JP2009525614A5 - - Google Patents
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- Publication number
- JP2009525614A5 JP2009525614A5 JP2008553272A JP2008553272A JP2009525614A5 JP 2009525614 A5 JP2009525614 A5 JP 2009525614A5 JP 2008553272 A JP2008553272 A JP 2008553272A JP 2008553272 A JP2008553272 A JP 2008553272A JP 2009525614 A5 JP2009525614 A5 JP 2009525614A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- substrate
- conductive
- particles
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011888 foil Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
Claims (1)
- 電気絶縁層で隔てられている第1及び第2の導電フォイルを備えるコンプライアント基板であって、前記絶縁層の熱伝導率を高める粒子で充填されているポリマー材料を前記絶縁層が含む、コンプライアント基板と、
前記第1の導電フォイルの上に配置される複数のLEDダイと
を備える照明アセンブリ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US74319506P | 2006-01-31 | 2006-01-31 | |
PCT/US2007/002195 WO2007089599A2 (en) | 2006-01-31 | 2007-01-26 | Led illumination assembly with compliant foil construction |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009525614A JP2009525614A (ja) | 2009-07-09 |
JP2009525614A5 true JP2009525614A5 (ja) | 2010-03-18 |
Family
ID=38137663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008553272A Withdrawn JP2009525614A (ja) | 2006-01-31 | 2007-01-26 | コンプライアントなフォイル構造を有するled照明アセンブリ |
Country Status (7)
Country | Link |
---|---|
US (1) | US7572031B2 (ja) |
EP (1) | EP1996860A2 (ja) |
JP (1) | JP2009525614A (ja) |
KR (1) | KR101347486B1 (ja) |
CN (1) | CN101379344B (ja) |
TW (1) | TW200734750A (ja) |
WO (1) | WO2007089599A2 (ja) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9951438B2 (en) | 2006-03-07 | 2018-04-24 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
KR20080006304A (ko) * | 2006-07-12 | 2008-01-16 | 삼성전자주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
DE102007004303A1 (de) | 2006-08-04 | 2008-02-07 | Osram Opto Semiconductors Gmbh | Dünnfilm-Halbleiterbauelement und Bauelement-Verbund |
US8439252B2 (en) * | 2006-11-07 | 2013-05-14 | Excelitas Technologies Gmbh & Co Kg | Method for bonding metal surfaces, method for producing an object having cavities, object having cavities, structure of a light emitting diode |
KR101672553B1 (ko) | 2007-06-25 | 2016-11-03 | 큐디 비젼, 인크. | 조성물 및 나노물질의 침착을 포함하는 방법 |
WO2009014707A2 (en) * | 2007-07-23 | 2009-01-29 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
DE102007043904A1 (de) * | 2007-09-14 | 2009-03-19 | Osram Gesellschaft mit beschränkter Haftung | Leucht-Vorrichtung |
DE102007043903A1 (de) * | 2007-09-14 | 2009-03-26 | Osram Gesellschaft mit beschränkter Haftung | Leucht-Vorrichtung |
DE102007046520A1 (de) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Flächenelement und Verfahren zum Herstellen eines lichtemittierenden Flächenelementes |
WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
JP2011524064A (ja) | 2008-05-06 | 2011-08-25 | キユーデイー・ビジヨン・インコーポレーテツド | 量子閉じ込め半導体ナノ粒子を含有する固体照明装置 |
US8022626B2 (en) * | 2008-09-16 | 2011-09-20 | Osram Sylvania Inc. | Lighting module |
DE102009019412A1 (de) | 2009-04-29 | 2010-11-04 | Fa. Austria Technologie & Systemtechnik Ag | Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren |
WO2011020098A1 (en) | 2009-08-14 | 2011-02-17 | Qd Vision, Inc. | Lighting devices, an optical component for a lighting device, and methods |
KR101081069B1 (ko) * | 2009-12-21 | 2011-11-07 | 엘지이노텍 주식회사 | 발광소자 및 그를 이용한 라이트 유닛 |
JP5555038B2 (ja) * | 2010-04-13 | 2014-07-23 | デクセリアルズ株式会社 | 光反射性異方性導電接着剤及び発光装置 |
US9797580B2 (en) * | 2010-05-24 | 2017-10-24 | Abl Ip Holding Llc | LED light fixture |
WO2012061182A1 (en) | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device with wire bond free die |
KR20130132828A (ko) | 2010-11-03 | 2013-12-05 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 중합체 에칭제 및 그의 사용 방법 |
WO2012061184A1 (en) * | 2010-11-03 | 2012-05-10 | 3M Innovative Properties Company | Flexible led device and method of making |
GB2484152B (en) * | 2010-12-03 | 2015-03-25 | Zeta Specialist Lighting | Methods of manufacturing electrical devices such as electric lamps |
US9151463B2 (en) | 2010-12-29 | 2015-10-06 | 3M Innovative Properties Company | LED color combiner |
JP6104174B2 (ja) | 2010-12-29 | 2017-03-29 | スリーエム イノベイティブ プロパティズ カンパニー | リモート蛍光体led構造 |
JP2013157592A (ja) * | 2012-01-05 | 2013-08-15 | Canon Components Inc | 発光素子実装用フレキシブル回路基板 |
US9232634B2 (en) | 2011-01-17 | 2016-01-05 | Canon Components, Inc. | Flexible circuit board for mounting light emitting element, illumination apparatus, and vehicle lighting apparatus |
JP5228089B2 (ja) * | 2011-07-06 | 2013-07-03 | シャープ株式会社 | 発光装置および表示装置 |
JP5175956B2 (ja) * | 2011-07-06 | 2013-04-03 | シャープ株式会社 | 発光装置および表示装置 |
US8322906B2 (en) | 2011-08-08 | 2012-12-04 | XtraLight Manufacturing Partnership Ltd | Versatile lighting units |
CN102612254A (zh) * | 2011-08-10 | 2012-07-25 | 田茂福 | 散热型led柔性线路板 |
JP2014531109A (ja) * | 2011-08-29 | 2014-11-20 | コーニンクレッカ フィリップス エヌ ヴェ | 柔軟な照明アセンブリ、照明器具、及び柔軟層を製造する方法。 |
DE102011086168B4 (de) | 2011-11-11 | 2023-05-04 | Pictiva Displays International Limited | Organisches Licht emittierendes Bauelement und Verfahren zur Herstellung eines organischen optoelektronischen Bauelements |
US9929325B2 (en) | 2012-06-05 | 2018-03-27 | Samsung Electronics Co., Ltd. | Lighting device including quantum dots |
US20140055991A1 (en) * | 2012-08-23 | 2014-02-27 | Forrest Starnes McCanless | Printed Circuit Boards with Deformations |
JP6150050B2 (ja) * | 2012-12-07 | 2017-06-21 | 東芝ライテック株式会社 | 発光装置及び照明装置 |
CN103855142B (zh) * | 2012-12-04 | 2017-12-29 | 东芝照明技术株式会社 | 发光装置及照明装置 |
US9091400B2 (en) * | 2013-01-30 | 2015-07-28 | Luxo-Led Co., Limited | Multi-color light emitting diode device |
KR102026120B1 (ko) * | 2013-04-17 | 2019-11-04 | 엘지이노텍 주식회사 | 발광장치 |
US9644829B2 (en) | 2013-04-25 | 2017-05-09 | Xtralight Manufacturing, Ltd. | Systems and methods for providing a field repairable light fixture with a housing that dissipates heat |
JP6255747B2 (ja) | 2013-07-01 | 2018-01-10 | 日亜化学工業株式会社 | 発光装置 |
US9335034B2 (en) | 2013-09-27 | 2016-05-10 | Osram Sylvania Inc | Flexible circuit board for electronic applications, light source containing same, and method of making |
US10032753B2 (en) * | 2014-06-20 | 2018-07-24 | Grote Industries, Llc | Flexible lighting device having both visible and infrared light-emitting diodes |
JP6779201B2 (ja) * | 2014-08-08 | 2020-11-04 | ルミレッズ ホールディング ベーフェー | 柔軟設計のledデバイスを提供する方法 |
JP2017152450A (ja) * | 2016-02-22 | 2017-08-31 | 大日本印刷株式会社 | Led表示装置 |
US10408391B2 (en) | 2016-11-30 | 2019-09-10 | Tactotek Oy | Illuminated structure and related method of manufacture |
US10317614B1 (en) * | 2017-03-14 | 2019-06-11 | Automatad Assembly Corporation | SSL lighting apparatus |
US10767840B2 (en) | 2017-05-01 | 2020-09-08 | Riverpoint Medical, Llc | Focused LED headlamp with iris assembly |
US10174912B1 (en) * | 2017-05-01 | 2019-01-08 | R Iverpoint Medical, Llc | Focused LED headlamp with iris assembly |
JP6898203B2 (ja) * | 2017-10-27 | 2021-07-07 | 株式会社 日立パワーデバイス | パワー半導体モジュール |
US10655823B1 (en) | 2019-02-04 | 2020-05-19 | Automated Assembly Corporation | SSL lighting apparatus |
TWI784175B (zh) * | 2019-06-14 | 2022-11-21 | 培英半導體有限公司 | 以雷射開窗形成光學擋牆的方法及光學擋牆結構 |
EP3799539B1 (de) | 2019-09-27 | 2022-03-16 | Siemens Aktiengesellschaft | Schaltungsträger, package und verfahren zu ihrer herstellung |
US10995931B1 (en) | 2020-08-06 | 2021-05-04 | Automated Assembly Corporation | SSL lighting apparatus |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0437596A (ja) | 1990-06-01 | 1992-02-07 | Toshiba Corp | 配線基板装置 |
EP1271669A3 (en) * | 1994-09-06 | 2005-01-26 | Koninklijke Philips Electronics N.V. | Electroluminescent device comprising a transparent structured electrode layer made from a conductive polymer |
US6274224B1 (en) | 1999-02-01 | 2001-08-14 | 3M Innovative Properties Company | Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article |
US6383005B2 (en) | 1999-12-07 | 2002-05-07 | Urex Precision, Inc. | Integrated circuit socket with contact pad |
US6710456B1 (en) * | 2000-08-31 | 2004-03-23 | Micron Technology, Inc. | Composite interposer for BGA packages |
US6799902B2 (en) | 2000-12-26 | 2004-10-05 | Emcore Corporation | Optoelectronic mounting structure |
US6541800B2 (en) | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
US6777870B2 (en) | 2001-06-29 | 2004-08-17 | Intel Corporation | Array of thermally conductive elements in an oled display |
US6577492B2 (en) | 2001-07-10 | 2003-06-10 | 3M Innovative Properties Company | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
US20030063465A1 (en) | 2001-09-28 | 2003-04-03 | Mcmillan Richard K. | Etched metal light reflector for vehicle feature illumination |
US6657297B1 (en) | 2002-08-15 | 2003-12-02 | The Bergquist Company | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads |
CN1601768A (zh) * | 2003-09-22 | 2005-03-30 | 福建省苍乐电子企业有限公司 | 一种发光二极管结构 |
US20050116235A1 (en) * | 2003-12-02 | 2005-06-02 | Schultz John C. | Illumination assembly |
DE102004016847A1 (de) * | 2004-04-07 | 2005-12-22 | P.M.C. Projekt Management Consult Gmbh | Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung |
US7997771B2 (en) | 2004-06-01 | 2011-08-16 | 3M Innovative Properties Company | LED array systems |
US7201497B2 (en) | 2004-07-15 | 2007-04-10 | Lumination, Llc | Led lighting system with reflective board |
US7303315B2 (en) | 2004-11-05 | 2007-12-04 | 3M Innovative Properties Company | Illumination assembly using circuitized strips |
-
2007
- 2007-01-26 EP EP07762789A patent/EP1996860A2/en not_active Withdrawn
- 2007-01-26 CN CN200780004037XA patent/CN101379344B/zh not_active Expired - Fee Related
- 2007-01-26 JP JP2008553272A patent/JP2009525614A/ja not_active Withdrawn
- 2007-01-26 KR KR1020087018759A patent/KR101347486B1/ko not_active IP Right Cessation
- 2007-01-26 WO PCT/US2007/002195 patent/WO2007089599A2/en active Application Filing
- 2007-01-30 TW TW096103377A patent/TW200734750A/zh unknown
- 2007-01-31 US US11/669,622 patent/US7572031B2/en not_active Expired - Fee Related
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