JP2009231752A5 - - Google Patents

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Publication number
JP2009231752A5
JP2009231752A5 JP2008078396A JP2008078396A JP2009231752A5 JP 2009231752 A5 JP2009231752 A5 JP 2009231752A5 JP 2008078396 A JP2008078396 A JP 2008078396A JP 2008078396 A JP2008078396 A JP 2008078396A JP 2009231752 A5 JP2009231752 A5 JP 2009231752A5
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JP
Japan
Prior art keywords
wiring board
reinforcing substrate
manufacturing
forming
opening
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Application number
JP2008078396A
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English (en)
Japanese (ja)
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JP5280079B2 (ja
JP2009231752A (ja
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Priority to JP2008078396A priority Critical patent/JP5280079B2/ja
Priority claimed from JP2008078396A external-priority patent/JP5280079B2/ja
Priority to US12/409,873 priority patent/US8137497B2/en
Publication of JP2009231752A publication Critical patent/JP2009231752A/ja
Publication of JP2009231752A5 publication Critical patent/JP2009231752A5/ja
Application granted granted Critical
Publication of JP5280079B2 publication Critical patent/JP5280079B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008078396A 2008-03-25 2008-03-25 配線基板の製造方法 Active JP5280079B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008078396A JP5280079B2 (ja) 2008-03-25 2008-03-25 配線基板の製造方法
US12/409,873 US8137497B2 (en) 2008-03-25 2009-03-24 Method of manufacturing wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008078396A JP5280079B2 (ja) 2008-03-25 2008-03-25 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2009231752A JP2009231752A (ja) 2009-10-08
JP2009231752A5 true JP2009231752A5 (https=) 2011-02-24
JP5280079B2 JP5280079B2 (ja) 2013-09-04

Family

ID=41115331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008078396A Active JP5280079B2 (ja) 2008-03-25 2008-03-25 配線基板の製造方法

Country Status (2)

Country Link
US (1) US8137497B2 (https=)
JP (1) JP5280079B2 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5280079B2 (ja) * 2008-03-25 2013-09-04 新光電気工業株式会社 配線基板の製造方法
KR101047485B1 (ko) * 2009-10-29 2011-07-08 삼성전기주식회사 전자소자 내장형 인쇄회로기판
US20130256884A1 (en) * 2012-03-27 2013-10-03 Intel Mobile Communications GmbH Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level package
US9111847B2 (en) * 2012-06-15 2015-08-18 Infineon Technologies Ag Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
US9240392B2 (en) * 2014-04-09 2016-01-19 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co., Ltd. Method for fabricating embedded chips
CN104270885A (zh) * 2014-05-05 2015-01-07 珠海越亚封装基板技术股份有限公司 具有聚合物基质的插件框架及其制造方法
JP6465340B2 (ja) * 2014-11-05 2019-02-06 日立化成株式会社 ケイ素を含む基板を用いた半導体装置の製造方法
US10276424B2 (en) * 2017-06-30 2019-04-30 Applied Materials, Inc. Method and apparatus for wafer level packaging
EP3557608A1 (en) * 2018-04-19 2019-10-23 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit
WO2020084981A1 (ja) * 2018-10-22 2020-04-30 東洋紡株式会社 デバイス連結体の製造方法、及び、デバイス連結体
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
JP2023009588A (ja) * 2021-07-07 2023-01-20 味の素株式会社 部品埋め込み基板の製造方法、液状樹脂組成物及びセット
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
US20240147633A1 (en) * 2021-12-27 2024-05-02 Daiwa Co., Ltd. Method for manufacturing wiring board or wiring board material
CN114666995B (zh) * 2022-02-25 2024-03-26 珠海越亚半导体股份有限公司 封装基板及其制作方法
US20240222213A1 (en) * 2022-12-30 2024-07-04 Nvidia Corporation Embedded silicon-based device components in a thick core substrate of an integrated circuit package

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0575255A (ja) * 1991-09-11 1993-03-26 Hitachi Ltd 混成基板とこれを搭載する回路モジユールおよびその製造方法
JP2844558B2 (ja) * 1995-06-29 1999-01-06 信越ポリマー株式会社 チップ状半導体素子装着用の配線回路基板およびその製造方法
JP3779816B2 (ja) * 1998-04-27 2006-05-31 日本特殊陶業株式会社 多層配線基板の製造方法
JP4931283B2 (ja) 2000-09-25 2012-05-16 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
JP4248157B2 (ja) * 2000-12-15 2009-04-02 イビデン株式会社 多層プリント配線板
JP4270769B2 (ja) * 2000-12-15 2009-06-03 イビデン株式会社 多層プリント配線板の製造方法
TWI234253B (en) * 2002-05-31 2005-06-11 Fujitsu Ltd Semiconductor device and manufacturing method thereof
US6964881B2 (en) * 2002-08-27 2005-11-15 Micron Technology, Inc. Multi-chip wafer level system packages and methods of forming same
JP2005064446A (ja) * 2003-07-25 2005-03-10 Dainippon Printing Co Ltd 積層用モジュールの製造方法
JP2007042719A (ja) * 2005-08-01 2007-02-15 Nec Electronics Corp 半導体装置
JP2007220792A (ja) * 2006-02-15 2007-08-30 Sony Corp ハイブリットモジュールの製造方法
JP2009228078A (ja) * 2008-03-24 2009-10-08 Fujitsu Ltd 電解メッキ液、電解メッキ方法、および半導体装置の製造方法
JP5280079B2 (ja) * 2008-03-25 2013-09-04 新光電気工業株式会社 配線基板の製造方法

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