JP2009239035A - Led基板 - Google Patents
Led基板 Download PDFInfo
- Publication number
- JP2009239035A JP2009239035A JP2008083503A JP2008083503A JP2009239035A JP 2009239035 A JP2009239035 A JP 2009239035A JP 2008083503 A JP2008083503 A JP 2008083503A JP 2008083503 A JP2008083503 A JP 2008083503A JP 2009239035 A JP2009239035 A JP 2009239035A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- led
- led element
- substrate
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Led Device Packages (AREA)
Abstract
【解決手段】本発明は、絶縁基板と、この絶縁基板の片面に設けられた接着層と、この絶縁基板および接着層を貫通するスリット部と、前記接着層によって前記絶縁基板と接着され、前記スリット部内に露出した面上にLED素子が搭載される反射部材とを有し、前記絶縁基板のスリット部側の端面に、前記LED素子から照射される光を遮蔽する被覆部が形成され、この被覆部と前記反射部材との間に離間を有するLED基板である。
【選択図】図1
Description
(1) 絶縁基板と、この絶縁基板の片面に設けられた接着層と、この絶縁基板および接着層を貫通するスリット部と、前記接着層によって前記絶縁基板と接着され、前記スリット部内に露出した面上にLED素子が搭載される反射部材とを有し、前記絶縁基板のスリット部側の端面に、前記LED素子から照射される光を遮蔽する被覆部が形成され、この被覆部と前記反射部材との間に離間を有するLED基板。
(2) 上記(1)において、被覆部が、めっきにより形成されたLED基板。
(3) 上記(1)または(2)において、被覆部と反射部材とが異種金属であるLED基板。
(4) 上記(1)から(3)の何れかにおいて、絶縁基板と接着層との間にも、被覆部が設けられたLED基板。
(5) 上記(1)から(4)の何れかにおいて、反射部材がアルミニウムであり、前記反射部材のスリット部内に露出した面が鏡面であるLED基板。
Claims (5)
- 絶縁基板と、この絶縁基板の片面に設けられた接着層と、この絶縁基板および接着層を貫通するスリット部と、前記接着層によって前記絶縁基板と接着され、前記スリット部内に露出した面上にLED素子が搭載される反射部材とを有し、前記絶縁基板のスリット部側の端面に、前記LED素子から照射される光を反射する被覆部が形成され、この被覆部と前記反射部材との間に離間を有するLED基板。
- 請求項1において、被覆部が、めっきにより形成されたLED基板。
- 請求項1または2において、被覆部と反射部材とが異種金属であるLED基板。
- 請求項1から3の何れかにおいて、絶縁基板と接着層との間にも、被覆部が設けられたLED基板。
- 請求項1から4の何れかにおいて、反射部材がアルミニウムであり、前記反射部材のスリット部内に露出した面が鏡面であるLED基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008083503A JP5186709B2 (ja) | 2008-03-27 | 2008-03-27 | Led基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008083503A JP5186709B2 (ja) | 2008-03-27 | 2008-03-27 | Led基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009239035A true JP2009239035A (ja) | 2009-10-15 |
JP5186709B2 JP5186709B2 (ja) | 2013-04-24 |
Family
ID=41252628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008083503A Expired - Fee Related JP5186709B2 (ja) | 2008-03-27 | 2008-03-27 | Led基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5186709B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101233754B1 (ko) * | 2011-09-06 | 2013-02-27 | 장종진 | 메탈 pcb 및 그의 제조 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006186000A (ja) * | 2004-12-27 | 2006-07-13 | Kyoei Opto Japan Kk | 高出力半導体装置及びその製造方法 |
JP2006339224A (ja) * | 2005-05-31 | 2006-12-14 | Tanazawa Hakkosha:Kk | Led用基板およびledパッケージ |
JP2007109701A (ja) * | 2005-10-11 | 2007-04-26 | Hitachi Aic Inc | 発光素子搭載用基板 |
JP2007227909A (ja) * | 2006-02-22 | 2007-09-06 | Samsung Electro-Mechanics Co Ltd | 基板パッケージ及びその製造方法 |
-
2008
- 2008-03-27 JP JP2008083503A patent/JP5186709B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006186000A (ja) * | 2004-12-27 | 2006-07-13 | Kyoei Opto Japan Kk | 高出力半導体装置及びその製造方法 |
JP2006339224A (ja) * | 2005-05-31 | 2006-12-14 | Tanazawa Hakkosha:Kk | Led用基板およびledパッケージ |
JP2007109701A (ja) * | 2005-10-11 | 2007-04-26 | Hitachi Aic Inc | 発光素子搭載用基板 |
JP2007227909A (ja) * | 2006-02-22 | 2007-09-06 | Samsung Electro-Mechanics Co Ltd | 基板パッケージ及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101233754B1 (ko) * | 2011-09-06 | 2013-02-27 | 장종진 | 메탈 pcb 및 그의 제조 방법 |
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Publication number | Publication date |
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JP5186709B2 (ja) | 2013-04-24 |
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