JP2009510617A - 多コア・プロセッサの電力供給及び電力管理 - Google Patents
多コア・プロセッサの電力供給及び電力管理 Download PDFInfo
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- G06F1/3234—Power saving characterised by the action undertaken
- G06F1/3287—Power saving characterised by the action undertaken by switching off individual functional units in the computer system
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Abstract
Description
Claims (20)
- 集積回路の電力を管理する装置であって、
パッケージ基板と、
電圧調節器モジュールの第1のダイであって、前記第1のダイが前記パッケージ基板上に搭載され、前記電圧調節器モジュールが複数の電圧調節器を含む第1のダイと、
前記集積回路の第2のダイとを備え、前記パッケージ基板、前記第1のダイ、及び前記第2のダイは、同じパッケージにパッキングされ、前記集積回路は複数の電子装置を含み、前記第1のダイにおける各電圧調節器を前記第2のダイに電子的に結合して、前記第2のダイにおける1つ又は複数の電子装置に電力を供給する装置。 - 請求項1記載の装置であって、前記第2のダイは、前記複数の電子装置の入力/出力(I/O)相互接続を含み、前記I/O相互接続は電圧識別(「VID」)信号の相互接続を含み、前記VID信号は、前記第1のダイ内の電圧調節器への、特定の値を備えた、電圧の供給に対する、前記第2のダイ内の電子装置からの要求を含み、前記要求を受け取ると、前記電圧調節器は、前記特定の値の電圧を前記電子装置に供給する装置。
- 請求項2記載の装置であって、前記パッケージ基板が前記第1のダイと前記第2のダイとの間にある装置。
- 請求項2記載の装置であって、前記第1のダイが前記第2のダイと前記パッケージ基板との間にある装置。
- 請求項4記載の装置であって、VID信号の前記相互接続は、前記第1のダイにおける前記複数の電圧調節器のうちの1つ又は複数に前記第2のダイにおける前記複数の電子装置それぞれから前記VID信号を送信するために前記第1のダイに電子的に結合された装置。
- 請求項1記載の装置であって、前記第1のダイにおける各電圧調節器は、前記電圧調節器が電力を供給する先の、前記第2のダイにおける1つ又は複数の電子装置とアラインされる装置。
- 請求項1記載の装置であって、前記集積回路は多コア・プロセッサを備え、前記多コア・プロセッサは複数のコアを含み、前記複数の電子装置それぞれは、前記複数のコアのうちの1つを含む装置。
- 集積回路の電力を管理する装置であって、
パッケージ基板と、
前記パッケージ基板上に搭載されたダイとを備え、前記ダイは、前記集積回路、及び複数の電圧調節器を含み、前記集積回路は複数の電子装置を含み、前記複数の電圧調節器それぞれは、前記複数の電子装置の1つ又は複数に電力を供給する装置。 - 請求項8記載の装置であって、前記ダイは、前記複数の電子装置の入力/出力(I/O)相互接続、及び電圧識別(「VID」)信号の相互接続を備え、前記VID信号は、電圧調節器への、特定値を備えた電圧供給に対する、電子装置からの要求を含み、前記要求を受け取ると、前記電圧調節器は、前記電子装置に、前記特定値の電圧を供給する装置。
- 請求項8記載の装置であって、前記複数の電圧調節器は、前記ダイ内の前記複数の電子装置と一体化される装置。
- 請求項8記載の装置であって、前記複数の電圧調節器は、前記ダイ内の前記複数の電子装置の周囲に存在する装置。
- 請求項8記載の装置であって、前記集積回路は多コア・プロセッサを備え、前記多コア・プロセッサは複数のコアを含み、前記複数の電子装置それぞれは、前記複数のコアのうちの1つを含む装置。
- コンピュータ・システムであって、
複数のコアを含む多コア・プロセッサと、
前記多コア・プロセッサ用データを記憶するための非揮発性メモリと、
前記複数のコアに電力を供給するための複数の電圧調節器とを備え、
前記複数の電圧調節器それぞれは、前記電圧調節器が電力を供給する先の、前記複数のコアのうちの1つ又は複数(「電力受取対象」)の近くに位置し、前記電力受取対象に、前記電力受取対象によって要求された特定値を備えた電圧供給を提供することができるコンピュータ・システム。 - 請求項13記載のシステムであって、電圧識別(「VID」)信号の相互接続を更に備え、前記VID信号は、前記複数の電圧調節器のうちの1つへの、特定値を備えた電圧供給に対する、前記複数のコアのうちの1つからの要求を含み、前記要求を受け取ると、前記電圧調節器は、前記コアに前記特定値の電圧を供給するシステム。
- 請求項13記載のシステムであって、前記複数の電圧調節器は第1のダイ上に存在し、前記複数のコアが第2のダイ上に存在し、前記第1のダイ及び前記第2のダイは、パッケージ基板と同じパッケージにパッキングされ、前記第1のダイにおける各電圧調節器を前記第2のダイに電子的に結合して、前記第2のダイにおける1つ又は複数のコアに電力を供給するシステム。
- 請求項15記載のシステムであって、前記パッケージ基板が前記第1のダイと前記第2のダイとの間にあるシステム。
- 請求項15記載のシステムであって、前記第1のダイが前記第2のダイと前記パッケージ基板との間にあるシステム。
- 請求項13記載のシステムであって、前記複数のコア及び前記複数の電圧調節器はダイ上に存在し、前記ダイはパッケージ基板とパッケージングされるシステム。
- 請求項18記載のシステムであって、前記複数の電圧調節器は、前記ダイ内の前記複数のコアと一体化されるシステム。
- 請求項18記載のシステムであって、前記複数の電圧調節器は、前記ダイ内の前記複数の電子装置の周囲に存在するシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US11/238,489 US7568115B2 (en) | 2005-09-28 | 2005-09-28 | Power delivery and power management of many-core processors |
PCT/US2006/037522 WO2007038529A2 (en) | 2005-09-28 | 2006-09-26 | Power delivery and power management of many-core processors |
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JP2011245570A Division JP2012038347A (ja) | 2005-09-28 | 2011-11-09 | 多コア・プロセッサの電力供給及び電力管理 |
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JP2011245570A Pending JP2012038347A (ja) | 2005-09-28 | 2011-11-09 | 多コア・プロセッサの電力供給及び電力管理 |
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US (1) | US7568115B2 (ja) |
JP (2) | JP2009510617A (ja) |
KR (1) | KR100974363B1 (ja) |
CN (2) | CN101278250B (ja) |
DE (1) | DE112006002506B4 (ja) |
GB (1) | GB2444013A (ja) |
HK (1) | HK1158340A1 (ja) |
WO (1) | WO2007038529A2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009009577A (ja) * | 2007-06-28 | 2009-01-15 | Intel Corp | 分散システムにおける動的な電力管理を実現するためのコア動作検出のための方法、システム及び装置 |
JP2013513190A (ja) * | 2009-12-31 | 2013-04-18 | インテル・コーポレーション | 高効率且つリアルタイムでプラットフォーム電力管理アーキテクチャを実行する装置 |
JP2013539121A (ja) * | 2010-09-23 | 2013-10-17 | インテル コーポレイション | コア単位電圧及び周波数制御の提供 |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7263457B2 (en) * | 2006-01-03 | 2007-08-28 | Advanced Micro Devices, Inc. | System and method for operating components of an integrated circuit at independent frequencies and/or voltages |
US7685441B2 (en) * | 2006-05-12 | 2010-03-23 | Intel Corporation | Power control unit with digitally supplied system parameters |
US7949887B2 (en) | 2006-11-01 | 2011-05-24 | Intel Corporation | Independent power control of processing cores |
JP4945224B2 (ja) * | 2006-11-30 | 2012-06-06 | 株式会社東芝 | コントローラ、情報処理装置、および供給電圧制御方法 |
US8397090B2 (en) * | 2006-12-08 | 2013-03-12 | Intel Corporation | Operating integrated circuit logic blocks at independent voltages with single voltage supply |
US7692278B2 (en) * | 2006-12-20 | 2010-04-06 | Intel Corporation | Stacked-die packages with silicon vias and surface activated bonding |
US7977218B2 (en) * | 2006-12-26 | 2011-07-12 | Spansion Llc | Thin oxide dummy tiling as charge protection |
US8601292B2 (en) | 2008-03-31 | 2013-12-03 | Intel Corporation | Supply margining method and apparatus |
US20090290773A1 (en) * | 2008-05-21 | 2009-11-26 | Varian Medical Systems, Inc. | Apparatus and Method to Facilitate User-Modified Rendering of an Object Image |
JP4868012B2 (ja) * | 2009-03-09 | 2012-02-01 | 日本電気株式会社 | コンピュータシステム、コンピュータシステムの制御方法、及びプログラム |
US8064197B2 (en) | 2009-05-22 | 2011-11-22 | Advanced Micro Devices, Inc. | Heat management using power management information |
US8587595B2 (en) | 2009-10-01 | 2013-11-19 | Hand Held Products, Inc. | Low power multi-core decoder system and method |
US8473818B2 (en) | 2009-10-12 | 2013-06-25 | Empire Technology Development Llc | Reliable communications in on-chip networks |
US8635470B1 (en) * | 2009-12-16 | 2014-01-21 | Applied Micro Circuits Corporation | System-on-chip with management module for controlling processor core internal voltages |
US8812879B2 (en) * | 2009-12-30 | 2014-08-19 | International Business Machines Corporation | Processor voltage regulation |
US8635476B2 (en) | 2010-12-22 | 2014-01-21 | Via Technologies, Inc. | Decentralized power management distributed among multiple processor cores |
US8782451B2 (en) | 2010-12-22 | 2014-07-15 | Via Technologies, Inc. | Power state synchronization in a multi-core processor |
US8930676B2 (en) | 2010-12-22 | 2015-01-06 | Via Technologies, Inc. | Master core discovering enabled cores in microprocessor comprising plural multi-core dies |
US8972707B2 (en) | 2010-12-22 | 2015-03-03 | Via Technologies, Inc. | Multi-core processor with core selectively disabled by kill instruction of system software and resettable only via external pin |
US9460038B2 (en) | 2010-12-22 | 2016-10-04 | Via Technologies, Inc. | Multi-core microprocessor internal bypass bus |
US8631256B2 (en) * | 2010-12-22 | 2014-01-14 | Via Technologies, Inc. | Distributed management of a shared power source to a multi-core microprocessor |
US8637212B2 (en) | 2010-12-22 | 2014-01-28 | Via Technologies, Inc. | Reticle set modification to produce multi-core dies |
CN102609075A (zh) * | 2012-02-21 | 2012-07-25 | 李�一 | 多核处理器电源管理电路 |
US9274580B2 (en) * | 2012-06-29 | 2016-03-01 | Intel Corporation | Voltage regulator supplying power exclusively to a non-core region of a processor having a supply capability threshold |
US9009508B2 (en) * | 2012-08-28 | 2015-04-14 | Advanced Micro Devices, Inc. | Mechanism for reducing interrupt latency and power consumption using heterogeneous cores |
US9081577B2 (en) * | 2012-12-28 | 2015-07-14 | Intel Corporation | Independent control of processor core retention states |
CN103914121B (zh) * | 2013-01-04 | 2017-04-19 | 华为技术有限公司 | 多机系统、用于优化多机系统功耗的方法及装置 |
US9823719B2 (en) | 2013-05-31 | 2017-11-21 | Intel Corporation | Controlling power delivery to a processor via a bypass |
EP2811367A1 (en) * | 2013-06-04 | 2014-12-10 | Ericsson Modems SA | A method for controlling powering of a mobile platform |
CN103412637A (zh) * | 2013-08-12 | 2013-11-27 | 浪潮电子信息产业股份有限公司 | 一种可变相数的cpu vr的节能方法 |
US9417675B2 (en) * | 2014-05-29 | 2016-08-16 | Silicon Storage Technology, Inc. | Power sequencing for embedded flash memory devices |
US9645598B2 (en) * | 2014-07-14 | 2017-05-09 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Controlling distributed power stages responsive to the activity level of functions in an integrated circuit |
US9882383B2 (en) * | 2014-12-23 | 2018-01-30 | Intel Corporation | Smart power delivery network |
US10236209B2 (en) * | 2014-12-24 | 2019-03-19 | Intel Corporation | Passive components in vias in a stacked integrated circuit package |
US10481671B2 (en) | 2015-05-21 | 2019-11-19 | Hitachi, Ltd. | Power saving for a computer system and computer based on differences between chip regions in processing and communication times |
US9974176B2 (en) * | 2015-07-10 | 2018-05-15 | Cisco Technology, Inc. | Mass storage integration over central processing unit interfaces |
JP2017084148A (ja) * | 2015-10-29 | 2017-05-18 | 富士通株式会社 | 制御装置、制御方法及び制御プログラム |
US9848515B1 (en) | 2016-05-27 | 2017-12-19 | Advanced Micro Devices, Inc. | Multi-compartment computing device with shared cooling device |
US11532906B2 (en) * | 2018-06-29 | 2022-12-20 | Intel Corporation | Hybrid socket for higher thermal design point processor support |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000066776A (ja) * | 1998-08-03 | 2000-03-03 | Lucent Technol Inc | システムのサブ回路の電力消費を制御する方法 |
JP2000122753A (ja) * | 1998-10-15 | 2000-04-28 | Nec Eng Ltd | Vrm誤実装防止回路 |
JP2001274265A (ja) * | 2000-03-28 | 2001-10-05 | Mitsubishi Electric Corp | 半導体装置 |
JP2002083872A (ja) * | 2000-06-22 | 2002-03-22 | Hitachi Ltd | 半導体集積回路 |
WO2002029893A1 (fr) * | 2000-10-03 | 2002-04-11 | Hitachi, Ltd | Dispositif à semi-conducteur |
WO2003027820A2 (en) * | 2001-09-28 | 2003-04-03 | Intel Corporation | Method and apparatus for adjusting the voltage and frequency to minimize power dissipation in a multiprocessor system |
JP2003521059A (ja) * | 2000-01-27 | 2003-07-08 | プリマリオン, インコーポレイテッド | 制御されたパワーを集積回路に供給するための装置 |
JP2003224193A (ja) * | 2002-01-30 | 2003-08-08 | Matsushita Electric Ind Co Ltd | 半導体装置及びその駆動方法 |
JP2004259879A (ja) * | 2003-02-25 | 2004-09-16 | Ricoh Co Ltd | レギュレータ内蔵型半導体装置 |
EP1555595A2 (en) * | 2004-01-13 | 2005-07-20 | Lg Electronics Inc. | Apparatus for controlling power of processor having a plurality of cores and control method of the same |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9206020D0 (en) | 1992-03-19 | 1992-04-29 | Astec Int Ltd | Transition resonant convertor |
US5694297A (en) | 1995-09-05 | 1997-12-02 | Astec International Limited | Integrated circuit mounting structure including a switching power supply |
WO1998025304A1 (fr) | 1996-12-04 | 1998-06-11 | Hitachi, Ltd. | Dispositif a semi-conducteur |
US6535988B1 (en) | 1999-09-29 | 2003-03-18 | Intel Corporation | System for detecting over-clocking uses a reference signal thereafter preventing over-clocking by reducing clock rate |
JP2001185676A (ja) * | 1999-12-24 | 2001-07-06 | Sharp Corp | 半導体装置 |
US6791846B2 (en) | 2000-10-30 | 2004-09-14 | Sun Microsystems, Inc. | Power distribution system with a dedicated power structure and a high performance voltage regulator |
US6792553B2 (en) | 2000-12-29 | 2004-09-14 | Hewlett-Packard Development Company, L.P. | CPU power sequence for large multiprocessor systems |
US6952748B1 (en) * | 2001-01-02 | 2005-10-04 | Advanced Micro Devices, Inc. | Voltage request arbiter |
US6792489B2 (en) * | 2001-03-30 | 2004-09-14 | Intel Corporation | Multistage configuration and power setting |
US6861739B1 (en) * | 2001-05-15 | 2005-03-01 | Lsi Logic Corporation | Minimum metal consumption power distribution network on a bonded die |
US20030030326A1 (en) | 2001-08-10 | 2003-02-13 | Shakti Systems, Inc. | Distributed power and supply architecture |
US6674646B1 (en) * | 2001-10-05 | 2004-01-06 | Skyworks Solutions, Inc. | Voltage regulation for semiconductor dies and related structure |
US7952194B2 (en) * | 2001-10-26 | 2011-05-31 | Intel Corporation | Silicon interposer-based hybrid voltage regulator system for VLSI devices |
AU2003213618A1 (en) | 2002-02-25 | 2003-09-09 | Molex Incorporated | Electrical connector equipped with filter |
US20040142603A1 (en) | 2002-07-24 | 2004-07-22 | Walker J. Thomas | Attachable modular electronic systems |
WO2004077851A1 (en) | 2003-02-24 | 2004-09-10 | Autocell Laboratories, Inc. | Wireless access protocol system and method |
GB2399684B (en) | 2003-03-18 | 2006-06-28 | Shuttle Inc | Placement structure of an integrated motherboard |
JP2006527444A (ja) * | 2003-06-10 | 2006-11-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 再構成可能な電源および/またはクロック周波数ドメインを備えた組み込み型コンピューティングシステム |
US7079148B2 (en) * | 2003-07-23 | 2006-07-18 | Hewlett-Packard Development Company, L.P. | Non-volatile memory parallel processor |
US7392099B2 (en) | 2003-12-12 | 2008-06-24 | Hewlett-Packard Development Company, L.P. | System and method for power management when an operating voltage is between two thresholds |
WO2005086978A2 (en) | 2004-03-11 | 2005-09-22 | International Rectifier Corporation | Embedded power management control circuit |
US7523337B2 (en) | 2004-08-19 | 2009-04-21 | Intel Corporation | Power delivery system in which power supply and load exchange power consumption measurements via digital bus |
US20060065962A1 (en) | 2004-09-29 | 2006-03-30 | Intel Corporation | Control circuitry in stacked silicon |
US20060071650A1 (en) | 2004-09-30 | 2006-04-06 | Narendra Siva G | CPU power delivery system |
US7698576B2 (en) | 2004-09-30 | 2010-04-13 | Intel Corporation | CPU power delivery system |
KR101108397B1 (ko) | 2005-06-10 | 2012-01-30 | 엘지전자 주식회사 | 멀티-코어 프로세서의 전원 제어 장치 및 방법 |
-
2005
- 2005-09-28 US US11/238,489 patent/US7568115B2/en active Active
-
2006
- 2006-09-26 JP JP2008533528A patent/JP2009510617A/ja active Pending
- 2006-09-26 GB GB0805204A patent/GB2444013A/en not_active Withdrawn
- 2006-09-26 CN CN200680036147XA patent/CN101278250B/zh active Active
- 2006-09-26 WO PCT/US2006/037522 patent/WO2007038529A2/en active Application Filing
- 2006-09-26 CN CN2010106233863A patent/CN102073371B/zh active Active
- 2006-09-26 KR KR1020087007642A patent/KR100974363B1/ko active IP Right Grant
- 2006-09-26 DE DE112006002506T patent/DE112006002506B4/de active Active
-
2011
- 2011-11-09 JP JP2011245570A patent/JP2012038347A/ja active Pending
- 2011-11-24 HK HK11112721.8A patent/HK1158340A1/xx unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000066776A (ja) * | 1998-08-03 | 2000-03-03 | Lucent Technol Inc | システムのサブ回路の電力消費を制御する方法 |
JP2000122753A (ja) * | 1998-10-15 | 2000-04-28 | Nec Eng Ltd | Vrm誤実装防止回路 |
JP2003521059A (ja) * | 2000-01-27 | 2003-07-08 | プリマリオン, インコーポレイテッド | 制御されたパワーを集積回路に供給するための装置 |
JP2001274265A (ja) * | 2000-03-28 | 2001-10-05 | Mitsubishi Electric Corp | 半導体装置 |
JP2002083872A (ja) * | 2000-06-22 | 2002-03-22 | Hitachi Ltd | 半導体集積回路 |
WO2002029893A1 (fr) * | 2000-10-03 | 2002-04-11 | Hitachi, Ltd | Dispositif à semi-conducteur |
WO2003027820A2 (en) * | 2001-09-28 | 2003-04-03 | Intel Corporation | Method and apparatus for adjusting the voltage and frequency to minimize power dissipation in a multiprocessor system |
JP2003224193A (ja) * | 2002-01-30 | 2003-08-08 | Matsushita Electric Ind Co Ltd | 半導体装置及びその駆動方法 |
JP2004259879A (ja) * | 2003-02-25 | 2004-09-16 | Ricoh Co Ltd | レギュレータ内蔵型半導体装置 |
EP1555595A2 (en) * | 2004-01-13 | 2005-07-20 | Lg Electronics Inc. | Apparatus for controlling power of processor having a plurality of cores and control method of the same |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009009577A (ja) * | 2007-06-28 | 2009-01-15 | Intel Corp | 分散システムにおける動的な電力管理を実現するためのコア動作検出のための方法、システム及び装置 |
JP2013513190A (ja) * | 2009-12-31 | 2013-04-18 | インテル・コーポレーション | 高効率且つリアルタイムでプラットフォーム電力管理アーキテクチャを実行する装置 |
US8990591B2 (en) | 2009-12-31 | 2015-03-24 | Intel Corporation | Power management system for selectively changing the power state of devices using an OS power management framework and non-OS power management framework |
JP2013539121A (ja) * | 2010-09-23 | 2013-10-17 | インテル コーポレイション | コア単位電圧及び周波数制御の提供 |
JP2017021831A (ja) * | 2010-09-23 | 2017-01-26 | インテル コーポレイション | コア単位電圧及び周波数制御の提供 |
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JP2012038347A (ja) | 2012-02-23 |
WO2007038529A3 (en) | 2007-06-28 |
GB0805204D0 (en) | 2008-04-30 |
CN102073371B (zh) | 2013-03-27 |
CN102073371A (zh) | 2011-05-25 |
CN101278250B (zh) | 2011-04-13 |
KR100974363B1 (ko) | 2010-08-05 |
DE112006002506B4 (de) | 2012-08-16 |
US20070070673A1 (en) | 2007-03-29 |
DE112006002506T5 (de) | 2008-09-25 |
CN101278250A (zh) | 2008-10-01 |
WO2007038529A2 (en) | 2007-04-05 |
GB2444013A (en) | 2008-05-21 |
HK1158340A1 (en) | 2012-07-13 |
KR20080039531A (ko) | 2008-05-07 |
US7568115B2 (en) | 2009-07-28 |
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