KR20080081331A - 서브마운트, 서브마운트의 제조방법, 서브마운트의 이용,및 발광장치 - Google Patents

서브마운트, 서브마운트의 제조방법, 서브마운트의 이용,및 발광장치 Download PDF

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Publication number
KR20080081331A
KR20080081331A KR1020087017809A KR20087017809A KR20080081331A KR 20080081331 A KR20080081331 A KR 20080081331A KR 1020087017809 A KR1020087017809 A KR 1020087017809A KR 20087017809 A KR20087017809 A KR 20087017809A KR 20080081331 A KR20080081331 A KR 20080081331A
Authority
KR
South Korea
Prior art keywords
submount
circuit
light emitting
ceramic substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020087017809A
Other languages
English (en)
Korean (ko)
Inventor
루카스 제이. 에이. 엠. 베커스
코엔 반 오스
Original Assignee
코닌클리즈케 필립스 일렉트로닉스 엔.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코닌클리즈케 필립스 일렉트로닉스 엔.브이. filed Critical 코닌클리즈케 필립스 일렉트로닉스 엔.브이.
Publication of KR20080081331A publication Critical patent/KR20080081331A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Led Device Packages (AREA)
KR1020087017809A 2005-12-22 2006-11-28 서브마운트, 서브마운트의 제조방법, 서브마운트의 이용,및 발광장치 Withdrawn KR20080081331A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05112772 2005-12-22
EP05112772.8 2005-12-22

Publications (1)

Publication Number Publication Date
KR20080081331A true KR20080081331A (ko) 2008-09-09

Family

ID=38055532

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087017809A Withdrawn KR20080081331A (ko) 2005-12-22 2006-11-28 서브마운트, 서브마운트의 제조방법, 서브마운트의 이용,및 발광장치

Country Status (7)

Country Link
US (1) US20080315238A1 (https=)
EP (1) EP1967053A2 (https=)
JP (1) JP2009521122A (https=)
KR (1) KR20080081331A (https=)
CN (1) CN101341803A (https=)
TW (1) TW200739953A (https=)
WO (1) WO2007072249A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019027192A1 (ko) * 2017-08-04 2019-02-07 엘지이노텍 주식회사 반도체 소자 패키지 및 광원 장치

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012174927A (ja) * 2011-02-22 2012-09-10 Fujitsu Ltd 半導体装置及びその製造方法
KR101873220B1 (ko) * 2012-03-14 2018-07-05 삼성전자주식회사 발광소자 모듈을 위한 발광소자 접합 방법
TWI566677B (zh) * 2014-07-10 2017-01-11 遠東科技大學 導熱輻射基板及反射式輻射散熱發光件
CN104934518B (zh) * 2015-05-14 2017-07-21 江苏有能新能源有限公司 一种石英陶瓷led光源封装基座及其制备工艺

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4793946A (en) * 1986-10-06 1988-12-27 Engelhard Corporation Thin print etchable gold conductor composition
JPH02234308A (ja) * 1989-03-07 1990-09-17 Sumitomo Metal Mining Co Ltd 導電性被膜形成用組成物
US5429670A (en) * 1993-04-26 1995-07-04 Matsushita Electric Industrial Co., Ltd. Gold paste for a ceramic circuit board
JPH11120818A (ja) * 1997-10-16 1999-04-30 Tdk Corp 導電体ペーストおよびそれを用いた非可逆回路素子
TW465123B (en) * 2000-02-02 2001-11-21 Ind Tech Res Inst High power white light LED
JP3476770B2 (ja) * 2000-12-18 2003-12-10 科学技術振興事業団 電気自動車の制御装置
US7115218B2 (en) * 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
US6998777B2 (en) * 2002-12-24 2006-02-14 Toyoda Gosei Co., Ltd. Light emitting diode and light emitting diode array
CN102290409B (zh) * 2003-04-01 2014-01-15 夏普株式会社 发光装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019027192A1 (ko) * 2017-08-04 2019-02-07 엘지이노텍 주식회사 반도체 소자 패키지 및 광원 장치
KR20190014957A (ko) * 2017-08-04 2019-02-13 엘지이노텍 주식회사 반도체 소자 패키지 및 광원 장치
US11302853B2 (en) 2017-08-04 2022-04-12 Suzhou Lekin Semiconductor Co., Ltd. Semiconductor device package and light source device
KR20220059448A (ko) * 2017-08-04 2022-05-10 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지 및 광원 장치

Also Published As

Publication number Publication date
WO2007072249A3 (en) 2008-02-28
EP1967053A2 (en) 2008-09-10
TW200739953A (en) 2007-10-16
US20080315238A1 (en) 2008-12-25
JP2009521122A (ja) 2009-05-28
WO2007072249A2 (en) 2007-06-28
CN101341803A (zh) 2009-01-07

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Date Code Title Description
PA0105 International application

Patent event date: 20080721

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid