JP2009535825A5 - - Google Patents

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Publication number
JP2009535825A5
JP2009535825A5 JP2009507992A JP2009507992A JP2009535825A5 JP 2009535825 A5 JP2009535825 A5 JP 2009535825A5 JP 2009507992 A JP2009507992 A JP 2009507992A JP 2009507992 A JP2009507992 A JP 2009507992A JP 2009535825 A5 JP2009535825 A5 JP 2009535825A5
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JP
Japan
Prior art keywords
gas
electrode
dielectric barrier
lamp assembly
discharge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009507992A
Other languages
English (en)
Japanese (ja)
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JP4934193B2 (ja
JP2009535825A (ja
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Publication date
Priority claimed from US11/380,553 external-priority patent/US7978964B2/en
Application filed filed Critical
Publication of JP2009535825A publication Critical patent/JP2009535825A/ja
Publication of JP2009535825A5 publication Critical patent/JP2009535825A5/ja
Application granted granted Critical
Publication of JP4934193B2 publication Critical patent/JP4934193B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009507992A 2006-04-27 2007-04-27 誘電体バリア放電ランプアセンブリを用いた基板処理チャンバ Expired - Fee Related JP4934193B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/380,553 US7978964B2 (en) 2006-04-27 2006-04-27 Substrate processing chamber with dielectric barrier discharge lamp assembly
US11/380,553 2006-04-27
PCT/US2007/067684 WO2007127947A2 (en) 2006-04-27 2007-04-27 Substrate processing chamber with dielectric barrier discharge lamp assembly

Publications (3)

Publication Number Publication Date
JP2009535825A JP2009535825A (ja) 2009-10-01
JP2009535825A5 true JP2009535825A5 (https=) 2012-02-09
JP4934193B2 JP4934193B2 (ja) 2012-05-16

Family

ID=38647690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009507992A Expired - Fee Related JP4934193B2 (ja) 2006-04-27 2007-04-27 誘電体バリア放電ランプアセンブリを用いた基板処理チャンバ

Country Status (3)

Country Link
US (2) US7978964B2 (https=)
JP (1) JP4934193B2 (https=)
WO (1) WO2007127947A2 (https=)

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US6972267B2 (en) 2002-03-04 2005-12-06 Applied Materials, Inc. Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
EP1420080A3 (en) 2002-11-14 2005-11-09 Applied Materials, Inc. Apparatus and method for hybrid chemical deposition processes
US20050252449A1 (en) 2004-05-12 2005-11-17 Nguyen Son T Control of gas flow and delivery to suppress the formation of particles in an MOCVD/ALD system
US20070128862A1 (en) 2005-11-04 2007-06-07 Paul Ma Apparatus and process for plasma-enhanced atomic layer deposition
US20080090393A1 (en) * 2006-10-10 2008-04-17 Wolfgang Aderhold Ultra shallow junction with rapid thermal anneal
US20090014423A1 (en) * 2007-07-10 2009-01-15 Xuegeng Li Concentric flow-through plasma reactor and methods therefor
US7718707B2 (en) * 2006-12-21 2010-05-18 Innovalight, Inc. Method for preparing nanoparticle thin films
US8821637B2 (en) 2007-01-29 2014-09-02 Applied Materials, Inc. Temperature controlled lid assembly for tungsten nitride deposition
US8471170B2 (en) * 2007-07-10 2013-06-25 Innovalight, Inc. Methods and apparatus for the production of group IV nanoparticles in a flow-through plasma reactor
US8968438B2 (en) * 2007-07-10 2015-03-03 Innovalight, Inc. Methods and apparatus for the in situ collection of nucleated particles
JP5169046B2 (ja) * 2007-07-20 2013-03-27 ウシオ電機株式会社 光照射式加熱処理装置
US20090053878A1 (en) * 2007-08-21 2009-02-26 Maxim Kelman Method for fabrication of semiconductor thin films using flash lamp processing
US8548311B2 (en) 2008-04-09 2013-10-01 Applied Materials, Inc. Apparatus and method for improved control of heating and cooling of substrates
US8283607B2 (en) * 2008-04-09 2012-10-09 Applied Materials, Inc. Apparatus including heating source reflective filter for pyrometry
US8367983B2 (en) * 2008-04-09 2013-02-05 Applied Materials, Inc. Apparatus including heating source reflective filter for pyrometry
US20100096569A1 (en) * 2008-10-21 2010-04-22 Applied Materials, Inc. Ultraviolet-transmitting microwave reflector comprising a micromesh screen
US7964858B2 (en) 2008-10-21 2011-06-21 Applied Materials, Inc. Ultraviolet reflector with coolant gas holes and method
US8584612B2 (en) * 2009-12-17 2013-11-19 Lam Research Corporation UV lamp assembly of degas chamber having rotary shutters
US8865602B2 (en) * 2012-09-28 2014-10-21 Applied Materials, Inc. Edge ring lip
US9153427B2 (en) 2012-12-18 2015-10-06 Agilent Technologies, Inc. Vacuum ultraviolet photon source, ionization apparatus, and related methods
JP5931769B2 (ja) * 2013-02-01 2016-06-08 アイシン高丘株式会社 赤外炉及び赤外線加熱方法
US20140270731A1 (en) * 2013-03-12 2014-09-18 Applied Materials, Inc. Thermal management apparatus for solid state light source arrays
CN105190851B (zh) * 2013-05-10 2018-03-16 应用材料公司 使用顺应性材料进行的圆顶冷却
US10410890B2 (en) * 2013-06-21 2019-09-10 Applied Materials, Inc. Light pipe window structure for thermal chamber applications and processes
KR20170013916A (ko) * 2014-05-27 2017-02-07 어플라이드 머티어리얼스, 인코포레이티드 연성 재료를 이용한 윈도우 냉각
JP2016018609A (ja) * 2014-07-04 2016-02-01 ウシオ電機株式会社 エキシマランプおよびエキシマ光照射装置
US10699922B2 (en) * 2014-07-25 2020-06-30 Applied Materials, Inc. Light pipe arrays for thermal chamber applications and thermal processes
KR101771667B1 (ko) * 2015-12-18 2017-08-28 한국과학기술원 유전체 장벽 방전용 전극 조립체 및 이를 이용한 플라즈마 처리장치
CN109011180B (zh) * 2018-08-24 2024-06-14 重庆半岛医疗科技有限公司 一种均匀发光的介质阻挡放电光源

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4485333A (en) 1982-04-28 1984-11-27 Eg&G, Inc. Vapor discharge lamp assembly
JPS63260132A (ja) * 1987-04-17 1988-10-27 Hitachi Ltd 表面改質装置
JPH01134932A (ja) * 1987-11-19 1989-05-26 Oki Electric Ind Co Ltd 基板清浄化方法及び基板清浄化装置
US5155336A (en) 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
JPH0410410A (ja) * 1990-02-02 1992-01-14 Sharp Corp 薄膜製造装置
JP4218192B2 (ja) * 1999-08-05 2009-02-04 株式会社日立ハイテクノロジーズ 基板処理装置及び処理方法
US6631726B1 (en) 1999-08-05 2003-10-14 Hitachi Electronics Engineering Co., Ltd. Apparatus and method for processing a substrate
JP2001176865A (ja) * 1999-12-15 2001-06-29 Seiko Epson Corp 処理装置及び処理方法

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