KR101093907B1 - 배터리 셀 보호용 반도체 장치, 이를 갖는 보호 회로 모듈 및 배터리 팩 - Google Patents
배터리 셀 보호용 반도체 장치, 이를 갖는 보호 회로 모듈 및 배터리 팩 Download PDFInfo
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- KR101093907B1 KR101093907B1 KR1020090115144A KR20090115144A KR101093907B1 KR 101093907 B1 KR101093907 B1 KR 101093907B1 KR 1020090115144 A KR1020090115144 A KR 1020090115144A KR 20090115144 A KR20090115144 A KR 20090115144A KR 101093907 B1 KR101093907 B1 KR 101093907B1
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- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
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- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
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- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/732—Location after the connecting process
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- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
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- H01L2924/181—Encapsulation
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Abstract
Description
Claims (20)
- 배터리 셀의 전압을 감지하고 제어 신호를 출력하는 집적 회로;상기 집적 회로와 전기적으로 연결되고, 상기 집적 회로의 출력신호에 따라 충전 경로를 차단하는 충전 스위치;상기 집적 회로와 전기적으로 연결되는 적어도 하나의 제 1 리드;상기 충전 스위치와 전기적으로 연결된 제 2 리드; 및상기 집적 회로, 충전 스위치, 제 1 리드 및 제 2 리드를 봉지하는 봉지부를 포함하고,상기 제 1 리드는상기 직접 회로에 전원을 공급하는 제 1 서브리드 및상기 배터리 셀의 전압을 감지하는 제 2 서브리드를 포함하여 이루어진 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항에 있어서,상기 집적 회로와 상기 충전스위치는 상호간 적어도 하나의 도전성 와이어로 연결된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항에 있어서,상기 집적 회로와 상기 제 1 리드는 상호간 적어도 하나의 도전성 와이어로 연결된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항에 있어서,상기 충전 스위치와 상기 제 2 리드는 상호간 적어도 하나의 도전성 와이어 로 연결된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항에 있어서,상기 제 1 리드 및 제 2 리드는 봉지부의 외부로 돌출된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 삭제
- 제 1 항에 있어서,상기 제 1 서브리드는 상기 봉지부의 일측에 배열되고,상기 제 2 서브리드 및 제 2 리드는 상기 제 1 서브리드와 대향되는 봉지부의 타측에 일렬로 배열되는 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항에 있어서,상기 제 1 서브리드는 배터리 단자와 팩 단자 사이에 전기적으로 연결된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항에 있어서,상기 제 2 서브리드는 팩 단자와 전기적으로 연결된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치
- 제 1 항에 있어서,상기 제 2 리드는 팩단자와 전기적으로 연결된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항에 있어서,상기 봉지부는 제 1 탑재판을 포함하고,상기 제 1 탑재판에는 상기 집적 회로가 탑재된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 11 항에 있어서,상기 제 1 탑재판과 상기 집적 회로는 절연성 접착제로 연결된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항에 있어서,상기 봉지부는 제 2 탑재판을 포함하고,상기 제 2 탑재판에는 상기 충전 스위치가 탑재된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 13 항에 있어서,상기 제 2 탑재판과 상기 충전 스위치는 도전성 접착제로 연결된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 13 항에 있어서,상기 제 2 탑재판은 상기 봉지부 외측으로 돌출된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항에 있어서,상기 봉지부는 더미 리드를 더 포함하여 이루어진 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 16 항에 있어서,상기 더미 리드는 상기 봉지부의 외부로 노출된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 16 항에 있어서,상기 더미 리드는 상기 봉지부에 배열된 제 1 서브리드와 같은 측에 형성된 것을 특징으로 하는 배터리 셀 보호용 반도체 장치.
- 제 1 항 내지 제 5 항 및 제 7 항 내지 제 18 항 중 어느 한 항에 기재된 배터리 셀 보호용 반도체 장치가 실장된 인쇄 회로 기판을 포함하는 보호 회로 모듈; 및상기 보호 회로 모듈과 전기적으로 연결되는 배터리 셀을 포함하여 이루어진 것을 특징으로 하는 배터리 팩.
- 제 19 항에 있어서,상기 인쇄 회로 기판은 배터리 셀과 전기적으로 접속되는 배터리 단자 및외부 시스템과 전기적으로 접속되는 팩 단자를 더 포함하여 이루어진 것을 특징으로 하는 배터리 팩.
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KR1020090115144A KR101093907B1 (ko) | 2009-11-26 | 2009-11-26 | 배터리 셀 보호용 반도체 장치, 이를 갖는 보호 회로 모듈 및 배터리 팩 |
US12/947,797 US9028987B2 (en) | 2009-11-26 | 2010-11-16 | Semiconductor device for protecting battery cell, protection circuit module and battery pack having the same |
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KR101288059B1 (ko) * | 2012-01-04 | 2013-07-22 | 주식회사 아이티엠반도체 | 배터리 보호회로의 패키지 모듈 |
KR102040194B1 (ko) * | 2013-03-25 | 2019-11-04 | 삼성에스디아이 주식회사 | 이차전지 연결용 회로기판 |
EP2822063B1 (en) | 2013-07-01 | 2017-05-31 | Samsung SDI Co., Ltd. | Protection apparatus for a battery pack and method of manufacturing the protection apparatus |
JP6367575B2 (ja) * | 2014-02-25 | 2018-08-01 | 株式会社日本マイクロニクス | 二次電池搭載回路チップ及びその製造方法 |
US10110025B2 (en) | 2016-01-26 | 2018-10-23 | Microsoft Technology Licensing, Llc | Enhanced parallel protection circuit |
KR102483624B1 (ko) * | 2018-01-10 | 2023-01-02 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 배터리 모듈 |
JP2021150159A (ja) * | 2020-03-19 | 2021-09-27 | キヤノン株式会社 | 電子機器および電池モジュール |
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JP4692554B2 (ja) * | 2008-02-06 | 2011-06-01 | ソニー株式会社 | 充電装置 |
WO2011163339A1 (en) * | 2010-06-25 | 2011-12-29 | Rafael Development Corporation Ltd. | Pulse parameters and electrode configurations for reducing patient discomfort from defibrillation |
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2009
- 2009-11-26 KR KR1020090115144A patent/KR101093907B1/ko active IP Right Grant
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JP2006304487A (ja) * | 2005-04-20 | 2006-11-02 | Matsushita Electric Ind Co Ltd | 二次電池の保護回路及び電池パック |
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KR20110058379A (ko) | 2011-06-01 |
US20110123842A1 (en) | 2011-05-26 |
US9028987B2 (en) | 2015-05-12 |
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