JP2009521122A5 - - Google Patents
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- Publication number
- JP2009521122A5 JP2009521122A5 JP2008546702A JP2008546702A JP2009521122A5 JP 2009521122 A5 JP2009521122 A5 JP 2009521122A5 JP 2008546702 A JP2008546702 A JP 2008546702A JP 2008546702 A JP2008546702 A JP 2008546702A JP 2009521122 A5 JP2009521122 A5 JP 2009521122A5
- Authority
- JP
- Japan
- Prior art keywords
- noble metal
- submount
- light
- ceramic substrate
- porous material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229910000510 noble metal Inorganic materials 0.000 claims 19
- 238000000034 method Methods 0.000 claims 13
- 239000000919 ceramic Substances 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 8
- 239000011148 porous material Substances 0.000 claims 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- 229910052709 silver Inorganic materials 0.000 claims 4
- 239000004332 silver Substances 0.000 claims 4
- 229910052720 vanadium Inorganic materials 0.000 claims 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 4
- 239000007788 liquid Substances 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 229910052787 antimony Inorganic materials 0.000 claims 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 2
- 229910052785 arsenic Inorganic materials 0.000 claims 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 claims 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910052702 rhenium Inorganic materials 0.000 claims 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims 2
- 229910052714 tellurium Inorganic materials 0.000 claims 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05112772 | 2005-12-22 | ||
| PCT/IB2006/054471 WO2007072249A2 (en) | 2005-12-22 | 2006-11-28 | Porous circuitry material for led submounts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009521122A JP2009521122A (ja) | 2009-05-28 |
| JP2009521122A5 true JP2009521122A5 (https=) | 2010-01-21 |
Family
ID=38055532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008546702A Abandoned JP2009521122A (ja) | 2005-12-22 | 2006-11-28 | Ｌｅｄサブマウントのための多孔質回路材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20080315238A1 (https=) |
| EP (1) | EP1967053A2 (https=) |
| JP (1) | JP2009521122A (https=) |
| KR (1) | KR20080081331A (https=) |
| CN (1) | CN101341803A (https=) |
| TW (1) | TW200739953A (https=) |
| WO (1) | WO2007072249A2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174927A (ja) * | 2011-02-22 | 2012-09-10 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| KR101873220B1 (ko) * | 2012-03-14 | 2018-07-05 | 삼성전자주식회사 | 발광소자 모듈을 위한 발광소자 접합 방법 |
| TWI566677B (zh) * | 2014-07-10 | 2017-01-11 | 遠東科技大學 | 導熱輻射基板及反射式輻射散熱發光件 |
| CN104934518B (zh) * | 2015-05-14 | 2017-07-21 | 江苏有能新能源有限公司 | 一种石英陶瓷led光源封装基座及其制备工艺 |
| KR102391610B1 (ko) * | 2017-08-04 | 2022-04-28 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 패키지 및 광원 장치 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4793946A (en) * | 1986-10-06 | 1988-12-27 | Engelhard Corporation | Thin print etchable gold conductor composition |
| JPH02234308A (ja) * | 1989-03-07 | 1990-09-17 | Sumitomo Metal Mining Co Ltd | 導電性被膜形成用組成物 |
| US5429670A (en) * | 1993-04-26 | 1995-07-04 | Matsushita Electric Industrial Co., Ltd. | Gold paste for a ceramic circuit board |
| JPH11120818A (ja) * | 1997-10-16 | 1999-04-30 | Tdk Corp | 導電体ペーストおよびそれを用いた非可逆回路素子 |
| TW465123B (en) * | 2000-02-02 | 2001-11-21 | Ind Tech Res Inst | High power white light LED |
| JP3476770B2 (ja) * | 2000-12-18 | 2003-12-10 | 科学技術振興事業団 | 電気自動車の制御装置 |
| US7115218B2 (en) * | 2001-06-28 | 2006-10-03 | Parelec, Inc. | Low temperature method and composition for producing electrical conductors |
| US6998777B2 (en) * | 2002-12-24 | 2006-02-14 | Toyoda Gosei Co., Ltd. | Light emitting diode and light emitting diode array |
| CN102290409B (zh) * | 2003-04-01 | 2014-01-15 | 夏普株式会社 | 发光装置 |
-
2006
- 2006-11-28 KR KR1020087017809A patent/KR20080081331A/ko not_active Withdrawn
- 2006-11-28 WO PCT/IB2006/054471 patent/WO2007072249A2/en not_active Ceased
- 2006-11-28 US US12/097,355 patent/US20080315238A1/en not_active Abandoned
- 2006-11-28 EP EP06831968A patent/EP1967053A2/en not_active Withdrawn
- 2006-11-28 CN CNA2006800484107A patent/CN101341803A/zh active Pending
- 2006-11-28 JP JP2008546702A patent/JP2009521122A/ja not_active Abandoned
- 2006-12-19 TW TW095147644A patent/TW200739953A/zh unknown
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