JP6104174B2 - リモート蛍光体led構造 - Google Patents
リモート蛍光体led構造 Download PDFInfo
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- JP6104174B2 JP6104174B2 JP2013547527A JP2013547527A JP6104174B2 JP 6104174 B2 JP6104174 B2 JP 6104174B2 JP 2013547527 A JP2013547527 A JP 2013547527A JP 2013547527 A JP2013547527 A JP 2013547527A JP 6104174 B2 JP6104174 B2 JP 6104174B2
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- 229910005540 GaP Inorganic materials 0.000 description 1
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- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
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- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/141—Beam splitting or combining systems operating by reflection only using dichroic mirrors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Luminescent Compositions (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Optical Filters (AREA)
Description
Claims (8)
- 光源であって、
可撓性基板と、
LED光を放射するように構成され、前記可撓性基材に配置される第1のLEDと、
蛍光体材料の層であって、前記蛍光体材料が前記第1のLED光からの励起に反応して、より長い波長で発光するように構成された蛍光体材料の層と、
光が前記第1のLEDからダイクロイック反射体に伝搬する際に、光が前記蛍光体材料の層を通過せず、前記ダイクロイック反射体がより長い波長の光を実質的に透過させるように、前記第1のLEDによって放射された光の少なくとも第1の部分を前記蛍光体材料の層に反射させるように構成されたダイクロイック反射体と、
を含み、
前記可撓性基材が空洞領域と、隣接する近接領域と、を有する誘電層を含み、前記第1のLEDが前記空洞領域内に配置され、
前記蛍光体材料によって放射されたより長い波長の光を含む広帯域光を放射する、光源。 - 前記第1のLED及び前記蛍光体材料の層が実質的に共面である、請求項1に記載の光源。
- LED光を放射するように構成された第2のLEDを更に含み、
前記第1のLEDと前記第2のLEDの一方が、前記ダイクロイック反射体によって形成される前記第1のLEDと前記第2のLEDの他方の像を遮らないように、前記第1のLEDと前記第2のLEDは配置されている、請求項1に記載の光源。 - 前記基材に配置される第2のLEDを更に含む、請求項2に記載の光源。
- 前記空洞領域が、前記誘電層を貫通して延在する穴によって特徴付けられる、請求項1に記載の光源。
- 前記基材が前記誘電層に配置された導電性材料を更に含み、前記LEDが前記導電性材料上に配置され、前記導電性材料が前記誘電層の第1の側面に配置され、前記基材が、前記第1の側面と反対側の前記誘電層の第2の側面に配置される熱伝導層を更に含む、請求項1に記載の光源。
- 前記第1のLEDが青色光を放射し、前記ダイクロイック反射体が前記第1のLEDによって放射された光の第2の部分を透過させるように構成され、前記光源によって放射された前記広帯域光が白色光を含み、前記LEDによって放射された光の第2の部分と、前記蛍光体材料によって放射されたより長い波長の光と、の結合光を含む、請求項1に記載の光源。
- 前記第1のLEDが紫外線を放射し、前記ダイクロイック反射体が前記第1のLEDによって放射された光をほとんど透過させないか、全く透過させないように構成され、前記光源によって放射された前記広帯域光が白色光を含み、前記蛍光体材料によって放射されたより長い波長の光を含み、前記第1のLEDによって放射された光をほとんど含まないか、全く含まない、請求項1に記載の光源。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201061428034P | 2010-12-29 | 2010-12-29 | |
US61/428,034 | 2010-12-29 | ||
PCT/US2011/065775 WO2012091971A1 (en) | 2010-12-29 | 2011-12-19 | Remote phosphor led constructions |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016160834A Division JP2016197756A (ja) | 2010-12-29 | 2016-08-18 | リモート蛍光体led構造 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014508398A JP2014508398A (ja) | 2014-04-03 |
JP2014508398A5 JP2014508398A5 (ja) | 2015-02-05 |
JP6104174B2 true JP6104174B2 (ja) | 2017-03-29 |
Family
ID=45496281
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013547527A Expired - Fee Related JP6104174B2 (ja) | 2010-12-29 | 2011-12-19 | リモート蛍光体led構造 |
JP2016160834A Pending JP2016197756A (ja) | 2010-12-29 | 2016-08-18 | リモート蛍光体led構造 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016160834A Pending JP2016197756A (ja) | 2010-12-29 | 2016-08-18 | リモート蛍光体led構造 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8912562B2 (ja) |
JP (2) | JP6104174B2 (ja) |
KR (1) | KR20130128445A (ja) |
CN (1) | CN103283048B (ja) |
TW (1) | TWI545811B (ja) |
WO (1) | WO2012091971A1 (ja) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103283048B (zh) | 2010-12-29 | 2017-04-12 | 3M创新有限公司 | 远程荧光粉led的构造 |
KR101913878B1 (ko) | 2010-12-29 | 2018-10-31 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 원격 인광체 led 소자를 위한 인광체 반사기 조립체 |
CN103299422B (zh) | 2010-12-29 | 2016-11-02 | 3M创新有限公司 | 具有宽带输出和可控颜色的远程荧光粉led装置 |
US9151463B2 (en) | 2010-12-29 | 2015-10-06 | 3M Innovative Properties Company | LED color combiner |
US10147853B2 (en) | 2011-03-18 | 2018-12-04 | Cree, Inc. | Encapsulant with index matched thixotropic agent |
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CN104541382B (zh) | 2012-06-01 | 2017-05-17 | 3M创新有限公司 | 使用远程荧光粉led和直接发射led组合的混合灯泡 |
US10424702B2 (en) | 2012-06-11 | 2019-09-24 | Cree, Inc. | Compact LED package with reflectivity layer |
US20130328074A1 (en) * | 2012-06-11 | 2013-12-12 | Cree, Inc. | Led package with multiple element light source and encapsulant having planar surfaces |
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US9818919B2 (en) | 2012-06-11 | 2017-11-14 | Cree, Inc. | LED package with multiple element light source and encapsulant having planar surfaces |
US10468565B2 (en) | 2012-06-11 | 2019-11-05 | Cree, Inc. | LED package with multiple element light source and encapsulant having curved and/or planar surfaces |
US9559272B2 (en) | 2012-09-13 | 2017-01-31 | 3M Innovative Properties Company | Efficient lighting system with wide color range |
TWM458672U (zh) * | 2013-04-10 | 2013-08-01 | Genesis Photonics Inc | 光源模組 |
JPWO2015072319A1 (ja) * | 2013-11-13 | 2017-03-16 | 日本電気硝子株式会社 | プロジェクター用蛍光ホイール及びプロジェクター用発光デバイス |
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US10680208B2 (en) | 2015-03-11 | 2020-06-09 | National Taiwan University | Electroluminescent device and display pixel structure using the same |
US20160268554A1 (en) * | 2015-03-11 | 2016-09-15 | National Taiwan University | Electroluminescent devices with improved optical out-coupling efficiencies |
CN107045254B (zh) * | 2016-02-05 | 2019-01-15 | 精工爱普生株式会社 | 波长转换元件、光源装置和投影仪 |
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TW201240163A (en) | 2012-10-01 |
JP2016197756A (ja) | 2016-11-24 |
TWI545811B (zh) | 2016-08-11 |
JP2014508398A (ja) | 2014-04-03 |
WO2012091971A1 (en) | 2012-07-05 |
US20150084500A1 (en) | 2015-03-26 |
US9360176B2 (en) | 2016-06-07 |
KR20130128445A (ko) | 2013-11-26 |
CN103283048B (zh) | 2017-04-12 |
CN103283048A (zh) | 2013-09-04 |
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