JP2009521122A - Ｌｅｄサブマウントのための多孔質回路材料 - Google Patents

Ｌｅｄサブマウントのための多孔質回路材料 Download PDF

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Publication number
JP2009521122A
JP2009521122A JP2008546702A JP2008546702A JP2009521122A JP 2009521122 A JP2009521122 A JP 2009521122A JP 2008546702 A JP2008546702 A JP 2008546702A JP 2008546702 A JP2008546702 A JP 2008546702A JP 2009521122 A JP2009521122 A JP 2009521122A
Authority
JP
Japan
Prior art keywords
noble metal
submount
circuit
substrate
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2008546702A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009521122A5 (https=
Inventor
ルーカス イェー アー エム ベッカーズ
オス クン ファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2009521122A publication Critical patent/JP2009521122A/ja
Publication of JP2009521122A5 publication Critical patent/JP2009521122A5/ja
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
JP2008546702A 2005-12-22 2006-11-28 Ｌｅｄサブマウントのための多孔質回路材料 Abandoned JP2009521122A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05112772 2005-12-22
PCT/IB2006/054471 WO2007072249A2 (en) 2005-12-22 2006-11-28 Porous circuitry material for led submounts

Publications (2)

Publication Number Publication Date
JP2009521122A true JP2009521122A (ja) 2009-05-28
JP2009521122A5 JP2009521122A5 (https=) 2010-01-21

Family

ID=38055532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008546702A Abandoned JP2009521122A (ja) 2005-12-22 2006-11-28 Ｌｅｄサブマウントのための多孔質回路材料

Country Status (7)

Country Link
US (1) US20080315238A1 (https=)
EP (1) EP1967053A2 (https=)
JP (1) JP2009521122A (https=)
KR (1) KR20080081331A (https=)
CN (1) CN101341803A (https=)
TW (1) TW200739953A (https=)
WO (1) WO2007072249A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174927A (ja) * 2011-02-22 2012-09-10 Fujitsu Ltd 半導体装置及びその製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101873220B1 (ko) * 2012-03-14 2018-07-05 삼성전자주식회사 발광소자 모듈을 위한 발광소자 접합 방법
TWI566677B (zh) * 2014-07-10 2017-01-11 遠東科技大學 導熱輻射基板及反射式輻射散熱發光件
CN104934518B (zh) * 2015-05-14 2017-07-21 江苏有能新能源有限公司 一种石英陶瓷led光源封装基座及其制备工艺
KR102391610B1 (ko) * 2017-08-04 2022-04-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지 및 광원 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793946A (en) * 1986-10-06 1988-12-27 Engelhard Corporation Thin print etchable gold conductor composition
JPH02234308A (ja) * 1989-03-07 1990-09-17 Sumitomo Metal Mining Co Ltd 導電性被膜形成用組成物
US5429670A (en) * 1993-04-26 1995-07-04 Matsushita Electric Industrial Co., Ltd. Gold paste for a ceramic circuit board
JPH11120818A (ja) * 1997-10-16 1999-04-30 Tdk Corp 導電体ペーストおよびそれを用いた非可逆回路素子
TW465123B (en) * 2000-02-02 2001-11-21 Ind Tech Res Inst High power white light LED
JP3476770B2 (ja) * 2000-12-18 2003-12-10 科学技術振興事業団 電気自動車の制御装置
US7115218B2 (en) * 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
US6998777B2 (en) * 2002-12-24 2006-02-14 Toyoda Gosei Co., Ltd. Light emitting diode and light emitting diode array
CN102290409B (zh) * 2003-04-01 2014-01-15 夏普株式会社 发光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174927A (ja) * 2011-02-22 2012-09-10 Fujitsu Ltd 半導体装置及びその製造方法

Also Published As

Publication number Publication date
WO2007072249A3 (en) 2008-02-28
EP1967053A2 (en) 2008-09-10
TW200739953A (en) 2007-10-16
US20080315238A1 (en) 2008-12-25
KR20080081331A (ko) 2008-09-09
WO2007072249A2 (en) 2007-06-28
CN101341803A (zh) 2009-01-07

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