JP2009269128A - 研削装置及び研削方法 - Google Patents
研削装置及び研削方法 Download PDFInfo
- Publication number
- JP2009269128A JP2009269128A JP2008122030A JP2008122030A JP2009269128A JP 2009269128 A JP2009269128 A JP 2009269128A JP 2008122030 A JP2008122030 A JP 2008122030A JP 2008122030 A JP2008122030 A JP 2008122030A JP 2009269128 A JP2009269128 A JP 2009269128A
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- Prior art keywords
- grinding
- porous pad
- workpiece
- gel
- holding table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 7
- 239000002002 slurry Substances 0.000 claims abstract description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000011148 porous material Substances 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 2
- 239000006061 abrasive grain Substances 0.000 abstract description 7
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 35
- 239000000758 substrate Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】 被加工物を保持する保持テーブルと、該保持テーブルに保持された被加工物を研削する研削手段と、該研削手段を被加工物に対して接近又は離反する方向に移動する研削手段送り機構とを備えた研削装置であって、前記研削手段は、該保持テーブルに保持された被加工物に対峙する多数の細孔を有する多孔質パッドと、該多孔質パッドの上方に設けられた内部にゲル状スラリーを格納するゲル状スラリー格納部と、該多孔質パッドと被加工物の間に水を供給する水供給手段とを具備し、該多孔質パッドは少なくとも外周部に超砥粒を含み、該多孔質パッドの細孔径はゲル状スラリーに含まれる超砥粒の粒子径より大きいことを特徴とする。
【選択図】図3
Description
10 研削ユニット
18 研削ユニット移動機構
25 ゲル状スラリー格納部
26 多孔質パッド
28 保持テーブル機構
50 保持テーブル
52 研削水供給ノズル
54 ウエーハ
56 超砥粒
58 ゲル状スラリー
60 細かい超砥粒
Claims (2)
- 被加工物を保持する保持テーブルと、該保持テーブルに保持された被加工物を研削する研削手段と、該研削手段を被加工物に対して接近又は離反する方向に移動する研削手段送り機構とを備えた研削装置であって、
前記研削手段は、
該保持テーブルに保持された被加工物に対峙する多数の細孔を有する多孔質パッドと、
該多孔質パッドの上方に設けられた内部にゲル状スラリーを格納するゲル状スラリー格納部と、
該多孔質パッドと被加工物の間に水を供給する水供給手段とを具備し、
該多孔質パッドは少なくとも外周部に超砥粒を含み、
該多孔質パッドの細孔径はゲル状スラリーに含まれる超砥粒の粒子径より大きいことを特徴とする研削装置。 - 請求項1記載の研削装置を用いて被加工物の研削を行う研削方法であって、
前記研削手段送り機構により前記多孔質パッドを前記保持テーブルに保持された被加工物に接近する方向に研削送りし、該多孔質パッドを被加工物へ押圧して被加工物の粗研削を行った後に、
該多孔質パッドの被加工物への押圧力を弱めて、該多孔質パッドから流出するゲル状スラリーで被加工物の仕上げ研削を行う、
ことを特徴とする研削方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008122030A JP5172457B2 (ja) | 2008-05-08 | 2008-05-08 | 研削装置及び研削方法 |
US12/422,674 US8142259B2 (en) | 2008-05-08 | 2009-04-13 | Grinding machine and method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008122030A JP5172457B2 (ja) | 2008-05-08 | 2008-05-08 | 研削装置及び研削方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009269128A true JP2009269128A (ja) | 2009-11-19 |
JP5172457B2 JP5172457B2 (ja) | 2013-03-27 |
Family
ID=41267243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008122030A Active JP5172457B2 (ja) | 2008-05-08 | 2008-05-08 | 研削装置及び研削方法 |
Country Status (2)
Country | Link |
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US (1) | US8142259B2 (ja) |
JP (1) | JP5172457B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101844320B (zh) * | 2010-06-07 | 2011-09-14 | 湖南大学 | 一种曲面零件的精密高效抛光方法及装置 |
JP7201322B2 (ja) | 2018-01-05 | 2023-01-10 | 株式会社荏原製作所 | フェースアップ式の研磨装置のための研磨ヘッド、当該研磨ヘッドを備える研磨装置および当該研磨装置を用いた研磨方法 |
JP7216613B2 (ja) * | 2019-05-16 | 2023-02-01 | 株式会社ディスコ | 加工装置 |
CN112518432B (zh) * | 2020-10-13 | 2022-05-10 | 欣强电子(清远)有限公司 | 一种提高电镀铂金表面平整度的方法及其使用的打磨设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0224053A (ja) * | 1988-07-11 | 1990-01-26 | Souzou Kagaku:Kk | ラッピング用砥石及びその製法 |
JPH1094965A (ja) * | 1996-09-24 | 1998-04-14 | Sony Corp | 化学的機械研磨装置 |
JP2000317810A (ja) * | 1999-04-28 | 2000-11-21 | Matsushita Electric Ind Co Ltd | 流体研磨装置 |
JP2000354950A (ja) * | 1999-06-15 | 2000-12-26 | Sumitomo Metal Ind Ltd | 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法 |
JP2010094806A (ja) * | 2010-02-04 | 2010-04-30 | Mezoteku Dia Kk | 表面研磨方法と表面研磨装置と表面研磨板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2309819A (en) * | 1941-04-18 | 1943-02-02 | Carborundum Co | Art of grinding and polishing glass and apparatus therefor |
JP2000033555A (ja) * | 1998-07-17 | 2000-02-02 | Sony Corp | 研磨装置 |
JP2000141215A (ja) * | 1998-11-05 | 2000-05-23 | Sony Corp | 平坦化研磨装置及び平坦化研磨方法 |
JP2000301450A (ja) * | 1999-04-19 | 2000-10-31 | Rohm Co Ltd | Cmp研磨パッドおよびそれを用いたcmp処理装置 |
JP2002319559A (ja) | 2001-04-23 | 2002-10-31 | Disco Abrasive Syst Ltd | 研削装置 |
US6905398B2 (en) * | 2001-09-10 | 2005-06-14 | Oriol, Inc. | Chemical mechanical polishing tool, apparatus and method |
US20050107016A1 (en) * | 2002-03-20 | 2005-05-19 | Nikon Corporation | Polishing equipment, and method of manufacturing semiconductor device using the equipment |
-
2008
- 2008-05-08 JP JP2008122030A patent/JP5172457B2/ja active Active
-
2009
- 2009-04-13 US US12/422,674 patent/US8142259B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0224053A (ja) * | 1988-07-11 | 1990-01-26 | Souzou Kagaku:Kk | ラッピング用砥石及びその製法 |
JPH1094965A (ja) * | 1996-09-24 | 1998-04-14 | Sony Corp | 化学的機械研磨装置 |
JP2000317810A (ja) * | 1999-04-28 | 2000-11-21 | Matsushita Electric Ind Co Ltd | 流体研磨装置 |
JP2000354950A (ja) * | 1999-06-15 | 2000-12-26 | Sumitomo Metal Ind Ltd | 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法 |
JP2010094806A (ja) * | 2010-02-04 | 2010-04-30 | Mezoteku Dia Kk | 表面研磨方法と表面研磨装置と表面研磨板 |
Also Published As
Publication number | Publication date |
---|---|
US20090280722A1 (en) | 2009-11-12 |
JP5172457B2 (ja) | 2013-03-27 |
US8142259B2 (en) | 2012-03-27 |
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