JP2009539626A - メンブレン膨張ステップなしの研磨ヘッドへの高速基板ローディング - Google Patents

メンブレン膨張ステップなしの研磨ヘッドへの高速基板ローディング Download PDF

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Publication number
JP2009539626A
JP2009539626A JP2009513475A JP2009513475A JP2009539626A JP 2009539626 A JP2009539626 A JP 2009539626A JP 2009513475 A JP2009513475 A JP 2009513475A JP 2009513475 A JP2009513475 A JP 2009513475A JP 2009539626 A JP2009539626 A JP 2009539626A
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JP
Japan
Prior art keywords
substrate
flexible membrane
chamber
base member
central chamber
Prior art date
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Pending
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JP2009513475A
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English (en)
Japanese (ja)
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JP2009539626A5 (enExample
Inventor
ハン チー チェン，
ジョンフン オウ，
アンドリュー ナジェンガスト，
スティーブン， エム． スニガ，
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2009539626A publication Critical patent/JP2009539626A/ja
Publication of JP2009539626A5 publication Critical patent/JP2009539626A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2009513475A 2006-06-02 2007-06-01 メンブレン膨張ステップなしの研磨ヘッドへの高速基板ローディング Pending JP2009539626A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81041506P 2006-06-02 2006-06-02
PCT/US2007/070243 WO2007143566A2 (en) 2006-06-02 2007-06-01 Fast substrate loading on polishing head without membrane inflation step

Publications (2)

Publication Number Publication Date
JP2009539626A true JP2009539626A (ja) 2009-11-19
JP2009539626A5 JP2009539626A5 (enExample) 2010-07-22

Family

ID=38802256

Family Applications (1)

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JP2009513475A Pending JP2009539626A (ja) 2006-06-02 2007-06-01 メンブレン膨張ステップなしの研磨ヘッドへの高速基板ローディング

Country Status (4)

Country Link
US (1) US7527271B2 (enExample)
JP (1) JP2009539626A (enExample)
TW (1) TWI354347B (enExample)
WO (1) WO2007143566A2 (enExample)

Cited By (2)

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Publication number Priority date Publication date Assignee Title
JP2017538296A (ja) * 2014-12-19 2017-12-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 化学機械研磨ツール用の構成要素
US11484987B2 (en) 2020-03-09 2022-11-01 Applied Materials, Inc. Maintenance methods for polishing systems and articles related thereto

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JP5074125B2 (ja) * 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
WO2009066351A1 (ja) * 2007-11-20 2009-05-28 Shin-Etsu Handotai Co., Ltd. 研磨ヘッド及び研磨装置
KR100931197B1 (ko) * 2008-02-22 2009-12-10 주식회사 실트론 웨이퍼 연마장치용 헤드 어셈블리
DE102008018536B4 (de) * 2008-04-12 2020-08-13 Erich Thallner Vorrichtung und Verfahren zum Aufbringen und/oder Ablösen eines Wafers auf einen/von einem Träger
JP5390807B2 (ja) * 2008-08-21 2014-01-15 株式会社荏原製作所 研磨方法および装置
US8454408B2 (en) 2008-11-26 2013-06-04 Applied Materials, Inc. Load cup substrate sensing
AT516595B1 (de) * 2009-03-05 2020-10-15 Thallner Erich Vorrichtung und Verfahren zum Aufbringen und/oder Ablösen eines Wafers auf einen/von einem Träger
US8460067B2 (en) 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
KR101801264B1 (ko) * 2011-06-13 2017-11-27 삼성전자주식회사 반도체 제조 장치 및 이를 이용한 반도체 패키지 방법
US10099327B2 (en) * 2012-08-28 2018-10-16 Nissan Motor Co., Ltd. Device for press-fitting oil seal
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
WO2014145456A1 (en) * 2013-03-15 2014-09-18 Rudolph Technologies, Inc. Flexible handling system for semiconductor substrates
JP6454326B2 (ja) * 2014-04-18 2019-01-16 株式会社荏原製作所 基板処理装置、基板処理システム、および基板処理方法
KR102346786B1 (ko) * 2015-07-03 2022-01-04 주식회사 케이씨텍 화학 기계적 연마 시스템의 웨이퍼 로딩 장치
KR102461598B1 (ko) * 2015-12-18 2022-11-01 주식회사 케이씨텍 화학 기계적 연마 시스템의 기판 로딩 장치
US10510563B2 (en) * 2016-04-15 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. Wafer carrier assembly
JP6650345B2 (ja) * 2016-05-26 2020-02-19 日本特殊陶業株式会社 基板保持装置及びその製造方法
US10618447B2 (en) * 2016-10-17 2020-04-14 Walmart Apollo, Llc Delivery vehicle and systems or parts thereof
KR102330274B1 (ko) * 2017-05-31 2021-11-24 주식회사 케이씨텍 기판 거치대 및 이를 구비한 기판 처리 장치
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
CN110142689B (zh) * 2019-04-17 2021-09-14 杭州众硅电子科技有限公司 一种晶圆装载支架、晶圆装载系统及晶圆装片方法
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
US11945073B2 (en) * 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
US20230207326A1 (en) * 2021-12-29 2023-06-29 Canon Kabushiki Kaisha Planarization process, apparatus and method of manufacturing an article
US20240363371A1 (en) * 2023-04-28 2024-10-31 Applied Materials, Inc. Substrate cleaning improvement

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US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
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JP3816297B2 (ja) * 2000-04-25 2006-08-30 株式会社荏原製作所 研磨装置
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017538296A (ja) * 2014-12-19 2017-12-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 化学機械研磨ツール用の構成要素
US10434627B2 (en) 2014-12-19 2019-10-08 Applied Materials, Inc. Components for a chemical mechanical polishing tool
US11376709B2 (en) 2014-12-19 2022-07-05 Applied Materials, Inc. Components for a chemical mechanical polishing tool
US11484987B2 (en) 2020-03-09 2022-11-01 Applied Materials, Inc. Maintenance methods for polishing systems and articles related thereto
US11986925B2 (en) 2020-03-09 2024-05-21 Applied Materials, Inc. Maintenance methods for polishing systems and articles related thereto

Also Published As

Publication number Publication date
TW200807615A (en) 2008-02-01
WO2007143566A3 (en) 2008-09-18
US20070289124A1 (en) 2007-12-20
TWI354347B (en) 2011-12-11
WO2007143566A2 (en) 2007-12-13
US7527271B2 (en) 2009-05-05

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