイッチとしてのFET(放電用FET)2と、保護IC3とを樹脂4にて封止し、1パッケージ化してなる。
【選択図】 図1
Description
2 放電用FET
3 保護IC
4 封止樹脂
5 リードフレーム
Claims (6)
- 二次電池における過充電及び過放電を防止するための1パッケージ化された電池保護装置であって、
前記二次電池に接続され、ドレインとゲート電極とソース電極とを有する充電用FETと、
前記二次電池に接続され、ドレインとゲート電極とソース電極とを有する放電用FETと、
前記二次電池の両端電圧に基づき前記充電用FETと前記放電用FETとを制御して前記二次電池の過充電及び過放電を防ぐ保護ICと、
外部導出配線を備えたマウント手段とを備え、
前記マウント手段には、前記充電用FETと前記放電用FETと前記保護ICとがマウントされ、
前記マウント手段上で、前記充電用FETのドレインと前記放電用FETのドレインとが電気的に接続され、
前記マウント手段上で、前記充電用FETのゲート電極と前記放電用FETのゲート電極は、各々前記保護ICと電気的に接続されていることを特徴とする電池保護装置。 - 前記充電用FETのソース電極と前記放電用FETのソース電極は、各々前記マウント手段の前記外部導出配線と電気的に接続されていることを特徴とする請求項1記載の電池保護装置。
- 前記マウント手段上で、前記充電用FETのドレインと前記放電用FETのドレインは、前記保護ICの裏面と電気的に絶縁されていることを特徴とする請求項1乃至2記載の電池保護装置。
- 前記マウント手段は、リードフレームであることを特徴とする請求項1乃至3記載の電池保護装置。
- 前記電池保護装置は樹脂封止によって1パッケージ化されたことを特徴とする請求項1乃至4記載の電池保護装置。
- 前記二次電池はリチウムイオン電池であることを特徴とする請求項1乃至5記載の電池保護装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009233079A JP4775676B2 (ja) | 1999-10-29 | 2009-10-07 | 電池保護装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30909999A JP4617524B2 (ja) | 1999-10-29 | 1999-10-29 | 電池保護装置 |
JP2009233079A JP4775676B2 (ja) | 1999-10-29 | 2009-10-07 | 電池保護装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30909999A Division JP4617524B2 (ja) | 1999-10-29 | 1999-10-29 | 電池保護装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010011736A true JP2010011736A (ja) | 2010-01-14 |
JP4775676B2 JP4775676B2 (ja) | 2011-09-21 |
Family
ID=17988885
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30909999A Expired - Lifetime JP4617524B2 (ja) | 1999-10-29 | 1999-10-29 | 電池保護装置 |
JP2009233079A Expired - Fee Related JP4775676B2 (ja) | 1999-10-29 | 2009-10-07 | 電池保護装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30909999A Expired - Lifetime JP4617524B2 (ja) | 1999-10-29 | 1999-10-29 | 電池保護装置 |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP4617524B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170082460A (ko) | 2016-01-06 | 2017-07-14 | 유비크 세미컨덕터 코프. | 반도체 장치 및 이를 사용하는 휴대기기 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4882235B2 (ja) * | 2005-01-27 | 2012-02-22 | ミツミ電機株式会社 | 電池保護用モジュール |
US7868432B2 (en) * | 2006-02-13 | 2011-01-11 | Fairchild Semiconductor Corporation | Multi-chip module for battery power control |
KR100943594B1 (ko) * | 2006-03-27 | 2010-02-24 | 삼성에스디아이 주식회사 | 보호 회로 모듈 및 이를 이용한 전지 팩 |
JP5165543B2 (ja) * | 2008-11-28 | 2013-03-21 | 株式会社日立超エル・エス・アイ・システムズ | 電池監視装置と電池監視用半導体装置 |
KR101093907B1 (ko) | 2009-11-26 | 2011-12-13 | 삼성에스디아이 주식회사 | 배터리 셀 보호용 반도체 장치, 이를 갖는 보호 회로 모듈 및 배터리 팩 |
KR101054888B1 (ko) * | 2009-12-21 | 2011-08-05 | 주식회사 아이티엠반도체 | 배터리 보호회로의 통합칩 배치구조 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08190936A (ja) * | 1995-01-12 | 1996-07-23 | Fuji Photo Film Co Ltd | 二次電池の充放電保護装置 |
JPH09182282A (ja) * | 1995-12-27 | 1997-07-11 | Hitachi Microcomput Syst Ltd | 二次電池保護回路 |
JPH11215716A (ja) * | 1998-01-20 | 1999-08-06 | Matsushita Electric Ind Co Ltd | 電池管理装置,電池パック及び電子機器 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09117068A (ja) * | 1995-10-18 | 1997-05-02 | Nemic Lambda Kk | 充放電パワーモジュール |
-
1999
- 1999-10-29 JP JP30909999A patent/JP4617524B2/ja not_active Expired - Lifetime
-
2009
- 2009-10-07 JP JP2009233079A patent/JP4775676B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08190936A (ja) * | 1995-01-12 | 1996-07-23 | Fuji Photo Film Co Ltd | 二次電池の充放電保護装置 |
JPH09182282A (ja) * | 1995-12-27 | 1997-07-11 | Hitachi Microcomput Syst Ltd | 二次電池保護回路 |
JPH11215716A (ja) * | 1998-01-20 | 1999-08-06 | Matsushita Electric Ind Co Ltd | 電池管理装置,電池パック及び電子機器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170082460A (ko) | 2016-01-06 | 2017-07-14 | 유비크 세미컨덕터 코프. | 반도체 장치 및 이를 사용하는 휴대기기 |
Also Published As
Publication number | Publication date |
---|---|
JP2001135361A (ja) | 2001-05-18 |
JP4617524B2 (ja) | 2011-01-26 |
JP4775676B2 (ja) | 2011-09-21 |
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