JP2009525614A5 - - Google Patents

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Publication number
JP2009525614A5
JP2009525614A5 JP2008553272A JP2008553272A JP2009525614A5 JP 2009525614 A5 JP2009525614 A5 JP 2009525614A5 JP 2008553272 A JP2008553272 A JP 2008553272A JP 2008553272 A JP2008553272 A JP 2008553272A JP 2009525614 A5 JP2009525614 A5 JP 2009525614A5
Authority
JP
Japan
Prior art keywords
insulating layer
substrate
conductive
particles
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008553272A
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English (en)
Other versions
JP2009525614A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2007/002195 external-priority patent/WO2007089599A2/en
Publication of JP2009525614A publication Critical patent/JP2009525614A/ja
Publication of JP2009525614A5 publication Critical patent/JP2009525614A5/ja
Withdrawn legal-status Critical Current

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Claims (1)

  1. 電気絶縁層で隔てられている第1及び第2の導電フォイルを備えるコンプライアント基板であって、前記絶縁層の熱伝導率を高める粒子で充填されているポリマー材料を前記絶縁層が含む、コンプライアント基板と、
    前記第1の導電フォイルの上に配置される複数のLEDダイと
    を備える照明アセンブリ。
JP2008553272A 2006-01-31 2007-01-26 コンプライアントなフォイル構造を有するled照明アセンブリ Withdrawn JP2009525614A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US74319506P 2006-01-31 2006-01-31
PCT/US2007/002195 WO2007089599A2 (en) 2006-01-31 2007-01-26 Led illumination assembly with compliant foil construction

Publications (2)

Publication Number Publication Date
JP2009525614A JP2009525614A (ja) 2009-07-09
JP2009525614A5 true JP2009525614A5 (ja) 2010-03-18

Family

ID=38137663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008553272A Withdrawn JP2009525614A (ja) 2006-01-31 2007-01-26 コンプライアントなフォイル構造を有するled照明アセンブリ

Country Status (7)

Country Link
US (1) US7572031B2 (ja)
EP (1) EP1996860A2 (ja)
JP (1) JP2009525614A (ja)
KR (1) KR101347486B1 (ja)
CN (1) CN101379344B (ja)
TW (1) TW200734750A (ja)
WO (1) WO2007089599A2 (ja)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9951438B2 (en) 2006-03-07 2018-04-24 Samsung Electronics Co., Ltd. Compositions, optical component, system including an optical component, devices, and other products
KR20080006304A (ko) * 2006-07-12 2008-01-16 삼성전자주식회사 유기 발광 표시 장치 및 그 제조 방법
DE102007004303A1 (de) 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
US8439252B2 (en) * 2006-11-07 2013-05-14 Excelitas Technologies Gmbh & Co Kg Method for bonding metal surfaces, method for producing an object having cavities, object having cavities, structure of a light emitting diode
KR101672553B1 (ko) 2007-06-25 2016-11-03 큐디 비젼, 인크. 조성물 및 나노물질의 침착을 포함하는 방법
WO2009014707A2 (en) * 2007-07-23 2009-01-29 Qd Vision, Inc. Quantum dot light enhancement substrate and lighting device including same
DE102007043904A1 (de) * 2007-09-14 2009-03-19 Osram Gesellschaft mit beschränkter Haftung Leucht-Vorrichtung
DE102007043903A1 (de) * 2007-09-14 2009-03-26 Osram Gesellschaft mit beschränkter Haftung Leucht-Vorrichtung
DE102007046520A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Lichtemittierendes Flächenelement und Verfahren zum Herstellen eines lichtemittierenden Flächenelementes
WO2009137053A1 (en) 2008-05-06 2009-11-12 Qd Vision, Inc. Optical components, systems including an optical component, and devices
US9207385B2 (en) 2008-05-06 2015-12-08 Qd Vision, Inc. Lighting systems and devices including same
JP2011524064A (ja) 2008-05-06 2011-08-25 キユーデイー・ビジヨン・インコーポレーテツド 量子閉じ込め半導体ナノ粒子を含有する固体照明装置
US8022626B2 (en) * 2008-09-16 2011-09-20 Osram Sylvania Inc. Lighting module
DE102009019412A1 (de) 2009-04-29 2010-11-04 Fa. Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren
WO2011020098A1 (en) 2009-08-14 2011-02-17 Qd Vision, Inc. Lighting devices, an optical component for a lighting device, and methods
KR101081069B1 (ko) * 2009-12-21 2011-11-07 엘지이노텍 주식회사 발광소자 및 그를 이용한 라이트 유닛
JP5555038B2 (ja) * 2010-04-13 2014-07-23 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
US9797580B2 (en) * 2010-05-24 2017-10-24 Abl Ip Holding Llc LED light fixture
WO2012061182A1 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device with wire bond free die
KR20130132828A (ko) 2010-11-03 2013-12-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 중합체 에칭제 및 그의 사용 방법
WO2012061184A1 (en) * 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device and method of making
GB2484152B (en) * 2010-12-03 2015-03-25 Zeta Specialist Lighting Methods of manufacturing electrical devices such as electric lamps
US9151463B2 (en) 2010-12-29 2015-10-06 3M Innovative Properties Company LED color combiner
JP6104174B2 (ja) 2010-12-29 2017-03-29 スリーエム イノベイティブ プロパティズ カンパニー リモート蛍光体led構造
JP2013157592A (ja) * 2012-01-05 2013-08-15 Canon Components Inc 発光素子実装用フレキシブル回路基板
US9232634B2 (en) 2011-01-17 2016-01-05 Canon Components, Inc. Flexible circuit board for mounting light emitting element, illumination apparatus, and vehicle lighting apparatus
JP5228089B2 (ja) * 2011-07-06 2013-07-03 シャープ株式会社 発光装置および表示装置
JP5175956B2 (ja) * 2011-07-06 2013-04-03 シャープ株式会社 発光装置および表示装置
US8322906B2 (en) 2011-08-08 2012-12-04 XtraLight Manufacturing Partnership Ltd Versatile lighting units
CN102612254A (zh) * 2011-08-10 2012-07-25 田茂福 散热型led柔性线路板
JP2014531109A (ja) * 2011-08-29 2014-11-20 コーニンクレッカ フィリップス エヌ ヴェ 柔軟な照明アセンブリ、照明器具、及び柔軟層を製造する方法。
DE102011086168B4 (de) 2011-11-11 2023-05-04 Pictiva Displays International Limited Organisches Licht emittierendes Bauelement und Verfahren zur Herstellung eines organischen optoelektronischen Bauelements
US9929325B2 (en) 2012-06-05 2018-03-27 Samsung Electronics Co., Ltd. Lighting device including quantum dots
US20140055991A1 (en) * 2012-08-23 2014-02-27 Forrest Starnes McCanless Printed Circuit Boards with Deformations
JP6150050B2 (ja) * 2012-12-07 2017-06-21 東芝ライテック株式会社 発光装置及び照明装置
CN103855142B (zh) * 2012-12-04 2017-12-29 东芝照明技术株式会社 发光装置及照明装置
US9091400B2 (en) * 2013-01-30 2015-07-28 Luxo-Led Co., Limited Multi-color light emitting diode device
KR102026120B1 (ko) * 2013-04-17 2019-11-04 엘지이노텍 주식회사 발광장치
US9644829B2 (en) 2013-04-25 2017-05-09 Xtralight Manufacturing, Ltd. Systems and methods for providing a field repairable light fixture with a housing that dissipates heat
JP6255747B2 (ja) 2013-07-01 2018-01-10 日亜化学工業株式会社 発光装置
US9335034B2 (en) 2013-09-27 2016-05-10 Osram Sylvania Inc Flexible circuit board for electronic applications, light source containing same, and method of making
US10032753B2 (en) * 2014-06-20 2018-07-24 Grote Industries, Llc Flexible lighting device having both visible and infrared light-emitting diodes
JP6779201B2 (ja) * 2014-08-08 2020-11-04 ルミレッズ ホールディング ベーフェー 柔軟設計のledデバイスを提供する方法
JP2017152450A (ja) * 2016-02-22 2017-08-31 大日本印刷株式会社 Led表示装置
US10408391B2 (en) 2016-11-30 2019-09-10 Tactotek Oy Illuminated structure and related method of manufacture
US10317614B1 (en) * 2017-03-14 2019-06-11 Automatad Assembly Corporation SSL lighting apparatus
US10767840B2 (en) 2017-05-01 2020-09-08 Riverpoint Medical, Llc Focused LED headlamp with iris assembly
US10174912B1 (en) * 2017-05-01 2019-01-08 R Iverpoint Medical, Llc Focused LED headlamp with iris assembly
JP6898203B2 (ja) * 2017-10-27 2021-07-07 株式会社 日立パワーデバイス パワー半導体モジュール
US10655823B1 (en) 2019-02-04 2020-05-19 Automated Assembly Corporation SSL lighting apparatus
TWI784175B (zh) * 2019-06-14 2022-11-21 培英半導體有限公司 以雷射開窗形成光學擋牆的方法及光學擋牆結構
EP3799539B1 (de) 2019-09-27 2022-03-16 Siemens Aktiengesellschaft Schaltungsträger, package und verfahren zu ihrer herstellung
US10995931B1 (en) 2020-08-06 2021-05-04 Automated Assembly Corporation SSL lighting apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0437596A (ja) 1990-06-01 1992-02-07 Toshiba Corp 配線基板装置
EP1271669A3 (en) * 1994-09-06 2005-01-26 Koninklijke Philips Electronics N.V. Electroluminescent device comprising a transparent structured electrode layer made from a conductive polymer
US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6383005B2 (en) 1999-12-07 2002-05-07 Urex Precision, Inc. Integrated circuit socket with contact pad
US6710456B1 (en) * 2000-08-31 2004-03-23 Micron Technology, Inc. Composite interposer for BGA packages
US6799902B2 (en) 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US6541800B2 (en) 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
US6777870B2 (en) 2001-06-29 2004-08-17 Intel Corporation Array of thermally conductive elements in an oled display
US6577492B2 (en) 2001-07-10 2003-06-10 3M Innovative Properties Company Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
US20030063465A1 (en) 2001-09-28 2003-04-03 Mcmillan Richard K. Etched metal light reflector for vehicle feature illumination
US6657297B1 (en) 2002-08-15 2003-12-02 The Bergquist Company Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
CN1601768A (zh) * 2003-09-22 2005-03-30 福建省苍乐电子企业有限公司 一种发光二极管结构
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
DE102004016847A1 (de) * 2004-04-07 2005-12-22 P.M.C. Projekt Management Consult Gmbh Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung
US7997771B2 (en) 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
US7201497B2 (en) 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
US7303315B2 (en) 2004-11-05 2007-12-04 3M Innovative Properties Company Illumination assembly using circuitized strips

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