TW200739953A - Porous circuitry material for LED submounts - Google Patents

Porous circuitry material for LED submounts

Info

Publication number
TW200739953A
TW200739953A TW095147644A TW95147644A TW200739953A TW 200739953 A TW200739953 A TW 200739953A TW 095147644 A TW095147644 A TW 095147644A TW 95147644 A TW95147644 A TW 95147644A TW 200739953 A TW200739953 A TW 200739953A
Authority
TW
Taiwan
Prior art keywords
porous
electrically conducting
led submounts
circuitry material
ceramic substrate
Prior art date
Application number
TW095147644A
Other languages
English (en)
Chinese (zh)
Inventor
Lucas Johannes Anna Maria Beckers
Os Koen Van
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200739953A publication Critical patent/TW200739953A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
TW095147644A 2005-12-22 2006-12-19 Porous circuitry material for LED submounts TW200739953A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05112772 2005-12-22

Publications (1)

Publication Number Publication Date
TW200739953A true TW200739953A (en) 2007-10-16

Family

ID=38055532

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147644A TW200739953A (en) 2005-12-22 2006-12-19 Porous circuitry material for LED submounts

Country Status (7)

Country Link
US (1) US20080315238A1 (https=)
EP (1) EP1967053A2 (https=)
JP (1) JP2009521122A (https=)
KR (1) KR20080081331A (https=)
CN (1) CN101341803A (https=)
TW (1) TW200739953A (https=)
WO (1) WO2007072249A2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174927A (ja) * 2011-02-22 2012-09-10 Fujitsu Ltd 半導体装置及びその製造方法
KR101873220B1 (ko) * 2012-03-14 2018-07-05 삼성전자주식회사 발광소자 모듈을 위한 발광소자 접합 방법
TWI566677B (zh) * 2014-07-10 2017-01-11 遠東科技大學 導熱輻射基板及反射式輻射散熱發光件
CN104934518B (zh) * 2015-05-14 2017-07-21 江苏有能新能源有限公司 一种石英陶瓷led光源封装基座及其制备工艺
KR102391610B1 (ko) * 2017-08-04 2022-04-28 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지 및 광원 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793946A (en) * 1986-10-06 1988-12-27 Engelhard Corporation Thin print etchable gold conductor composition
JPH02234308A (ja) * 1989-03-07 1990-09-17 Sumitomo Metal Mining Co Ltd 導電性被膜形成用組成物
US5429670A (en) * 1993-04-26 1995-07-04 Matsushita Electric Industrial Co., Ltd. Gold paste for a ceramic circuit board
JPH11120818A (ja) * 1997-10-16 1999-04-30 Tdk Corp 導電体ペーストおよびそれを用いた非可逆回路素子
TW465123B (en) * 2000-02-02 2001-11-21 Ind Tech Res Inst High power white light LED
JP3476770B2 (ja) * 2000-12-18 2003-12-10 科学技術振興事業団 電気自動車の制御装置
US7115218B2 (en) * 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
US6998777B2 (en) * 2002-12-24 2006-02-14 Toyoda Gosei Co., Ltd. Light emitting diode and light emitting diode array
CN102290409B (zh) * 2003-04-01 2014-01-15 夏普株式会社 发光装置

Also Published As

Publication number Publication date
WO2007072249A3 (en) 2008-02-28
EP1967053A2 (en) 2008-09-10
US20080315238A1 (en) 2008-12-25
KR20080081331A (ko) 2008-09-09
JP2009521122A (ja) 2009-05-28
WO2007072249A2 (en) 2007-06-28
CN101341803A (zh) 2009-01-07

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