JP2009253070A5 - - Google Patents

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Publication number
JP2009253070A5
JP2009253070A5 JP2008100113A JP2008100113A JP2009253070A5 JP 2009253070 A5 JP2009253070 A5 JP 2009253070A5 JP 2008100113 A JP2008100113 A JP 2008100113A JP 2008100113 A JP2008100113 A JP 2008100113A JP 2009253070 A5 JP2009253070 A5 JP 2009253070A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2008100113A
Other versions
JP4582181B2 (ja
JP2009253070A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2008100113A external-priority patent/JP4582181B2/ja
Priority to JP2008100113A priority Critical patent/JP4582181B2/ja
Priority to TW098107885A priority patent/TWI397142B/zh
Priority to US12/382,323 priority patent/US8162128B2/en
Priority to KR1020090029300A priority patent/KR101573365B1/ko
Priority to CN2009101338796A priority patent/CN101557698B/zh
Publication of JP2009253070A publication Critical patent/JP2009253070A/ja
Publication of JP2009253070A5 publication Critical patent/JP2009253070A5/ja
Publication of JP4582181B2 publication Critical patent/JP4582181B2/ja
Application granted granted Critical
Priority to US13/453,558 priority patent/US8376129B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008100113A 2008-04-08 2008-04-08 部品実装装置、実装品の製造方法 Active JP4582181B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008100113A JP4582181B2 (ja) 2008-04-08 2008-04-08 部品実装装置、実装品の製造方法
TW098107885A TWI397142B (zh) 2008-04-08 2009-03-11 元件安裝裝置、安裝元件製造方法及傳送裝置
US12/382,323 US8162128B2 (en) 2008-04-08 2009-03-13 Component mounting apparatus, mounting-component producing method, and conveyor apparatus
KR1020090029300A KR101573365B1 (ko) 2008-04-08 2009-04-06 부품 실장 장치, 실장품의 제조 방법 및 콘베이어 장치
CN2009101338796A CN101557698B (zh) 2008-04-08 2009-04-08 部件安装装置、安装部件的制造方法和输送装置
US13/453,558 US8376129B2 (en) 2008-04-08 2012-04-23 Component mounting apparatus, mounting-component producing method, and conveyor apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008100113A JP4582181B2 (ja) 2008-04-08 2008-04-08 部品実装装置、実装品の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010157653A Division JP4692687B2 (ja) 2010-07-12 2010-07-12 実装基板の製造方法

Publications (3)

Publication Number Publication Date
JP2009253070A JP2009253070A (ja) 2009-10-29
JP2009253070A5 true JP2009253070A5 (ja) 2010-05-13
JP4582181B2 JP4582181B2 (ja) 2010-11-17

Family

ID=41132243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008100113A Active JP4582181B2 (ja) 2008-04-08 2008-04-08 部品実装装置、実装品の製造方法

Country Status (5)

Country Link
US (2) US8162128B2 (ja)
JP (1) JP4582181B2 (ja)
KR (1) KR101573365B1 (ja)
CN (1) CN101557698B (ja)
TW (1) TWI397142B (ja)

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* Cited by examiner, † Cited by third party
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JP4582181B2 (ja) * 2008-04-08 2010-11-17 ソニー株式会社 部品実装装置、実装品の製造方法
JP5155834B2 (ja) * 2008-12-02 2013-03-06 富士機械製造株式会社 回路基板検査装置
JP5099064B2 (ja) * 2009-04-07 2012-12-12 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP5120357B2 (ja) * 2009-10-14 2013-01-16 パナソニック株式会社 電子部品実装装置および電子部品実装方法
CN102783267B (zh) 2010-01-19 2015-04-08 松下电器产业株式会社 元件安装方法以及元件安装装置
KR101646983B1 (ko) * 2011-03-16 2016-08-09 한화테크윈 주식회사 기판이송장치
KR101672840B1 (ko) * 2011-11-09 2016-11-08 한화테크윈 주식회사 플립칩 마운터 증식형 시스템
JP5945690B2 (ja) * 2012-05-21 2016-07-05 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装システムにおける設備ユニット管理方法
JP5903660B2 (ja) * 2012-05-21 2016-04-13 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装システムにおける部品管理方法
US8833547B2 (en) * 2012-11-02 2014-09-16 Shenzhen China Star Optoelectronics Technology Co., Ltd Transmission device and transmission method for glass substrate
JP6166903B2 (ja) * 2013-01-11 2017-07-19 ヤマハ発動機株式会社 電子部品実装装置
US9468135B2 (en) 2013-02-08 2016-10-11 Yamaha Hatsudoki Kabushiki Kaisha Substrate conveying system for electronic component mounting device
JP6051409B2 (ja) * 2013-09-24 2016-12-27 パナソニックＩｐマネジメント株式会社 部品実装装置
JP6106065B2 (ja) * 2013-11-05 2017-03-29 ヤマハ発動機株式会社 部品実装装置
WO2015155817A1 (ja) * 2014-04-07 2015-10-15 ヤマハ発動機株式会社 プリント基板用搬送装置
DE102014117026B3 (de) * 2014-11-20 2015-12-03 Strothmann Machines & Handling GmbH Transfervorrichtung
CN105142346B (zh) * 2015-08-05 2018-05-04 惠州市大亚湾天马电子机械有限公司 一种印制线路板钻床用自动上下料系统
JP6655948B2 (ja) * 2015-11-05 2020-03-04 株式会社東芝 搬送装置および搬送方法
JP2018047515A (ja) * 2016-09-20 2018-03-29 株式会社東芝 ロボットハンド装置およびロボットハンド装置を用いた搬送装置
US11116121B2 (en) 2017-01-06 2021-09-07 Yamaha Hatsudoki Kabushiki Kaisha Mounting target working device
JP7050821B2 (ja) * 2018-01-23 2022-04-08 株式会社Fuji 対応関係生成装置
CN111670614B (zh) * 2018-03-09 2021-06-29 雅马哈发动机株式会社 元件安装装置、元件安装系统及元件安装方法
CN113811177B (zh) * 2021-09-13 2023-04-25 深圳市兆驰股份有限公司 一种贴片设备

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