JP2009527631A5 - - Google Patents
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- Publication number
- JP2009527631A5 JP2009527631A5 JP2008556457A JP2008556457A JP2009527631A5 JP 2009527631 A5 JP2009527631 A5 JP 2009527631A5 JP 2008556457 A JP2008556457 A JP 2008556457A JP 2008556457 A JP2008556457 A JP 2008556457A JP 2009527631 A5 JP2009527631 A5 JP 2009527631A5
- Authority
- JP
- Japan
- Prior art keywords
- halogen
- free
- weight
- polyphosphate
- flame retardant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000000203 mixture Substances 0.000 claims description 27
- 229920000388 Polyphosphate Polymers 0.000 claims description 11
- 239000001205 polyphosphate Substances 0.000 claims description 11
- 235000011176 polyphosphates Nutrition 0.000 claims description 11
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 239000003063 flame retardant Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000003054 catalyst Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000000806 elastomer Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 claims description 2
- 238000003475 lamination Methods 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000004114 Ammonium polyphosphate Substances 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 2
- 229920001276 ammonium polyphosphate Polymers 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 125000000547 substituted alkyl group Chemical group 0.000 description 2
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical group CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- DWSWCPPGLRSPIT-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinin-6-ium 6-oxide Chemical group C1=CC=C2[P+](=O)OC3=CC=CC=C3C2=C1 DWSWCPPGLRSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012802 nanoclay Substances 0.000 description 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095106033A TW200732448A (en) | 2006-02-23 | 2006-02-23 | Non-halogen adhesive containing polyphosphate compounds |
| PCT/US2007/004837 WO2007100724A2 (en) | 2006-02-23 | 2007-02-22 | A halogen-free phosphorous epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009527631A JP2009527631A (ja) | 2009-07-30 |
| JP2009527631A5 true JP2009527631A5 (https=) | 2010-04-08 |
Family
ID=38328567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008556457A Withdrawn JP2009527631A (ja) | 2006-02-23 | 2007-02-22 | ハロゲンを含まないリン・エポキシ樹脂組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100048766A1 (https=) |
| EP (1) | EP2054467A2 (https=) |
| JP (1) | JP2009527631A (https=) |
| TW (1) | TW200732448A (https=) |
| WO (1) | WO2007100724A2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200732412A (en) * | 2006-02-23 | 2007-09-01 | Pont Taiwan Ltd Du | Non-halogen composition having phosphor-containing epoxy resin |
| KR101556657B1 (ko) | 2008-10-23 | 2015-10-26 | 주식회사 두산 | 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판 |
| JP5769629B2 (ja) * | 2008-12-08 | 2015-08-26 | スリーエム イノベイティブ プロパティズ カンパニー | エポキシ樹脂系用のハロゲンを含まない難燃剤 |
| TWI432509B (zh) * | 2008-12-22 | 2014-04-01 | Iteq Corp | 無鹵黏合膠片及其所用之樹脂 |
| PL225651B1 (pl) * | 2010-12-10 | 2017-05-31 | Inst Inżynierii Materiałów Polimerowych I Barwników | Trudnopalna kompozycja epoksydowa do wytwarzania laminatów epoksydowo-szklanych |
| KR101044656B1 (ko) * | 2011-01-25 | 2011-06-29 | (주)진성티앤씨 | 난연 화합물 |
| CN102250575A (zh) * | 2011-05-20 | 2011-11-23 | 北京理工大学 | 一种无卤阻燃pes本色热熔胶及其制备方法 |
| DE102011116178A1 (de) * | 2011-10-14 | 2013-04-18 | Schill + Seilacher "Struktol" Gmbh | Halogenfreies, phosphorhaltiges Flammschutzmittel |
| US9850375B2 (en) * | 2013-08-23 | 2017-12-26 | Elite Electronic Material (Kunshan) Co. Ltd. | Resin composition, copper clad laminate and printed circuit board using same |
| CN108912604A (zh) * | 2018-06-19 | 2018-11-30 | 成都纺织高等专科学校 | 一种具有高效阻燃性能的环氧树脂及其制备方法 |
| GB2580283B (en) | 2018-08-03 | 2022-02-23 | Gurit Uk Ltd | Fire-retardant epoxide resins and use thereof |
| CN109912799B (zh) * | 2019-03-29 | 2021-03-26 | 太原理工大学 | 一种含磷有机硅阻燃剂及其制备和应用 |
| CN111621250A (zh) * | 2019-10-23 | 2020-09-04 | 广东欣兴旺软板技术有限公司 | 一种无卤素阻燃粘合剂 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1048709A1 (en) * | 1998-10-30 | 2000-11-02 | Mitsui Chemicals, Inc. | Adhesive composition |
| JP2000198907A (ja) * | 1999-01-05 | 2000-07-18 | Ajinomoto Co Inc | 難燃性エポキシ樹脂組成物及びこれを用いたプリント配線板用層間接着フィルム、多層プリント配線板の製造方法 |
| WO2001042359A1 (en) * | 1999-12-13 | 2001-06-14 | Dow Global Technologies Inc. | Flame retardant phosphorus element-containing epoxy resin compositions |
| US6576690B1 (en) * | 2002-03-22 | 2003-06-10 | Chang Chung Plastics Co., Ltd. | Phosphorous-containing flame retarding epoxy resin and an epoxy resin composition containing the same |
| JP4434569B2 (ja) * | 2002-10-18 | 2010-03-17 | 日立化成ポリマー株式会社 | ハロゲンフリー難燃性接着剤組成物及びカバーレイフィルム |
| JP4672505B2 (ja) * | 2005-04-13 | 2011-04-20 | 信越化学工業株式会社 | 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板 |
| TW200732412A (en) * | 2006-02-23 | 2007-09-01 | Pont Taiwan Ltd Du | Non-halogen composition having phosphor-containing epoxy resin |
-
2006
- 2006-02-23 TW TW095106033A patent/TW200732448A/zh not_active IP Right Cessation
-
2007
- 2007-02-22 EP EP07751589A patent/EP2054467A2/en not_active Withdrawn
- 2007-02-22 JP JP2008556457A patent/JP2009527631A/ja not_active Withdrawn
- 2007-02-22 US US12/162,611 patent/US20100048766A1/en not_active Abandoned
- 2007-02-22 WO PCT/US2007/004837 patent/WO2007100724A2/en not_active Ceased
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