JP2009545869A - 層の平面に垂直なスピン分極が大きい薄層磁気デバイス、およびそのデバイスを使用する磁気トンネル接合およびスピンバルブ - Google Patents
層の平面に垂直なスピン分極が大きい薄層磁気デバイス、およびそのデバイスを使用する磁気トンネル接合およびスピンバルブ Download PDFInfo
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- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
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- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
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- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/18—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
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- H01F10/30—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the intermediate layers, e.g. seed, buffer, template, diffusion preventing, cap layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
Description
- 速度(ほんの数ナノ秒の書き込み読み出し時間)
- 不揮発性
- 読み出し/書き込み疲労がない
- 電離放射線の影響を受けない
ただし、Cは、磁気層の体積特性に依存する定数であり、Kapは、垂直異方性定数であり、磁気層と接触した材料の詳しい構造および界面の構造品質に依存する。
- 垂直磁気異方性が大きい材料から作られる磁気層であって、その磁化が、どのような電気的または磁気的な相互作用がない場合でも、該磁気層の平面の外部に配置される、磁気層と、
- 先の層と直接接触し、スピン分極の比率が高い強磁性材料から作られる磁気層であって、その磁化が、どのような電気的または磁気的な相互作用がない場合でも、その平面上に配置され、先の層とのその結合が、これら2つの層を含むアセンブリの有効な消磁磁場の低減を誘起する、磁気層と、
- 先の磁気層、すなわちスピン分極の比率が高い強磁性材料から作られる磁気層と直接接触し、デバイスを通過する電子には分極性でない材料から作られる非磁気層と、から構成される薄膜磁気デバイスに関する。
平面磁化を有するスピンバルブまたは磁気トンネル接合の内部の垂直分極層として、
垂直磁化を有する構造中の活性層、すなわちフリー層および固定層の両方として、
平面磁化を有する構造中の活性層として、すなわち弱い磁化磁場を有するフリー層として、
使用することができる。
ただし、kv2およびks2は、マルチレイヤ2のそれぞれ磁気結晶異方性および界面異方性である。
ただし、kv3およびks3は、コバルト層のそれぞれ磁気結晶異方性および界面異方性である。
層3について、-2π・M2 3・e3
ただし、M2(3)は、対応する層の自然発生的な磁化である。
ただし、θ2は、層の平面に対して垂直の方向に対する層2の磁化角度である。
2 層、マルチレイヤ、白金およびコバルトの層のスタックから構成される層、磁気層
3 層、コバルト層、スピン分極の比率が高い強磁性材料から作られる層、磁気層
4 層、銅の層、非磁気層
Claims (17)
- カソードスパッタリングによって堆積された複合アセンブリを基板上に含む薄膜磁気デバイスにおいて、
垂直磁気異方性が大きい材料からなる磁気層(2)であって、その磁化は、どのような電気的または磁気的な相互作用がない場合に、該層の平面の外部に位置する、磁気層(2)と、
前記磁気層(2)と直接接触し、スピン分極の比率が高い強磁性材料からなる磁気層(3)であって、その磁化は、どのような電気的または磁気的な相互作用がない場合に、その平面上に位置し、かつ前記磁気層(2)とのその直接の磁気結合が、前記2つの磁気層(2)および(3)を含む前記アセンブリの有効な消磁磁場の低減を誘起する、磁気層(3)と、
前記磁気層(3)と直接接触し、前記デバイスを通過する電子には分極性でない材料からなる非磁気層(4)と、を備え、
それら層中をそれらの平面に対して実質的に垂直な方向に電流を流す手段をさらに備える、薄膜磁気デバイス。 - その得られた磁化が、それを構成する前記層の平面に対して垂直に方向付けられることを特徴とする、請求項1に記載の薄膜磁気デバイス。
- 前記磁気層(2)が、コバルト、白金、鉄、ニッケル、パラジウム、金および銅を含む群から選択される材料の材料、合金またはマルチレイヤから構成されることを特徴とする、請求項1又は2のいずれかに記載の薄膜磁気デバイス。
- 前記磁気層(3)が、コバルト、鉄、ニッケル、あるいはそれらの二元または三元合金を含む群から選択される磁性材料から構成されることを特徴とする、請求項1又は2のいずれかに記載の薄膜磁気デバイス。
- 前記磁気層(3)を構成する前記磁性材料が、結晶化した、またはアモルファスであり、かつヨウ素、ケイ素、リン、炭素、ジルコニウム、ハフニウムまたはそれらの合金を含む群から選択される追加の非磁性材料を含むことを特徴とする、請求項1又は2のいずれかに記載の薄膜磁気デバイス。
- 前記磁気層(3)が、磁性金属/磁性金属または磁性金属/非磁性金属のタイプのマルチレイヤから構成されることを特徴とする、請求項1又は2のいずれかに記載の薄膜磁気デバイス。
- 前記非磁気層(4)が、非磁性金属または非磁性酸化物から作られることを特徴とする、請求項1又は2のいずれかに記載の薄膜磁気デバイス。
- 前記基板と前記複合アセンブリの間にバッファ層(1)を介在させることを特徴とする、請求項1から7のいずれか一項に記載の薄膜磁気デバイス。
- 前記バッファ層(1)が、白金、タンタル、クロム、チタン、窒化チタン、銅、金、パラジウム、銀またはそれらの合金を含む群から選択される、1つまたは複数の材料から作られることを特徴とする、請求項8に記載の薄膜磁気デバイス。
- 前記バッファ層(1)が、複数の層から構成されることを特徴とする、請求項8に記載の薄膜磁気デバイス。
- 前記基板が、ケイ素、シリカ、窒化ケイ素、酸化マグネシウム、酸化アルミニウムおよびガラスを含む群から選択される材料から作られることを特徴とする、請求項1から10のいずれか一項に記載の薄膜磁気デバイス。
- その2つの活性磁気層に加えて、請求項1から11のいずれかに記載されたように作られる追加のマルチレイヤを含むことを特徴とする、平面磁化を有する磁気トンネル接合。
- その2つの活性磁気層の少なくとも1つが、請求項1から11のいずれかに記載されたように作られることを特徴とする、平面磁化を有する磁気トンネル接合。
- その2つの活性磁気層の少なくとも1つが、請求項1から11のいずれかに記載されたように作られることを特徴とする、垂直磁化を有する磁気トンネル接合。
- その2つの活性磁気層に加えて、請求項1から11のいずれかに記載されたように作られる追加のマルチレイヤを含むことを特徴とする、平面磁化を有するスピンバルブ。
- その2つの活性磁気層の少なくとも1つが、請求項1から11のいずれか一項に記載されたように作られることを特徴とする、平面磁化を有するスピンバルブ。
- その2つの活性磁気層の少なくとも1つが、請求項1から11のいずれか一項に記載されたように作られることを特徴とする、垂直磁化を有するスピンバルブ。
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FR0653266 | 2006-08-03 | ||
FR0653266A FR2904724B1 (fr) | 2006-08-03 | 2006-08-03 | Dispositif magnetique en couches minces a forte polarisation en spin perpendiculaire au plan des couches, jonction tunnel magnetique et vanne de spin mettant en oeuvre un tel dispositif |
US86842906P | 2006-12-04 | 2006-12-04 | |
US60/868,429 | 2006-12-04 | ||
PCT/FR2007/051659 WO2008015354A2 (fr) | 2006-08-03 | 2007-07-13 | Dispositif magnétique en couches minces à forte polarisation en spin perpendiculaire au plan des couches, jonction tunnel magnétique et vanne de spin mettant en oeuvre un tel dispositif |
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JP5117496B2 JP5117496B2 (ja) | 2013-01-16 |
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EP (1) | EP2047489B1 (ja) |
JP (1) | JP5117496B2 (ja) |
KR (1) | KR20090037970A (ja) |
CN (1) | CN101496120B (ja) |
FR (1) | FR2904724B1 (ja) |
WO (1) | WO2008015354A2 (ja) |
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JP2011060918A (ja) * | 2009-09-08 | 2011-03-24 | Nippon Hoso Kyokai <Nhk> | スピン注入磁化反転素子、磁気ランダムアクセスメモリ、光変調器、表示装置、ホログラフィ装置、ホログラム記録装置および光変調器の製造方法 |
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JP2008084879A (ja) * | 2006-09-25 | 2008-04-10 | Toshiba Corp | 磁気発振素子、磁気センサ、磁気ヘッド及び磁気記録再生装置 |
JP2011060918A (ja) * | 2009-09-08 | 2011-03-24 | Nippon Hoso Kyokai <Nhk> | スピン注入磁化反転素子、磁気ランダムアクセスメモリ、光変調器、表示装置、ホログラフィ装置、ホログラム記録装置および光変調器の製造方法 |
JP2021525005A (ja) * | 2018-05-24 | 2021-09-16 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 結合層とピンニング層の格子整合を用いた磁気トンネル接合 |
JP7104809B2 (ja) | 2018-05-24 | 2022-07-21 | アプライド マテリアルズ インコーポレイテッド | 結合層とピンニング層の格子整合を用いた磁気トンネル接合 |
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JP5117496B2 (ja) | 2013-01-16 |
WO2008015354A2 (fr) | 2008-02-07 |
FR2904724A1 (fr) | 2008-02-08 |
CN101496120A (zh) | 2009-07-29 |
EP2047489B1 (fr) | 2019-08-28 |
US20080031035A1 (en) | 2008-02-07 |
WO2008015354A3 (fr) | 2008-03-27 |
KR20090037970A (ko) | 2009-04-16 |
US7813202B2 (en) | 2010-10-12 |
FR2904724B1 (fr) | 2011-03-04 |
CN101496120B (zh) | 2012-01-25 |
EP2047489A2 (fr) | 2009-04-15 |
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