JP2009289980A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
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Abstract
【解決手段】半導体装置が、半導体素子9が載置された回路基板6と、回路基板と平行に配置され、半導体素子を制御する制御基板13と、回路基板と制御基板との間に、半導体素子を囲むように設けられたケース11と、回路基板に設けられた留め部3に接続され、回路基板と制御基板とを接続する線材ピン2とを含み、線材ピンは、屈曲したストレスリリーフ部4と段差部とを有し、段差部を留め部方向に押して線材ピンを留め部に接続させる。
【選択図】図1
Description
なお、パワー回路基板6や制御基板13には他の半導体素子が載置されているが、ここでは省略する。
なお、図1(b)に示すように、制御基板13と線材ピン2との接続は、制御基板13の下側に平坦な電極14を設け、そこに線材ピン2を接触させることによって行っても良い。
また、この例ではパターン8の上に留め部3が配置される構成を示しているが、留め部3はパワー半導体素子9の表面電極に直接固着しても良い。
従来構造の電力用半導体装置では、直線状の線材ピン2bが、留め部3aに挿入されて半田で固定されるとともに、(a)のように、制御基板13を貫通した状態で制御基板13に半田で固定されたり、(b)のように、制御基板13に設けられた電極14の半田で固定されている。
なお、留め部3と線材ピン2の間には接触抵抗が生じるが、通電による抵抗発熱は、パターン8、パワー半導体素子9およびパワー回路基板6を通して図示しない放熱手段へと排出されるため、余分な抵抗発熱は生じない。これは、接触部をパワー回路基板6に近接配置したため得られる効果である。また、温度上昇による抵抗率の増大も防止でき、通電抵抗を低く保つことができる。
また、図10のように、留め部3の端部に円錐台部25を備えることにより、開口部23に留め部3を容易に挿入できる。
特に、線材をヘッダー加工して留め部3を形成することにより、適度な長さに線材を切断するだけの簡単な方法で留め部3を作製できる。
Claims (9)
- 半導体素子が載置された回路基板と、
該回路基板と平行に配置され、該半導体素子を制御する制御基板と、
該回路基板と該制御基板との間に、該半導体素子を囲むように設けられたケースと、
該回路基板に設けられた留め部に接続され、該回路基板と該制御基板とを接続する線材ピンとを含み、
該線材ピンは、屈曲したストレスリリーフ部と段差部とを有し、該段差部を該留め部方向に押して該線材ピンを該留め部に接続させたことを特徴とする半導体装置。 - 上記段差部は、上記線材ピンの周囲につば状に突出した突出部であることを特徴とする請求項1に記載の半導体装置。
- 上記線材ピンが円柱からなり、上記段差部は、該線材ピンと同軸で直径の大きいつば部からなることを特徴とする請求項2に記載の半導体装置。
- 上記段差部は、上記線材ピンの周囲に設けた切り欠き部からなることを特徴とする請求項1に記載の半導体装置、
- 上記線材ピンが円柱からなり、上記段差部は、該線材ピンと同軸で直径の小さい切り欠き部からなることを特徴とする請求項4に記載の半導体装置。
- 上記留め部は上記回路基板の上に固定された突出部からなり、該突出部は上記線材ピンがその中に挿入される開口部を有することを特徴とする請求項1に記載の半導体装置。
- 上記留め部は上記回路基板の上に固定された突出部からなり、上記線材ピンはその端部に該突出部がその中に挿入される開口部を有することを特徴とする請求項1に記載の半導体装置。
- 上記線材ピンと上記留め部が、半田により接続されたことを特徴とする請求項1〜7のいずれか1つに記載の半導体装置。
- 上記線材ピンと上記留め部が、嵌合接続されたことを特徴とする請求項1〜7のいずれか1つに記載の半導体装置。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010129670A (ja) * | 2008-11-26 | 2010-06-10 | Mitsubishi Electric Corp | 電力用半導体モジュール |
JP2013239512A (ja) * | 2012-05-14 | 2013-11-28 | Mitsubishi Electric Corp | 半導体装置 |
JP2014107378A (ja) * | 2012-11-27 | 2014-06-09 | Mitsubishi Electric Corp | 電力用半導体装置 |
WO2014148319A1 (ja) * | 2013-03-21 | 2014-09-25 | 富士電機株式会社 | コンタクト部品、および半導体モジュール |
WO2015020176A1 (ja) * | 2013-08-09 | 2015-02-12 | 日本発條株式会社 | 接続端子、パワーモジュールおよび通電ユニット |
JP2017017206A (ja) * | 2015-07-02 | 2017-01-19 | 三菱電機株式会社 | 車載用電子制御装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0621330A (ja) * | 1992-06-30 | 1994-01-28 | Mitsubishi Electric Corp | 半導体パワーモジュール |
JP2000068446A (ja) * | 1998-08-25 | 2000-03-03 | Hitachi Ltd | パワー半導体モジュール |
JP2000091500A (ja) * | 1998-08-24 | 2000-03-31 | Internatl Rectifier Corp | パワ―モジュ―ル |
JP2006165499A (ja) * | 2004-06-08 | 2006-06-22 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
JP2006287101A (ja) * | 2005-04-04 | 2006-10-19 | Toyota Motor Corp | パワーモジュール、及び、その製造方法 |
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- 2008-05-29 JP JP2008140928A patent/JP5334457B2/ja active Active
Patent Citations (5)
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JPH0621330A (ja) * | 1992-06-30 | 1994-01-28 | Mitsubishi Electric Corp | 半導体パワーモジュール |
JP2000091500A (ja) * | 1998-08-24 | 2000-03-31 | Internatl Rectifier Corp | パワ―モジュ―ル |
JP2000068446A (ja) * | 1998-08-25 | 2000-03-03 | Hitachi Ltd | パワー半導体モジュール |
JP2006165499A (ja) * | 2004-06-08 | 2006-06-22 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
JP2006287101A (ja) * | 2005-04-04 | 2006-10-19 | Toyota Motor Corp | パワーモジュール、及び、その製造方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010129670A (ja) * | 2008-11-26 | 2010-06-10 | Mitsubishi Electric Corp | 電力用半導体モジュール |
JP2013239512A (ja) * | 2012-05-14 | 2013-11-28 | Mitsubishi Electric Corp | 半導体装置 |
JP2014107378A (ja) * | 2012-11-27 | 2014-06-09 | Mitsubishi Electric Corp | 電力用半導体装置 |
WO2014148319A1 (ja) * | 2013-03-21 | 2014-09-25 | 富士電機株式会社 | コンタクト部品、および半導体モジュール |
US9406633B2 (en) | 2013-03-21 | 2016-08-02 | Fuji Electric Co., Ltd. | Contact component and semiconductor module |
WO2015020176A1 (ja) * | 2013-08-09 | 2015-02-12 | 日本発條株式会社 | 接続端子、パワーモジュールおよび通電ユニット |
JPWO2015020176A1 (ja) * | 2013-08-09 | 2017-03-02 | 日本発條株式会社 | 通電ユニット |
JP2017017206A (ja) * | 2015-07-02 | 2017-01-19 | 三菱電機株式会社 | 車載用電子制御装置 |
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