JP2009527632A5 - - Google Patents
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- Publication number
- JP2009527632A5 JP2009527632A5 JP2008556459A JP2008556459A JP2009527632A5 JP 2009527632 A5 JP2009527632 A5 JP 2009527632A5 JP 2008556459 A JP2008556459 A JP 2008556459A JP 2008556459 A JP2008556459 A JP 2008556459A JP 2009527632 A5 JP2009527632 A5 JP 2009527632A5
- Authority
- JP
- Japan
- Prior art keywords
- halogen
- free
- epoxy resin
- phosphorus
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 claims description 27
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229910052736 halogen Inorganic materials 0.000 claims description 14
- 150000002367 halogens Chemical class 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000000806 elastomer Substances 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 150000002431 hydrogen Chemical class 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 125000000547 substituted alkyl group Chemical group 0.000 claims description 2
- 0 CC1(CNc2cc(C(*)(*)c3cc(NC*4CN5)c4c5c3)c3)c2c3PC1 Chemical compound CC1(CNc2cc(C(*)(*)c3cc(NC*4CN5)c4c5c3)c3)c2c3PC1 0.000 description 5
- 239000004114 Ammonium polyphosphate Substances 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 2
- 229920001276 ammonium polyphosphate Polymers 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095106032A TW200732412A (en) | 2006-02-23 | 2006-02-23 | Non-halogen composition having phosphor-containing epoxy resin |
| PCT/US2007/004853 WO2007100734A2 (en) | 2006-02-23 | 2007-02-22 | A halogen-free phosphorous epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009527632A JP2009527632A (ja) | 2009-07-30 |
| JP2009527632A5 true JP2009527632A5 (enExample) | 2010-04-08 |
Family
ID=38323955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008556459A Withdrawn JP2009527632A (ja) | 2006-02-23 | 2007-02-22 | ハロゲンを含まないリン・エポキシ樹脂組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090018241A1 (enExample) |
| EP (1) | EP2054460A2 (enExample) |
| JP (1) | JP2009527632A (enExample) |
| TW (1) | TW200732412A (enExample) |
| WO (1) | WO2007100734A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200732448A (en) * | 2006-02-23 | 2007-09-01 | Pont Taiwan Ltd Du | Non-halogen adhesive containing polyphosphate compounds |
| KR101520131B1 (ko) * | 2007-09-28 | 2015-05-13 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시 수지 조성물 |
| US10966850B2 (en) * | 2014-03-06 | 2021-04-06 | W. L. Gore & Associates, Inc. | Implantable medical device constraint and deployment apparatus |
| JP5920431B2 (ja) | 2014-09-19 | 2016-05-18 | 横浜ゴム株式会社 | 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用エポキシ樹脂組成物の製造方法、プリプレグ及びハニカムパネル |
| JP7045173B2 (ja) * | 2017-11-28 | 2022-03-31 | 藤森工業株式会社 | カバーレイフィルムおよびそれを用いた電子機器 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100721697B1 (ko) * | 1999-12-13 | 2007-05-28 | 다우 글로벌 테크놀로지스 인크. | 난연성 인 원소 함유 에폭시 수지 조성물 |
| JP2002020715A (ja) * | 2000-07-11 | 2002-01-23 | Toshiba Chem Corp | 難燃性接着剤組成物およびフレキシブルプリント配線板関連製品 |
| TW498084B (en) * | 2000-07-19 | 2002-08-11 | Chang Chun Plastics Co Ltd | Flame-retardant resin and flame retardant composition containing the same |
| JP2003105167A (ja) * | 2001-07-27 | 2003-04-09 | Toray Ind Inc | 難燃性樹脂組成物とそれを用いた半導体装置用接着剤シート、カバーレイフィルム並びにフレキシブルプリント配線基板 |
| TW200413467A (en) * | 2003-01-16 | 2004-08-01 | Chang Chun Plastics Co Ltd | Resin composition without containing halogen |
| JP2005002294A (ja) * | 2003-06-16 | 2005-01-06 | Shin Etsu Chem Co Ltd | 接着剤組成物、それを用いたカバーレイフィルムおよびフレキシブル印刷配線板 |
| TW200732448A (en) * | 2006-02-23 | 2007-09-01 | Pont Taiwan Ltd Du | Non-halogen adhesive containing polyphosphate compounds |
-
2006
- 2006-02-23 TW TW095106032A patent/TW200732412A/zh not_active IP Right Cessation
-
2007
- 2007-02-22 JP JP2008556459A patent/JP2009527632A/ja not_active Withdrawn
- 2007-02-22 US US12/162,610 patent/US20090018241A1/en not_active Abandoned
- 2007-02-22 WO PCT/US2007/004853 patent/WO2007100734A2/en not_active Ceased
- 2007-02-22 EP EP07751602A patent/EP2054460A2/en not_active Withdrawn
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