CN105990303A - 复合式电路板及其制作方法，以及半导体封装结构 - Google Patents

复合式电路板及其制作方法，以及半导体封装结构 Download PDF

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CN105990303A
CN105990303A CN201510074392.0A CN201510074392A CN105990303A CN 105990303 A CN105990303 A CN 105990303A CN 201510074392 A CN201510074392 A CN 201510074392A CN 105990303 A CN105990303 A CN 105990303A
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pattern layer
line pattern
layer
welding resisting
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黄昱程
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Acer Qinhuangdao Ding Technology Co. Ltd.
Zhending Technology Co Ltd
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Hongqisheng Precision Electronics Qinhuangdao Co Ltd
Zhending Technology Co Ltd
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Priority to CN201510074392.0A priority Critical patent/CN105990303A/zh
Priority to TW104107113A priority patent/TW201630136A/zh
Priority to US14/802,451 priority patent/US20160240464A1/en
Publication of CN105990303A publication Critical patent/CN105990303A/zh
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Abstract

一种复合式电路板，其包括：一绝缘封胶层，其包括第一表面及与第一表面相对的第二表面；一防焊层，其形成于绝缘封胶层的第一表面；一线路图形层，其形成于绝缘封胶层的第一表面且嵌设于防焊层中，该线路图形层的厚度与防焊层的厚度相当；多个导电柱，其嵌设于绝缘封胶层中，每一导电柱具有与该线路图形层电性导通连接的第一端面和相对绝缘封胶层裸露的第二端面；一支撑板，其形成于防焊层和线路图形层上，且支撑板开设有一开口以局部裸露所述防焊层和线路图形层。所述的复合式电路板成本低廉，还可有效避免后续封装过程中半导体封装结构产品产生翘曲等不良。本发明还提供该种复合式电路板的制作方法及应用该复合式电路板的半导体封装结构。

Description

复合式电路板及其制作方法，以及半导体封装结构
技术领域
本发明涉及一种复合式电路板及其制作方法，以及应用该复合式电路板的半导体封装结构。
背景技术
半导体封装结构通常包括电路板及电性连接该电路板的半导体晶片。然而，现有的半导体晶片的热膨胀系数与电路板的热膨胀系数通常相差较大，容易造成半导体封装结构产生翘曲等不良，导致产品良率较低。
发明内容
鉴于此，有必要提供一种可有效避免封装过程产生翘曲等不良的复合式电路板及应用其的半导体封装结构。
另外，还有必要提供一种上述复合式电路板的制作方法。
一种复合式电路板，其包括：
一绝缘封胶层，其包括第一表面及与第一表面相对的第二表面；
一防焊层，其形成于绝缘封胶层的第一表面；
一线路图形层，其形成于绝缘封胶层的第一表面且嵌设于防焊层中，该线路图形层的厚度与防焊层的厚度相当；
多个导电柱，其嵌设于绝缘封胶层中，每一导电柱具有与该线路图形层电性导通连接的第一端面和相对绝缘封胶层裸露的第二端面；
一支撑板，其形成于防焊层和线路图形层上，且支撑板开设有一开口以局部裸露所述防焊层和线路图形层。
一种应用上述复合式电路板的半导体封装结构，该半导体封装结构包括复合式电路板及与复合式电路板的线路图形层电性导通连接的半导体晶片。
一种半导体封装结构，其包括上述复合式电路板及与线路图形层电性导通连接的半导体晶片，所述绝缘封胶层的热膨胀系数与所述半导体晶片的热膨胀系数相当。
一种复合式电路板的制作方法，包括步骤：
提供一支撑板；
在该支撑板的一表面的局部形成防焊层；
在该支撑板形成有防焊层的表面且未被该防焊层覆盖的区域形成线路图形层，该线路图形层的厚度与防焊层的厚度相当；
在该线路图形层表面形成多个导电柱，每一导电柱具有与线路图形层电性导通连接的第一端面和与第一端面相对的第二端面；
在该防焊层及线路图形层表面形成绝缘封胶层，且所述多个导电柱嵌设于该绝缘封胶层中，且导电柱的第二端面相对绝缘封胶层裸露；
对支撑板进行蚀刻形成一开口，以局部裸露所述防焊层和线路图形层。
本发明通过对复合式电路板的结构和材料的优化设计，不仅可有效降低成本，还可有效避免后续封装过程中半导体封装结构产品产生翘曲等不良。此外，该复合式电路板的制作方法工艺简单，采用电镀导电柱替代了传统的机械钻孔，并可实现精细的线路图形的制备，还可制作出厚度较薄的复合式电路板，从而降低半导体封装结构的整体厚度。
附图说明
图1是本发明一较佳实施方式的复合式电路板的剖视示意图。
图2是本发明第二较佳实施方式的复合式电路板的剖视示意图。
图3是本发明较佳实施方式的半导体封装结构的剖视示意图。
图4是图1所示的复合式电路板的加工流程示意图一。
图5是图1所示的复合式电路板的加工流程示意图二。
主要元件符号说明
复合式电路板 10，20
防焊层 11
线路图形层 13
第二防焊层 21
第二线路图形层 23
绝缘封胶层 15
第一表面 153
第二表面 155
导电柱 17
第一端面 171
第二端面 173
支撑板 30
开口 33
通孔 31
半导体晶片 50
焊锡 60
保护干膜 70
半导体封装结构 100
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明一较佳实施方式的复合式电路板10包括：
一绝缘封胶层15，其包括第一表面153及与第一表面153相对的第二表面155；
一防焊层11，其形成于绝缘封胶层15的第一表面153；
一线路图形层13，其形成于绝缘封胶层15的第一表面153且嵌设于防焊层11中，该线路图形层13的厚度与防焊层11的厚度相当；
多个导电柱17，其嵌设于绝缘封胶层15中，每一导电柱17具有与该线路图形层13电性导通连接的第一端面171和相对绝缘封胶层15裸露的第二端面173；
一支撑板30，其形成于防焊层11和线路图形层13上，且支撑板30开设有一开口33以局部裸露所述防焊层11和线路图形层13。
每一导电柱17的第二端面173与绝缘封胶层15的第二表面155相平齐或相对突出于所述绝缘封胶层15的第二表面155。
该防焊层11由业界常规使用的防焊油墨涂布形成。
该绝缘封胶层15主要成分为环氧树脂。该绝缘封胶层15的热膨胀系数（3～6ppm/℃）与半导体晶片的热膨胀系数（3～4ppm/℃）相当，可有效避免后续封装半导体结构时造成的翘曲等不良。本发明采用环氧树脂作为构成绝缘封胶层15的主要材料，相较于传统电路板使用的铜箔基板材料（CCL）和聚丙烯（PP），其成本更加低廉。
该线路图形层13、导电柱17的材质可为业界常规使用的各种导电的金属，优选为金属铜。
该支撑板30具有足够的硬度和强度，以防止所述复合式电路板10搬运输送过程中发生弯折变形等损毁，且可更方便的拿取所述复合式电路板10。本实施例中，该支撑板30可为被铜层包覆的聚合物板材。
所述防焊层11和线路图形层13相对支撑板30的开口33裸露的区域形成为一粘晶区域（图未示）以连接一半导体晶片50。
请参阅图2，本发明第二较佳实施方式的复合式电路板20，其在上述的复合式电路板10的基础上还增加有第二防焊层21和第二线路图形层23。该第二防焊层21和第二线路图形层23形成于绝缘封胶层15的第二表面155，且该第二线路图形层23嵌设于该第二防焊层21中，且第二线路图形层23的部分表面相对该第二防焊层21裸露，第二线路图形层23与导电柱17的第二端面173电性导通连接。
请参阅图3，本发明一较佳实施方式的半导体封装结构100，其包括上述的复合式电路板20及半导体晶片50。该半导体晶片50与线路图形层13通过焊锡60实现电性导通连接。本实施例中，该半导体晶片50可为业界常规使用的覆晶晶片（flip-chip）或打线晶片（wire-bond）。
可以理解的，当采用覆晶晶片，则需要在复合式电路板20与覆晶晶片的结合处填充胶体（图未示），一方面胶体可包裹住所述焊锡60以保护焊锡60，另一方面可增强复合式电路板20与覆晶晶片二者之间的结合力。
可以理解的，其他的实施方式中，该半导体封装结构100中的复合式电路板20也可用复合式电路板10替代。
请参阅图4-5，本发明一较佳实施方式的制作上述复合式电路板10的方法包括如下步骤：
(S1)提供一支撑板30。
该支撑板30具有足够的硬度和强度，用以承载所述复合式电路板10。本实施例中，该支撑板30为被铜层包覆的聚合物板材，如图4所示。
(S2)在该支撑板30一表面的局部形成防焊层11。
该步骤具体可为：在支撑板30的一表面全部涂覆感光防焊油墨，然后对该涂覆后的感光防焊油墨进行曝光显影，以去除支撑板30表面的部分感光防焊油墨，使该支撑板30的局部表面形成防焊层11。
该步骤中对感光防焊油墨进行曝光时，可预先在支撑板30上开设相应的通孔31（如图4所示。需说明的是，图4所示的通孔31的位置仅为示意，不代表实际通孔31的开设位置），光线（如紫外线）从支撑板30未涂覆感光防焊油墨的一侧射入，通过所述通孔31照射到感光防焊油墨。
(S3)在该支撑板30形成有防焊层11的表面、且未被该防焊层11覆盖的区域形成线路图形层13。
本实施例中，形成线路图形层13的方法可为电镀。该线路图形层13的厚度与防焊层11的厚度相当。本发明的方法可实现精细的线路图形的制备。
(S4)在该线路图形层13表面形成多个导电柱17，每一导电柱17具有与线路图形层13电性导通连接的第一端面171和与第一端面171相对的第二端面173。
请参阅图5，该步骤具体包括：在防焊层11及线路图形层13的表面形成一保护干膜70（如图5所示，支撑板30远离线路图形层13的表面也需形成保护干膜70）；对形成于防焊层11及线路图形层13的表面的保护干膜70进行曝光显影以去除部分保护干膜70，并使线路图形层13局部裸露；在该线路图形层13局部裸露的表面形成多个导电柱17与该线路图形层13连通（形成导电柱17的方法可为电镀）；最后去除残留的保护干膜70即可。本发明的方法采用电镀导电柱17替代了传统的机械钻孔方式。
(S5)在该防焊层11及线路图形层13表面形成一绝缘封胶层15，且所述多个导电柱17嵌设于该绝缘封胶层15中，且导电柱17的第二端面173相对绝缘封胶层15裸露。
该步骤具体可为：将步骤(S4)获得的产品放入一模具（图未示）中，注塑熔融树脂于该防焊层11及线路图形层13的表面形成绝缘封胶层15，并使所述多个导电柱17嵌设于该绝缘封胶层15中（如图5所示）。该步骤还可包括对注塑形成的绝缘封胶层15的表面进行研磨，以使导电柱17的第二端面173相对绝缘封胶层15裸露。
可以理解的，进行步骤(S5)之前，还可对所述多个导电柱17进行微蚀刻以粗化所述导电柱17的表面，如此可增强导电柱17与绝缘封胶层15二者之间的结合力。
该方法还可包括对支撑板30进行局部蚀刻形成一开口33的步骤，以局部裸露所述防焊层11和线路图形层13。局部蚀刻的方式同样可参上所述的方式，即在支撑板30上形成保护干膜70，并对保护干膜70进行曝光显影以去除部分保护干膜70使支撑板30需蚀刻的表面得以裸露；然后对裸露的支撑板30进行蚀刻去除。蚀刻去除方法可采用常规的蚀刻液进行化学蚀刻。
本发明复合式电路板的制作方法工艺简单，可制作出厚度较薄的复合式电路板，从而降低半导体封装结构的整体厚度。
可以理解的，制作上述复合式电路板20时，还需要在上述步骤(S5)的基础上进一步进行形成第二防焊层21和第二线路图形层23的步骤。具体可增加如下步骤：在绝缘封胶层15的表面形成（如物理气相沉积）第二线路图形层23使其与多个导电柱17的第二端面173电性导通连接；对该第二线路图形层23进行局部蚀刻去除部分的第二线路图形层23，并使绝缘封胶层15裸露；再在裸露的绝缘封胶层15表面涂覆防焊油墨形成第二防焊层21。
对该第二线路图形层23进行局部蚀刻的方法具体可为：在第二线路图形层23的表面形成保护干膜70（注：支撑板30远离线路图形层13的表面也需形成保护干膜70）；对形成于第二线路图形层23的表面的保护干膜70进行曝光显影以去除部分保护干膜70，使第二线路图形层23需蚀刻的表面得以裸露；然后对裸露的第二线路图形层23进行蚀刻去除。蚀刻去除方法可采用常规的蚀刻液进行化学蚀刻。
可以理解的，在制作复合式电路板的最后阶段，还可在线路图形层13、或线路图形层13和第二线路图形层23的表面涂覆有机保焊剂（OSP）（图未示），以保护线路图形层13和/或第二线路图形层23的表面；或是在线路图形层13、或线路图形层13和第二线路图形层23的表面形成（如电镀）镍钯金层（图未示），以避免线路图形层13和/或第二线路图形层23裸露表面的氧化。
本发明通过对复合式电路板的结构和材料的优化设计（包括在基板结构中引入绝缘封胶层，并通过材料的设计使绝缘封胶层的热膨胀系数与半导体晶片的热膨胀系数相当），不仅可有效降低成本，还可有效避免后续封装过程中半导体封装结构产品产生翘曲等不良。此外，该复合式电路板的制作方法工艺简单，采用电镀导电柱替代了传统的机械钻孔，并可实现精细的线路图形的制备，还可制作出厚度较薄的复合式电路板，从而降低半导体封装结构的整体厚度。

Claims (16)

1.一种复合式电路板，其包括：
一绝缘封胶层，其包括第一表面及与第一表面相对的第二表面；
一防焊层，其形成于绝缘封胶层的第一表面；
一线路图形层，其形成于绝缘封胶层的第一表面且嵌设于防焊层中，该线路图形层的厚度与防焊层的厚度相当；
多个导电柱，其嵌设于绝缘封胶层中，每一导电柱具有与该线路图形层电性导通连接的第一端面和相对绝缘封胶层裸露的第二端面；
一支撑板，其形成于防焊层和线路图形层上，且支撑板开设有一开口以局部裸露所述防焊层和线路图形层。
2.如权利要求1所述的复合式电路板，其特征在于：每一导电柱的第二端面与绝缘封胶层的第二表面相平齐或相对突出于所述绝缘封胶层的第二表面。
3.如权利要求1所述的复合式电路板，其特征在于：该绝缘封胶层的热膨胀系数为3～6ppm/℃。
4.如权利要求1所述的复合式电路板，其特征在于：该绝缘封胶层的主要成分为环氧树脂。
5.如权利要求1所述的复合式电路板，其特征在于：该线路图形层、导电柱的材质均为金属铜。
6.如权利要求1所述的复合式电路板，其特征在于：该复合式电路板还包括第二防焊层和第二线路图形层，该第二防焊层和第二线路图形层形成于绝缘封胶层的第二表面，该第二线路图形层嵌设于该第二防焊层中，且第二线路图形层的部分表面相对该第二防焊层裸露，该第二线路图形层与导电柱电性导通连接。
7.如权利要求1所述的复合式电路板，其特征在于：所述防焊层和线路图形层相对开口裸露的区域形成一粘晶区域以连接半导体晶片。
8.一种半导体封装结构，其包括如权利要求1~7任一项所述的复合式电路板及与所述线路图形层电性导通连接的半导体晶片，所述绝缘封胶层的热膨胀系数与所述半导体晶片的热膨胀系数相当。
9.一种复合式电路板的制作方法，包括步骤：
提供一支撑板；
在该支撑板的一表面的局部形成防焊层；
在该支撑板形成有防焊层的表面且未被该防焊层覆盖的区域形成线路图形层，该线路图形层的厚度与防焊层的厚度相当；
在该线路图形层表面形成多个导电柱，每一导电柱具有与线路图形层电性导通连接的第一端面和与第一端面相对的第二端面；
在该防焊层及线路图形层表面形成绝缘封胶层，且所述多个导电柱嵌设于该绝缘封胶层中，且导电柱的第二端面相对绝缘封胶层裸露；
对支撑板进行蚀刻形成一开口，以局部裸露所述防焊层和线路图形层。
10.如权利要求9所述的复合式电路板的制作方法，其特征在于：所述形成线路图形层和多个导电柱的的方法均为电镀。
11.如权利要求9所述的复合式电路板的制作方法，其特征在于：在该支撑板的局部表面形成防焊层的步骤具体包括：在支撑板的一表面全部涂覆感光防焊油墨，然后对该涂覆后的感光防焊油墨进行曝光显影以去除支撑板表面的部分感光防焊油墨，使该支撑板的局部表面形成防焊层。
12.如权利要求9所述的复合式电路板的制作方法，其特征在于：所述形成多个导电柱的步骤具体包括：在防焊层及线路图形层的表面形成保护干膜；对该保护干膜进行曝光显影以去除部分保护干膜，并使线路图形层局部裸露；在该线路图形层局部裸露的表面形成多个导电柱与该线路图形层连通；去除残留的保护干膜。
13.如权利要求9所述的复合式电路板的制作方法，其特征在于：形成绝缘封胶层的步骤具体包括：采用模具注塑法，注塑熔融树脂于该防焊层及线路图形层的表面形成绝缘封胶层，并使所述多个导电柱嵌设于该绝缘封胶层中；对注塑形成的绝缘封胶层的表面进行研磨。
14.如权利要求9所述的复合式电路板的制作方法，其特征在于：该方法还包括在形成绝缘封胶层的步骤前，对所述多个导电柱进行微蚀刻以粗化所述导电柱的表面的步骤。
15.如权利要求9所述的复合式电路板的制作方法，其特征在于：该方法还包括在形成绝缘封胶层的步骤后，在绝缘封胶层的一表面形成第二线路图形层与多个导电柱的第二端面电性导通连接；对该第二线路图形层进行局部蚀刻去除部分的第二线路图形层，并使绝缘封胶层裸露；再在裸露的绝缘封胶层表面涂覆防焊油墨形成第二防焊层。
16.如权利要求9所述的复合式电路板的制作方法，其特征在于：该绝缘封胶层的主要成分为环氧树脂，该绝缘封胶层的热膨胀系数为3～6ppm/℃。
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CN110366308A (zh) * 2019-08-02 2019-10-22 昆山丘钛微电子科技有限公司 线路板制造方法及线路板
CN110996519A (zh) * 2019-12-17 2020-04-10 Tcl华瑞照明科技（惠州）有限公司 线路板及其制作方法

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TWI622151B (zh) * 2016-12-07 2018-04-21 矽品精密工業股份有限公司 用於半導體封裝的承載基板與其封裝結構，及半導體封裝元件的製作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110366308A (zh) * 2019-08-02 2019-10-22 昆山丘钛微电子科技有限公司 线路板制造方法及线路板
CN110996519A (zh) * 2019-12-17 2020-04-10 Tcl华瑞照明科技（惠州）有限公司 线路板及其制作方法

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