TW200732412A - Non-halogen composition having phosphor-containing epoxy resin - Google Patents

Non-halogen composition having phosphor-containing epoxy resin

Info

Publication number
TW200732412A
TW200732412A TW095106032A TW95106032A TW200732412A TW 200732412 A TW200732412 A TW 200732412A TW 095106032 A TW095106032 A TW 095106032A TW 95106032 A TW95106032 A TW 95106032A TW 200732412 A TW200732412 A TW 200732412A
Authority
TW
Taiwan
Prior art keywords
phosphor
containing epoxy
printed circuit
halogen composition
circuit boards
Prior art date
Application number
TW095106032A
Other languages
English (en)
Chinese (zh)
Other versions
TWI305217B (enExample
Inventor
yu-xuan Zheng
Ming-Te We
Original Assignee
Pont Taiwan Ltd Du
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pont Taiwan Ltd Du filed Critical Pont Taiwan Ltd Du
Priority to TW095106032A priority Critical patent/TW200732412A/zh
Priority to JP2008556459A priority patent/JP2009527632A/ja
Priority to PCT/US2007/004853 priority patent/WO2007100734A2/en
Priority to EP07751602A priority patent/EP2054460A2/en
Priority to US12/162,610 priority patent/US20090018241A1/en
Publication of TW200732412A publication Critical patent/TW200732412A/zh
Application granted granted Critical
Publication of TWI305217B publication Critical patent/TWI305217B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
TW095106032A 2006-02-23 2006-02-23 Non-halogen composition having phosphor-containing epoxy resin TW200732412A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW095106032A TW200732412A (en) 2006-02-23 2006-02-23 Non-halogen composition having phosphor-containing epoxy resin
JP2008556459A JP2009527632A (ja) 2006-02-23 2007-02-22 ハロゲンを含まないリン・エポキシ樹脂組成物
PCT/US2007/004853 WO2007100734A2 (en) 2006-02-23 2007-02-22 A halogen-free phosphorous epoxy resin composition
EP07751602A EP2054460A2 (en) 2006-02-23 2007-02-22 A halogen-free phosphorous epoxy resin composition
US12/162,610 US20090018241A1 (en) 2006-02-23 2007-02-22 Halogen-free phosphorous epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095106032A TW200732412A (en) 2006-02-23 2006-02-23 Non-halogen composition having phosphor-containing epoxy resin

Publications (2)

Publication Number Publication Date
TW200732412A true TW200732412A (en) 2007-09-01
TWI305217B TWI305217B (enExample) 2009-01-11

Family

ID=38323955

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106032A TW200732412A (en) 2006-02-23 2006-02-23 Non-halogen composition having phosphor-containing epoxy resin

Country Status (5)

Country Link
US (1) US20090018241A1 (enExample)
EP (1) EP2054460A2 (enExample)
JP (1) JP2009527632A (enExample)
TW (1) TW200732412A (enExample)
WO (1) WO2007100734A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452081B (zh) * 2007-09-28 2014-09-11 Dow Global Technologies Llc 環氧樹脂調配物

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200732448A (en) * 2006-02-23 2007-09-01 Pont Taiwan Ltd Du Non-halogen adhesive containing polyphosphate compounds
US10966850B2 (en) * 2014-03-06 2021-04-06 W. L. Gore & Associates, Inc. Implantable medical device constraint and deployment apparatus
JP5920431B2 (ja) 2014-09-19 2016-05-18 横浜ゴム株式会社 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用エポキシ樹脂組成物の製造方法、プリプレグ及びハニカムパネル
JP7045173B2 (ja) * 2017-11-28 2022-03-31 藤森工業株式会社 カバーレイフィルムおよびそれを用いた電子機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100721697B1 (ko) * 1999-12-13 2007-05-28 다우 글로벌 테크놀로지스 인크. 난연성 인 원소 함유 에폭시 수지 조성물
JP2002020715A (ja) * 2000-07-11 2002-01-23 Toshiba Chem Corp 難燃性接着剤組成物およびフレキシブルプリント配線板関連製品
TW498084B (en) * 2000-07-19 2002-08-11 Chang Chun Plastics Co Ltd Flame-retardant resin and flame retardant composition containing the same
JP2003105167A (ja) * 2001-07-27 2003-04-09 Toray Ind Inc 難燃性樹脂組成物とそれを用いた半導体装置用接着剤シート、カバーレイフィルム並びにフレキシブルプリント配線基板
TW200413467A (en) * 2003-01-16 2004-08-01 Chang Chun Plastics Co Ltd Resin composition without containing halogen
JP2005002294A (ja) * 2003-06-16 2005-01-06 Shin Etsu Chem Co Ltd 接着剤組成物、それを用いたカバーレイフィルムおよびフレキシブル印刷配線板
TW200732448A (en) * 2006-02-23 2007-09-01 Pont Taiwan Ltd Du Non-halogen adhesive containing polyphosphate compounds

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452081B (zh) * 2007-09-28 2014-09-11 Dow Global Technologies Llc 環氧樹脂調配物

Also Published As

Publication number Publication date
EP2054460A2 (en) 2009-05-06
US20090018241A1 (en) 2009-01-15
JP2009527632A (ja) 2009-07-30
WO2007100734A2 (en) 2007-09-07
TWI305217B (enExample) 2009-01-11
WO2007100734A3 (en) 2007-11-22

Similar Documents

Publication Publication Date Title
WO2007100724A3 (en) A halogen-free phosphorous epoxy resin composition
WO2010114279A3 (en) Phosphorus-containing phenol novolac resin, hardener comprising the same and epoxy resin composition
ATE509053T1 (de) Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze
SI2307359T1 (sl) Mešanice ki vsebujejo epoksi smole in mešaniceaminov z gvanidinskimi derivati
DE602007005002D1 (de) Modifizierte hydrocarbylphenol-aldehydharze als klebrigmacher und diese enthaltende kautschukzusammensetzungen
TW200833802A (en) Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using the same
MX2009005356A (es) Resinas epoxicas comprendiendo un agente de curado de diamina cicloalifatica.
SG179001A1 (en) Adhesive film, multilayer circuit board, electronic component and semiconductor device
MY148111A (en) Curable silicone composition and electronic component
MY156575A (en) Epoxy resin coating compositions
WO2006005716A3 (en) Fire retardant composition
PL2307358T3 (pl) Mieszaniny amin z pochodnymi guanidyny
TW200740710A (en) Sealant composition having reduced permeability to gas
WO2014064103A3 (de) Reaktionsharz-zusammensetzung und deren verwendung
TW200734377A (en) Phenol resin and resin composition
PL2132274T3 (pl) Jednoskładnikowy klej montażowy o wysokiej przyczepności początkowej
TW200745199A (en) Thermally curable epoxy-amine barrier sealants
EP2157113A3 (en) Alkylated aminopropylated ethylenediamines and uses thereof
ATE543865T1 (de) Flammhemmende additive
WO2011054945A3 (de) Verwendung von guanidin-derivaten als härtungsbeschleuniger für epoxidharze
WO2007100734A3 (en) A halogen-free phosphorous epoxy resin composition
TW200710160A (en) Hardenable epoxy resin composition
BR112012014525A2 (pt) método para estabilizar adesivos de poliacrilato sensíveís à pressão em mistura com resinas adesivas
TW200710120A (en) Resin compositions, prepregs and laminates
WO2012093860A3 (ko) 프리프레그 및 이를 포함하는 프린트 배선판

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees