TW200734750A - LED illumination assembly with compliant foil construction - Google Patents

LED illumination assembly with compliant foil construction

Info

Publication number
TW200734750A
TW200734750A TW096103377A TW96103377A TW200734750A TW 200734750 A TW200734750 A TW 200734750A TW 096103377 A TW096103377 A TW 096103377A TW 96103377 A TW96103377 A TW 96103377A TW 200734750 A TW200734750 A TW 200734750A
Authority
TW
Taiwan
Prior art keywords
illumination assembly
led illumination
compliant foil
insulating layer
foil construction
Prior art date
Application number
TW096103377A
Other languages
English (en)
Inventor
John Charles Schultz
Nelson Boyd O'bryan Jr
Andrew John Ouderkirk
John Allen Wheatley
Joel Steven Peiffer
Cameron Taylor Murray
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200734750A publication Critical patent/TW200734750A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Laminated Bodies (AREA)
TW096103377A 2006-01-31 2007-01-30 LED illumination assembly with compliant foil construction TW200734750A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74319506P 2006-01-31 2006-01-31

Publications (1)

Publication Number Publication Date
TW200734750A true TW200734750A (en) 2007-09-16

Family

ID=38137663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096103377A TW200734750A (en) 2006-01-31 2007-01-30 LED illumination assembly with compliant foil construction

Country Status (7)

Country Link
US (1) US7572031B2 (zh)
EP (1) EP1996860A2 (zh)
JP (1) JP2009525614A (zh)
KR (1) KR101347486B1 (zh)
CN (1) CN101379344B (zh)
TW (1) TW200734750A (zh)
WO (1) WO2007089599A2 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465806B (zh) * 2011-07-06 2014-12-21 夏普股份有限公司 A light emitting device and a display device
TWI475290B (zh) * 2011-07-06 2015-03-01 夏普股份有限公司 A light emitting device and a display device

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9951438B2 (en) 2006-03-07 2018-04-24 Samsung Electronics Co., Ltd. Compositions, optical component, system including an optical component, devices, and other products
KR20080006304A (ko) * 2006-07-12 2008-01-16 삼성전자주식회사 유기 발광 표시 장치 및 그 제조 방법
DE102007004303A1 (de) * 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
WO2008055616A1 (en) * 2006-11-07 2008-05-15 Perkinelmer Optoelectronics Gmbh & Co. Kg Method for bonding metal surfaces by applying a first oxidised metal layer and a second oxidised metal layer object having cavities or structure of a light emitting diode produced through the last method
WO2009014590A2 (en) 2007-06-25 2009-01-29 Qd Vision, Inc. Compositions and methods including depositing nanomaterial
WO2009014707A2 (en) 2007-07-23 2009-01-29 Qd Vision, Inc. Quantum dot light enhancement substrate and lighting device including same
DE102007043903A1 (de) * 2007-09-14 2009-03-26 Osram Gesellschaft mit beschränkter Haftung Leucht-Vorrichtung
DE102007043904A1 (de) * 2007-09-14 2009-03-19 Osram Gesellschaft mit beschränkter Haftung Leucht-Vorrichtung
DE102007046520A1 (de) * 2007-09-28 2009-04-02 Osram Opto Semiconductors Gmbh Lichtemittierendes Flächenelement und Verfahren zum Herstellen eines lichtemittierenden Flächenelementes
WO2009137053A1 (en) 2008-05-06 2009-11-12 Qd Vision, Inc. Optical components, systems including an optical component, and devices
US9207385B2 (en) 2008-05-06 2015-12-08 Qd Vision, Inc. Lighting systems and devices including same
EP2297762B1 (en) 2008-05-06 2017-03-15 Samsung Electronics Co., Ltd. Solid state lighting devices including quantum confined semiconductor nanoparticles
US8022626B2 (en) * 2008-09-16 2011-09-20 Osram Sylvania Inc. Lighting module
DE102009019412A1 (de) * 2009-04-29 2010-11-04 Fa. Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren
KR20120062773A (ko) 2009-08-14 2012-06-14 큐디 비젼, 인크. 조명 장치, 조명 장치용 광학 요소, 및 방법
KR101081069B1 (ko) * 2009-12-21 2011-11-07 엘지이노텍 주식회사 발광소자 및 그를 이용한 라이트 유닛
JP5555038B2 (ja) * 2010-04-13 2014-07-23 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
US9797580B2 (en) * 2010-05-24 2017-10-24 Abl Ip Holding Llc LED light fixture
WO2012061010A2 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Polymer etchant and method of using same
US9698563B2 (en) 2010-11-03 2017-07-04 3M Innovative Properties Company Flexible LED device and method of making
KR20130143061A (ko) 2010-11-03 2013-12-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 와이어 본드 프리 다이를 사용한 가요성 led 디바이스
GB2484152B (en) * 2010-12-03 2015-03-25 Zeta Specialist Lighting Methods of manufacturing electrical devices such as electric lamps
KR20140004695A (ko) 2010-12-29 2014-01-13 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Ｌｅｄ 색상 조합기
JP6104174B2 (ja) 2010-12-29 2017-03-29 スリーエム イノベイティブ プロパティズ カンパニー リモート蛍光体ｌｅｄ構造
JP2013157592A (ja) * 2012-01-05 2013-08-15 Canon Components Inc 発光素子実装用フレキシブル回路基板
US9232634B2 (en) 2011-01-17 2016-01-05 Canon Components, Inc. Flexible circuit board for mounting light emitting element, illumination apparatus, and vehicle lighting apparatus
US8322906B2 (en) 2011-08-08 2012-12-04 XtraLight Manufacturing Partnership Ltd Versatile lighting units
CN102612254A (zh) * 2011-08-10 2012-07-25 田茂福 散热型led柔性线路板
EP2752101A1 (en) * 2011-08-29 2014-07-09 Koninklijke Philips N.V. A flexible lighting assembly, a luminaire, and a method of manufacturing a flexible layer
DE102011086168B4 (de) 2011-11-11 2023-05-04 Pictiva Displays International Limited Organisches Licht emittierendes Bauelement und Verfahren zur Herstellung eines organischen optoelektronischen Bauelements
US9929325B2 (en) 2012-06-05 2018-03-27 Samsung Electronics Co., Ltd. Lighting device including quantum dots
US20140055991A1 (en) * 2012-08-23 2014-02-27 Forrest Starnes McCanless Printed Circuit Boards with Deformations
CN103855142B (zh) * 2012-12-04 2017-12-29 东芝照明技术株式会社 发光装置及照明装置
JP6150050B2 (ja) * 2012-12-07 2017-06-21 東芝ライテック株式会社 発光装置及び照明装置
US9091400B2 (en) * 2013-01-30 2015-07-28 Luxo-Led Co., Limited Multi-color light emitting diode device
KR102026120B1 (ko) * 2013-04-17 2019-11-04 엘지이노텍 주식회사 발광장치
US9644829B2 (en) 2013-04-25 2017-05-09 Xtralight Manufacturing, Ltd. Systems and methods for providing a field repairable light fixture with a housing that dissipates heat
JP6255747B2 (ja) 2013-07-01 2018-01-10 日亜化学工業株式会社 発光装置
US9335034B2 (en) 2013-09-27 2016-05-10 Osram Sylvania Inc Flexible circuit board for electronic applications, light source containing same, and method of making
US10032753B2 (en) * 2014-06-20 2018-07-24 Grote Industries, Llc Flexible lighting device having both visible and infrared light-emitting diodes
WO2016020218A1 (en) * 2014-08-08 2016-02-11 Koninklijke Philips N.V. Led device with flexible thermal interface
JP2017152450A (ja) * 2016-02-22 2017-08-31 大日本印刷株式会社 Ｌｅｄ表示装置
JP7129975B2 (ja) * 2016-11-30 2022-09-02 タクトテク オーユー 照明構造、および、関連する製造方法
US10317614B1 (en) * 2017-03-14 2019-06-11 Automatad Assembly Corporation SSL lighting apparatus
US10767840B2 (en) 2017-05-01 2020-09-08 Riverpoint Medical, Llc Focused LED headlamp with iris assembly
US10174912B1 (en) * 2017-05-01 2019-01-08 R Iverpoint Medical, Llc Focused LED headlamp with iris assembly
JP6898203B2 (ja) * 2017-10-27 2021-07-07 株式会社 日立パワーデバイス パワー半導体モジュール
US10655823B1 (en) 2019-02-04 2020-05-19 Automated Assembly Corporation SSL lighting apparatus
TWI784175B (zh) * 2019-06-14 2022-11-21 培英半導體有限公司 以雷射開窗形成光學擋牆的方法及光學擋牆結構
EP3799539B1 (de) 2019-09-27 2022-03-16 Siemens Aktiengesellschaft Schaltungsträger, package und verfahren zu ihrer herstellung
US10995931B1 (en) 2020-08-06 2021-05-04 Automated Assembly Corporation SSL lighting apparatus

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0437596A (ja) 1990-06-01 1992-02-07 Toshiba Corp 配線基板装置
EP0727100B1 (en) * 1994-09-06 2003-01-29 Philips Electronics N.V. Electroluminescent device comprising a poly-3,4-dioxythiophene layer
US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6383005B2 (en) 1999-12-07 2002-05-07 Urex Precision, Inc. Integrated circuit socket with contact pad
US6710456B1 (en) * 2000-08-31 2004-03-23 Micron Technology, Inc. Composite interposer for BGA packages
US6799902B2 (en) 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US6541800B2 (en) 2001-02-22 2003-04-01 Weldon Technologies, Inc. High power LED
US6777870B2 (en) 2001-06-29 2004-08-17 Intel Corporation Array of thermally conductive elements in an oled display
US6577492B2 (en) 2001-07-10 2003-06-10 3M Innovative Properties Company Capacitor having epoxy dielectric layer cured with aminophenylfluorenes
US20030063465A1 (en) 2001-09-28 2003-04-03 Mcmillan Richard K. Etched metal light reflector for vehicle feature illumination
US6657297B1 (en) 2002-08-15 2003-12-02 The Bergquist Company Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads
CN1601768A (zh) * 2003-09-22 2005-03-30 福建省苍乐电子企业有限公司 一种发光二极管结构
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
DE102004016847A1 (de) * 2004-04-07 2005-12-22 P.M.C. Projekt Management Consult Gmbh Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung
US7997771B2 (en) 2004-06-01 2011-08-16 3M Innovative Properties Company LED array systems
US7201497B2 (en) 2004-07-15 2007-04-10 Lumination, Llc Led lighting system with reflective board
US7303315B2 (en) 2004-11-05 2007-12-04 3M Innovative Properties Company Illumination assembly using circuitized strips

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465806B (zh) * 2011-07-06 2014-12-21 夏普股份有限公司 A light emitting device and a display device
TWI475290B (zh) * 2011-07-06 2015-03-01 夏普股份有限公司 A light emitting device and a display device

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WO2007089599A2 (en) 2007-08-09
CN101379344A (zh) 2009-03-04
KR20080091784A (ko) 2008-10-14
JP2009525614A (ja) 2009-07-09
US20070177380A1 (en) 2007-08-02
US7572031B2 (en) 2009-08-11
WO2007089599A3 (en) 2007-12-13
CN101379344B (zh) 2013-08-28
EP1996860A2 (en) 2008-12-03
KR101347486B1 (ko) 2014-01-02

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