JP2009194065A - Silicon carbide semiconductor device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an SiC semiconductor device in the structure for improving a yield by preventing fluctuation in product characteristics, and also to provide a method of manufacturing the device. <P>SOLUTION: A p-type deep layer 10 is formed and extended in the direction of a normal for a part where a channel region is constituted in the side surface of a trench 6. According to this structure, a depletion layer at the PN junction between the p-type deep layer 10 and an n<SP>-</SP>-type drift layer 2 is significantly extended to the side of the n<SP>-</SP>-type drift layer 2 and thereby a high voltage caused by a drain voltage is hardly input into a gate oxide film 8. Therefore, a concentration of an electric field in the gate oxide film 8 can be mitigated particularly at the bottom of the trench 6 in the gate oxide film 8 and the breakage of the gate oxide film 8 can be prevented. Moreover, since the longitudinal direction of the trench 6 is formed perpendicularly to the longitudinal direction of the p-type deep layer 10, displacement in the mask for forming these elements does not affect device characteristics. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a silicon carbide (hereinafter referred to as SiC) semiconductor device having a trench gate and a method for manufacturing the same.

  In recent years, SiC has attracted attention as a power device material that can provide high electric field breakdown strength. Since the SiC semiconductor device has a high electric field breakdown strength, a large current can be controlled. Therefore, it is expected to be utilized for controlling a hybrid car motor.

  In the SiC semiconductor device, it is effective to increase the channel density in order to flow a larger current. For this reason, MOSFETs having a trench gate structure are adopted and put into practical use in silicon transistors. This trench gate structure is naturally applicable to a SiC semiconductor device, but there is a big problem when applied to SiC. That is, since SiC has a breakdown electric field strength 10 times that of silicon, SiC semiconductor devices are used in a state where a voltage nearly 10 times that of silicon devices is applied. Therefore, there is a problem that an electric field 10 times stronger than that of the silicon device is applied to the gate insulating film formed in the trench that has entered SiC, and the gate insulating film is easily broken at the corner of the trench. When this was calculated by simulation, an electric field of 4.9 MV / cm was concentrated on the gate insulating film in the trench when 650 V was applied to the drain. In order to withstand actual use, it is necessary to make it 3 MV / cm or less, and considering long-term reliability, it is desired to make it 2 MV / cm or less.

As a solution to such a problem, there is an SiC semiconductor device disclosed in Patent Document 1. In this SiC semiconductor device, the electric field concentration at the bottom of the trench is reduced by designing the bottom of the trench gate to be thicker than the side surface. Specifically, a (1120) plane trench gate structure is fabricated using a 4H—SiC (000-1) c plane substrate. Thus, when a gate insulating film is formed by thermal oxidation in a trench in which a trench side surface is an a surface and a bottom surface is a c surface using a c surface substrate, the oxidation rate of the c surface is 5 times that of the a surface. The oxide film at the bottom of the trench can be five times as thick as the side surface. Thereby, it is possible to alleviate electric field concentration at the bottom of the trench.
JP 9-199724 A

  However, in the structure in which the gate insulating film is thick at the bottom of the trench as described above, for example, when the film thickness on the side surface of the trench is set to 40 nm and the film thickness at the bottom of the trench is designed to 200 nm, calculation is performed by simulation. In this case, it was confirmed that the electric field concentration of the gate insulating film in the trench could be reduced to 3.9 MV / cm. However, it was not yet sufficient, and it was found that further electric field relaxation was necessary.

Therefore, the present inventors have previously made a structure that can further relax the electric field, extending in the longitudinal direction of the trench gate, and on the opposite side of the trench gate across the n ⁺ -type source region and the p-type base region. That is, a structure has been filed in which a p-type deep layer deeper than the bottom surface of the trench gate is formed at a position below the p ⁺ -type contact region for electrical connection between the p-type base region and the source electrode ( (See Japanese Patent Application No. 2007-288545).

  However, in the SiC semiconductor device having this structure, since the formation process of the trench gate and the p-type deep layer is a separate process, it is difficult to align them, and the distance from the side surface of the trench gate to the p-type deep layer varies. appear. For this reason, there is a problem that the product characteristics vary and the yield is poor.

  In view of the above-described points, an object of the present invention is to provide an SiC semiconductor device having a structure capable of preventing variations in product characteristics and improving yield and a method for manufacturing the same.

  In order to achieve the above object, according to the first aspect of the present invention, the storage channel formed in the channel layer (7) is controlled by controlling the voltage applied to the gate electrode (9), and the source region ( 4) In a SiC semiconductor device including a storage type MOSFET that allows current to flow between the source electrode (11) and the drain electrode (13) via the drift layer (2), the SiC semiconductor device is disposed below the base region (3). And a deep layer (10) of a second conductivity type that is disposed up to a position deeper than the trench (6) and extends in a normal direction to the side surface of the trench (6) where the channel region is formed. It is characterized by.

  As described above, since the deep layer (10) is deeper than the trench (6), the depletion layer at the PN junction between the deep layer (10) and the drift layer (2) is the drift layer (2). The high voltage due to the influence of the drain voltage hardly enters the gate insulating film (8). Therefore, it is possible to alleviate electric field concentration in the gate oxide film (8), particularly electric field concentration at the bottom of the trench (6) in the gate oxide film (8). This can prevent the gate oxide film (8) from being destroyed.

  In addition, since the longitudinal direction of the trench (6) and the longitudinal direction of the deep layer (10) are perpendicular to each other, mask displacement for forming these does not affect the device characteristics. As a result, variation in product characteristics can be prevented and yield can be improved.

  Here, the SiC semiconductor device having the storage type MOSFET has been described. However, as described in claim 2, the SiC semiconductor device is positioned on the side surface of the trench (6) by controlling the voltage applied to the gate electrode (9). A channel region is formed in the surface portion of the base region (3), and an inversion type is used to pass current between the source electrode (11) and the drain electrode (13) via the source region (4) and the drift layer (2). A structure similar to the above can also be adopted for a SiC semiconductor device including a MOSFET.

  If such a deep layer (10) has the same impurity concentration as that of the base region (3) or a higher impurity concentration than that of the base region (3), a depletion layer extending to the drift layer (2) side is provided. Since the amount of elongation can be increased, the electric field relaxation effect can be enhanced, and the gate insulating film (8) can be further prevented from being destroyed.

  Further, as described in claim 4, a plurality of such deep layers (10) are provided, and the deep layers (10) can be arranged with a predetermined interval therebetween. .

  In the fifth aspect of the present invention, the current distribution is made of SiC of the first conductivity type having a higher impurity concentration than the drift layer (2) between the drift layer (2) and the base region (3). A layer (30) is formed.

  In such a configuration, since the current flowing through the channel layer (7) at the time of ON is expanded in the normal direction to the side surface of the trench (6) in the current spreading layer (30), the inside of the drift layer (2) is widened. It will flow in a distributed manner. For this reason, it becomes possible to reduce on-resistance.

  Such a current spreading layer (30) has the same or higher impurity concentration as the drift layer (2), as described in claim 6. When the current spreading layer (30) and the drift layer (2) have the same impurity concentration, the current spreading layer (30) has little effect of spreading the current over a wide range, but at least the current spreading layer (30) is provided. As a result, the depth of the deep layer (10) with respect to the bottom surface of the trench (6) can be made deeper than in the case where the current spreading layer (30) is not formed, so that the effect shown in claim 1 can be obtained. Become. Further, when the current spreading layer (30) has a higher impurity concentration than the drift layer (2), the current spreading layer (30) can obtain an effect of spreading the current over a wide range.

  The invention according to claim 8 is characterized in that the deep layer (10) is in contact with the base region (3) through the current spreading layer (30).

  Thus, if the current spreading layer (30) is in contact with the deep layer (10), the deep layer (10) can be fixed to the source potential. Therefore, it is possible to prevent the electric field relaxation effect from being weakened as compared with the case where the deep layer (10) is in a floating state.

  The invention according to claim 9 is characterized in that the impurity concentration of the drift layer (2) is lowered as it approaches the base region (3) from the substrate (1).

  In this way, since the internal resistance of the drift layer (2) can be reduced, the on-resistance can be reduced.

  The SiC semiconductor device as described above is manufactured by, for example, a manufacturing method shown below.

  For example, as described in claim 10, the first or second conductivity type substrate (1) made of SiC is made of SiC of the first conductivity type having a lower impurity concentration than the substrate (1). The step of forming the drift layer (2) and the mask (20) are arranged on the surface of the drift layer (2), and then ion implantation using the mask (20) is performed to extend in one direction. Forming the second conductivity type deep layer (10), forming the second conductivity type base region (3) on the deep layer (10) and the drift layer (2), and the base region A source region made of SiC having a higher concentration than the drift layer (2) by ion-implanting a first conductivity type impurity into the surface layer portion of the base region (3) in (3). (4) forming step and source region (4) The longitudinal direction is perpendicular to the direction in which the deep layer (10) is extended so as to penetrate the base region (3) from the surface to reach the drift layer (2) and become shallower than the deep layer (10). A step of forming a trench (6), a step of forming a channel layer (7) of the first conductivity type in the trench (6), and a surface of the channel layer (7) in the trench (6). A step of forming a gate insulating film (8), a step of forming a gate electrode (9) on the gate insulating film (8) in the trench (5), and a source region (4) and a base region (3). A manufacturing method including the step of forming a source electrode (11) electrically connected to the substrate and the step of forming a drain electrode (13) on the back side of the substrate (1). An accumulation type SiC semiconductor device can be manufactured.

  In addition, as described in claim 11, before the step of forming the base region (3), the drift layer (2) including the surface of the deep layer (10) and the drift layer (2) is drifted before the step of forming the base region (3). In the step of forming the first conductivity type current spreading layer (30) having a higher concentration than the layer (2) and forming the base region (3), the base region is formed on the surface of the current spreading layer (30). By forming the base region (3) on the deep layer (10) and the drift layer (2) by forming (3), the storage type SiC having a structure including the current spreading layer (30) is formed. A semiconductor device can be manufactured.

  In addition, as described in claim 12, after forming the first conductivity type current spreading layer (30) having a higher concentration than the drift layer (2) on the surface of the drift layer (2), the current spreading layer The second conductivity type deep layer (10) is formed so as to extend in one direction by disposing a mask (20) on the surface of (30) and performing ion implantation using the mask (20). If the second conductivity type base region (3) is formed on the surface of the current spreading layer (30) and the deep layer (10), the deep layer (10) penetrates the current spreading layer (30). It is also possible to manufacture a storage type SiC semiconductor device having a structure in which the base region (3) is in contact.

  Furthermore, an inversion type SiC semiconductor device can also be manufactured by the same manufacturing method. However, with respect to the inversion type SiC semiconductor device, the step of forming the gate insulating film (8) directly on the surface of the trench (6) is performed as described in claims 13 to 15, and the trench (6) It is not necessary to carry out the step of forming the channel layer (7) on the surface of the film.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
A first embodiment of the present invention will be described. Here, a storage type trench gate structure MOSFET will be described as an element provided in the SiC semiconductor device.

  FIG. 1 is a perspective sectional view of a MOSFET having a trench gate structure according to the present embodiment. This figure corresponds to the extracted one cell of the MOSFET. Although only one MOSFET cell is shown in the figure, MOSFETs having the same structure as the MOSFET shown in FIG. 1 are arranged so as to be adjacent to each other in a plurality of rows. 2A to 2D are cross-sectional views of the MOSFET of FIG. 1, and FIG. 2-A is a cross-sectional view taken along line AA in FIG. 1 in parallel with the xz plane. 2-b is a section taken along line BB in FIG. 1 when parallel to the xz plane, and FIG. 2-c is a section taken along line CC along line yz in FIG. 2D is a cross section when cut in parallel with the yz plane along the line DD in FIG.

The MOSFET shown in FIGS. 1 and 2-a to 2-d has an n ⁺ -type substrate 1 made of SiC having an n-type impurity concentration of, for example, phosphorus of 1.0 × 10 ¹⁹ / cm ³ and a thickness of about 300 μm. It is used as a semiconductor substrate, and the surface of the n ⁺ -type substrate 1 is made of SiC having an n-type impurity concentration such as phosphorus of 3.0 to 7.0 × 10 ¹⁵ / cm ³ and a thickness of about 10 to ¹⁵ μm. An n ⁻ type drift layer 2 is formed. The impurity concentration of the n ⁻ type drift layer 2 may be constant in the depth direction, but the concentration distribution is inclined, and the n ⁺ type substrate 1 side of the n ⁻ type drift layer 2 is n ⁺ type. It is preferable that the concentration be higher than that on the side away from the substrate 1. For example, the impurity concentration in the portion of about 3 to 5 μm from the surface of the n ⁺ -type substrate 1 in the n ⁻ -type drift layer 2 is preferably higher than that in other portions by about 2.0 × 10 ¹⁵ / cm ³ . In this way, since the internal resistance of the n ⁻ type drift layer 2 can be reduced, the on-resistance can be reduced.

A p-type base region 3 is formed in the surface layer portion of the n ⁻ -type drift layer 2, and an n ⁺ -type source region 4 and a p ⁺ -type body layer 5 are formed in an upper layer portion of the p-type base region 3. ing.

The p-type base region 3 has a p-type impurity concentration such as boron or aluminum of, for example, 5.0 × 10 ^{16 to} 2.0 × 10 ¹⁹ / cm ³ and a thickness of about 2.0 μm. The n ⁺ -type source region 4 is configured such that the n-type impurity concentration (surface concentration) such as phosphorus in the surface layer portion is, for example, 1.0 × 10 ²¹ / cm ³ and the thickness is about 0.3 μm. The p ⁺ -type body layer 5 is configured to have a p-type impurity concentration (surface concentration) such as boron or aluminum in the surface layer portion of, for example, 1.0 × 10 ²¹ / cm ³ and a thickness of about 0.3 μm. The n ⁺ type source region 4 is disposed on both sides of a trench gate structure described later, and the p ⁺ type body layer 5 is provided on the opposite side of the trench gate structure with the n ⁺ type source region 4 interposed therebetween.

For example, the width is 1.4 to 2.0 μm and the depth is 2.0 μm or more (for example, 2 μm) so as to penetrate the p-type base region 3 and the n ⁺ -type source region 4 and reach the n ⁻ -type drift layer 2. .4 μm) trenches 6 are formed. The p-type base region 3 and the n ⁺ -type source region 4 are arranged so as to be in contact with the side surface of the trench 6. An n-type channel layer 7 having an n-type impurity concentration such as phosphorus of 1.0 × 10 ¹⁶ / cm ³ is formed on the inner wall surface of the trench 6. The n-type channel layer 7 is for forming a channel region, and is set to a thickness that is normally off, for example, 0.3 to 1.0 μm on the bottom surface of the trench 6 and 0. 1 to 0.3 μm.

  Further, the surface of the n-type channel layer 7 is covered with a gate oxide film 8, and the trench 6 is filled with the gate electrode 9 made of doped Poly-Si formed on the surface of the gate oxide film 8. It is exhausted. The gate oxide film 8 is formed by thermally oxidizing the surface of the n-type channel layer 7, and the thickness of the gate oxide film 8 is about 100 nm on both the side surface side and the bottom side of the trench 6.

In this way, a trench gate structure is configured. This trench gate structure is extended with the y direction in FIG. 1 as the longitudinal direction. A plurality of trench gate structures are arranged in parallel in the x direction in FIG. In addition, the n ⁺ type source region 4 and the p ⁺ type body layer 5 described above are also extended along the longitudinal direction of the trench gate structure.

Further, in the n ⁻ type drift layer 2 below the p-type base region 3, the normal direction to the portion of the side surface of the trench 6 in the trench gate structure where the channel region is formed (the x direction in FIG. 1). That is, the p-type deep layer 10 extending in the direction perpendicular to the longitudinal direction of the trench 6 is provided. The p-type deep layer 10 is deeper than the bottom of the trench 6, that is, the bottom of the n-type channel layer 7, and the depth from the surface of the n ⁻ -type drift layer 2 is, for example, about 2.6 to 3.0 μm ( The depth from the bottom of the p-type base region 3 is, for example, 0.6 to 1.0 μm. Moreover, the width | variety (y direction dimension in FIG. 1) of the p-type deep layer 10 shall be 0.6-1.0 micrometer. The p-type impurity concentration in the p-type deep layer 10 such as boron or aluminum is, for example, 1.0 × 10 ¹⁷ / cm ^{3 to} 1.0 × 10 ¹⁹ / cm ³ . A plurality of the p-type deep layers 10 are arranged in parallel along the longitudinal direction of the trench gate structure, and the interval between the adjacent p-type deep layers 10 is, for example, 2 to 3 μm.

A source electrode 11 and a gate wiring (not shown) are formed on the surface of the n ⁺ type source region 4 and the p ⁺ type body layer 5 and the surface of the gate electrode 9. The source electrode 11 and the gate wiring are composed of a plurality of metals (for example, Ni / Al, etc.), and at least n-type SiC (specifically, the n ⁺ -type source region 4 and the gate electrode 9 in the case of n doping) The portion in contact with n-type SiC is made of a metal capable of ohmic contact with n-type SiC, and the portion in contact with at least p-type SiC (specifically, p ⁺ -type body layer 5 or gate electrode 9 in the case of p-doping) is p-type. It is made of a metal capable of ohmic contact with SiC. The source electrode 11 and the gate wiring are electrically insulated by being formed on the interlayer insulating film 12, and the source electrode 11 is connected to the n ⁺ -type source region through the contact hole formed in the interlayer insulating film 12. 4 and p ⁺ type body layer 5 are in electrical contact, and the gate wiring is in electrical contact with gate electrode 9.

Then, on the back side of the n ⁺ -type substrate 1 n ⁺ -type substrate 1 and electrically connected to the drain electrode 13 are formed. With such a structure, an n-channel storage type MOSFET with a trench gate structure is formed.

  Such an accumulation type MOSFET having a trench gate structure operates as follows.

First, in a state before applying a gate voltage to the gate electrode 9, SiC has an intrinsic potential of about 3 V when the impurity concentration is as high as 1.0 × 10 ¹⁹ / cm ^3. Even if 11 is 0V, the p-type base region 3 behaves like -3V. For this reason, a depletion layer spreads from the p-type base region 3, and the vicinity of the p-type base region 3 behaves like an insulator. Therefore, even if a positive voltage is applied to the drain electrode 13, the n-type channel layer 7 behaves like an insulator, so electrons cannot reach the n-type channel layer 7, and the source electrode 11 and the drain electrode No current flows between

Next, when off (gate voltage = 0 V, drain voltage = 650 V, source voltage = 0 V), since a reverse bias is applied even if a voltage is applied to the drain electrode 13, the p-type base region 3 and the n ⁻ -type drift layer 2 (including the n-type channel layer 7) spreads the depletion layer. At this time, since the concentration of the p-type base region 3 is much higher than that of the n ⁻ -type drift layer 2, the depletion layer almost extends to the n ⁻ -type drift layer 2 side. For example, when the impurity concentration of the p-type base region 3 is 10 times the impurity concentration of the n ⁻ -type drift layer 2 as in the present embodiment, the p ⁻ base region 3 extends about 0.7 μm, and the n ⁻ -type Although it extends about 7.0 μm to the drift layer 2 side, the thickness of the p-type base region 3 is 2.0 μm, which is larger than the extension amount of the depletion layer, so that punch-through can be prevented. Since the depletion layer is wider than in the case of the drain 0 V, the region that behaves as an insulator further widens, so that no current flows between the source electrode 11 and the drain electrode 13.

In addition, since the gate voltage is 0 V, an electric field is also applied between the drain and the gate. For this reason, electric field concentration can also occur at the bottom of the gate oxide film 8. However, since the p-type deep layer 10 is deeper than the trench 6, the depletion layer at the PN junction between the p-type deep layer 10 and the n ⁻ -type drift layer 2 is on the n ⁻ -type drift layer 2 side. As a result, the high voltage due to the influence of the drain voltage hardly enters the gate oxide film 8. In particular, if the impurity concentration of the p-type deep layer 10 is higher than that of the p-type base region 3, the amount of depletion layer extending toward the n ⁻ -type drift layer 2 becomes larger. Thereby, the electric field concentration in the gate oxide film 8, particularly the electric field concentration at the bottom of the trench 6 in the gate oxide film 8 can be relaxed, and the gate oxide film 8 is prevented from being destroyed. Is possible.

  When confirmed by simulation, when 650 V was applied to the drain electrode 13, the electric field strength at the bottom of the trench 6 in the gate oxide film 8 was 2.0 MV / cm. This electric field strength is at a level at which the gate oxide film 8 is not destroyed by electric field concentration. For this reason, even if 650V is applied to the drain electrode 13, the gate oxide film 8 is not destroyed, and a withstand voltage of 650V can be achieved.

On the other hand, when ON (gate voltage = 20V, drain voltage = 1V, source voltage = 0V), 20V is applied to the gate electrode 9 as a gate voltage, so that the n-type channel layer 7 functions as a storage channel. For this reason, the electrons injected from the source electrode 11 reach the n ⁻ type drift layer 2 after passing through the n type channel layer 7 from the n ⁺ type source region 4. As a result, a current can flow between the source electrode 11 and the drain electrode 13.

The on-resistance in this case is calculated to be 4.9 mΩ · cm ² , and the on-resistance when the p-type deep layer 10 having the structure as in the present embodiment is not formed is 4.3 mΩ · cm ² . On the other hand, the on-resistance increased by 15%. This is because a channel is not formed on the side surface of the trench gate structure at the position where the p-type deep layer 10 is formed. However, the increase in on-resistance is not large, and can be adjusted according to the width and interval of the p-type deep layer 10, so that there is no problem.

  As a reference, a potential distribution was simulated when it was assumed that 650 V was applied to the drain electrode 13 as described above. The results are shown in FIGS. 3A and 3B are cross-sectional views corresponding to FIG. 2A, respectively, and the SiC semiconductor device having the p-type deep layer 10 and the SiC semiconductor not having the p-type deep layer 10 shown in the present embodiment. It is the figure which showed the electric potential distribution of an apparatus, and equipotential lines are shown by the 10V space | interval by making the surface (top part) of the p-type base region 3 and the p-type deep layer 10 into 0V. FIG. 4 shows the potential distribution of the SiC semiconductor device having the p-type deep layer 10 shown in the present embodiment in a cross section different from that shown in FIG. 3A, specifically, in a cross section corresponding to FIG. FIG.

  As shown in FIG. 3B, it can be seen that when the p-type deep layer 10 is not formed, the interval between the equipotential lines is very narrow in the gate oxide film 8, particularly in the bottom of the trench. The electric field in the gate oxide film 8 at this time was 4.9 MV / cm. On the other hand, when the p-type deep layer 10 configured as in the present embodiment is formed, the equipotential lines are pushed down by the p-type deep layer 10 as shown in FIG. As shown, the equipotential lines in the gate oxide film 8 can widen the distance between the p-type deep layers 10 on both the side and bottom of the trench. Then, it can be seen that the electric field in the gate oxide film 8 at this time is 2.0 MV / cm as described above, and is reduced to half or less that when the p-type deep layer 10 is not formed. Therefore, by forming the p-type deep layer 10 having the structure as in the present embodiment, the electric field concentration in the gate oxide film 8 can be sufficiently relaxed.

  Next, a method for manufacturing the trench gate type MOSFET shown in FIG. 1 will be described. 5 to 6 are cross-sectional views showing a manufacturing process of the trench gate type MOSFET shown in FIG. 5 and 6, the left side is a cross-sectional view taken along line AA in FIG. 1 in parallel with the xz plane (the location corresponding to FIG. 2-a), and the right side is D- in FIG. A cross-sectional view taken along line D and parallel to the yz plane (a place corresponding to FIG. 2D) is shown. Hereinafter, description will be given with reference to these drawings.

[Step shown in FIG. 5A]
First, an n ⁺ -type substrate 1 having an n-type impurity concentration such as phosphorus of 1.0 × 10 ¹⁹ / cm ³ and a thickness of about 300 μm is prepared. After forming the drain electrode 13 on the back side of the n ⁺ -type substrate 1, the thickness of n-type impurity concentration of, for example, 3.0~7.0 × 10 ¹⁵ / cm ³ of phosphorus or the like on the surface of the n ⁺ -type substrate 1 An n ⁻ type drift layer 2 made of SiC having a thickness of about 15 μm is epitaxially grown.

[Step shown in FIG. 5B]
After the mask 20 made of LTO or the like is formed on the surface of the n ⁻ type drift layer 2, the mask 20 is opened in a region where the p-type deep layer 10 is to be formed through a photolithography process. Then, ion implantation and activation of a p-type impurity (for example, boron or aluminum) is performed on the mask 20 so that, for example, the boron or aluminum concentration is 1.0 × 10 ¹⁷ / cm ^{3 to} 1.0 × 10 ¹⁹ / cm. ^{3. A} p-type deep layer 10 having a thickness of about 0.6 to 1.0 μm and a width of about 0.6 to 1.0 μm is formed. Thereafter, the mask 20 is removed.

[Step shown in FIG. 5 (c)]
A p-type impurity layer having a p-type impurity concentration such as boron or aluminum of about 5.0 × 10 ^{16 to} 2.0 × 10 ¹⁹ / cm ³ and a thickness of about 2.0 μm is formed on the surface of the n ⁻ -type drift layer 2. Is grown epitaxially to form the p-type base region 3.

[Step shown in FIG. 6A]
A mask (not shown) made of, for example, LTO is formed on the p-type base region 3, and the mask is opened on a region where the n ⁺ -type source region 4 is to be formed through a photolithography process. Thereafter, n-type impurities (for example, nitrogen) are ion-implanted. Subsequently, after removing the previously used mask, a mask (not shown) is formed again, and the mask is opened on a region where the p ⁺ -type body layer 5 is to be formed through a photolithography process. Thereafter, a p-type impurity (for example, nitrogen) is ion-implanted. Then, by activating the implanted ions, the n ⁺ -type source region 4 having an n-type impurity concentration (surface concentration) such as phosphorus of 1.0 × 10 ²¹ / cm ³ and a thickness of about 0.3 μm is formed. At the same time, a p ⁺ type body layer 5 having a p type impurity concentration (surface concentration) of, eg, 1.0 × 10 ²¹ / cm ³ and a thickness of about 0.3 μm is formed. Thereafter, the mask is removed.

[Step shown in FIG. 6B]
After forming an etching mask (not shown) on the p-type base region 3, the n ⁺ -type source region 4 and the p ⁺ -type body layer 5, the etching mask is opened in a region where the trench 6 is to be formed. Then, after performing anisotropic etching using an etching mask, isotropic etching or sacrificial oxidation process is performed as necessary to form the trench 6. Thereafter, the etching mask is removed.

[Step shown in FIG. 6 (c)]
An n-type channel layer 7 having an n-type impurity concentration such as phosphorus of 1.0 × 10 ¹⁶ / cm ³ is epitaxially grown on the entire surface of the substrate including the inside of the trench 6. At this time, the n-type channel layer 7 is formed so that the bottom surface of the trench 6 is hotter than the side surface due to the plane orientation dependency of epitaxial growth. Subsequently, after removing unnecessary portions of the n-type channel layer 7, that is, portions formed on the p-type base region 3, the n ⁺ -type source region 4 and the p ⁺ -type body layer 5, a gate oxide film forming step To form the gate oxide film 8. Specifically, the gate oxide film 8 is formed by gate oxidation (thermal oxidation) by a pyrogenic method using a wet atmosphere.

  Subsequently, a polysilicon layer doped with n-type impurities is formed on the surface of the gate oxide film 8 at a temperature of about 440 nm, for example, at a temperature of 600.degree. 8 and the gate electrode 9 are left.

Although the subsequent steps are the same as in the prior art and are not shown in the figure, after the interlayer insulating film 12 is formed, the interlayer insulating film is patterned to be connected to the n ⁺ type source region 4 and the p ⁺ type body layer 5. While forming a hole, the contact hole connected with the gate electrode 9 is formed in another cross section. Subsequently, after depositing an electrode material so as to fill the contact hole, the source electrode 11 and the gate wiring are formed by patterning the electrode material. Thereby, the MOSFET shown in FIG. 1 is completed.

  According to the manufacturing method described above, since the p-type deep layer 10 is not formed by trench embedding in which a trench is dug and a p-type layer is epitaxially grown and buried, the planarization step after filling the trench Therefore, it is possible to prevent the occurrence of crystal defects.

  The p-type deep layer 10 can also be formed by ion implantation from the surface of the p-type base layer 3, but ion implantation for forming the p-type deep layer 10 is performed from the surface of the n-type drift layer 2. Like to do. For this reason, it is not necessary to form the p-type deep layer 10 by high-speed ion implantation with high energy, and it becomes possible to suppress generation of defects due to high-speed ion implantation.

  Further, when the longitudinal direction of the trench 6 and the longitudinal direction of the p-type deep layer 10 are made parallel, the device characteristics are affected if the distance between them is not constant. The alignment of the mask used and the mask used when forming the p-type deep layer 10 is important. However, since a certain amount of mask displacement inevitably occurs, the influence of device characteristics due to mask displacement cannot be completely eliminated. On the other hand, according to the SiC semiconductor device of the present embodiment, the longitudinal direction of the trench 6 and the longitudinal direction of the p-type deep layer 10 are perpendicular to each other. There is no impact. As a result, variation in product characteristics can be prevented and yield can be improved. Therefore, by adopting the structure as in the present embodiment, it is possible to provide a SiC semiconductor device having a structure in which variation in product characteristics can be prevented and yield can be improved.

(Second Embodiment)
A second embodiment of the present invention will be described. The SiC semiconductor device of this embodiment is intended to reduce the on-resistance compared to the first embodiment, and the basic structure is the same as that of the first embodiment. Only will be described.

  FIG. 7 is a perspective sectional view of a trench gate structure MOSFET provided in the SiC semiconductor device according to the present embodiment. 8A to 8D are cross-sectional views of the MOSFET of FIG. 7, and FIG. 8-A is a cross-sectional view taken along the line EE in FIG. 8-b is a cross section when cut in parallel with the xz plane at the line FF in FIG. 7, and FIG. 8-c is a cross section when cut in parallel with the yz plane at the line GG in FIG. 8D is a cross-sectional view taken along line HH in FIG. 7 in parallel with the yz plane.

As shown in FIG. 7, in the MOSFET provided in the SiC semiconductor device of this embodiment, the n-type current distribution layer is in contact with the n-type channel layer 7 between the n ⁻ -type drift layer 2 and the p-type base region 3. 30 is provided. The n-type current distribution layer 30 has an n-type impurity concentration such as phosphorus higher than that of the n ⁻ -type drift layer 2, preferably higher than that of the n-type channel layer 7, for example, 2.0 × 10 ¹⁵ / cm. ^{3 to} 1.0 × 10 ¹⁷ / cm ³ . Although the thickness of the n-type current distribution layer 30 is arbitrary, in this embodiment, the thickness is set such that the trench 6 penetrates the n-type current distribution layer 30 and can be, for example, about 0.3 μm. . A p-type deep layer 10 is formed below the n-type current distribution layer 30, and the p-type deep layer 10 and the p-type base region 3 are separated by the n-type current distribution layer 30. In this embodiment, the p-type deep layer 10 is formed so that the depth from the lower surface of the n-type current distribution layer 30 is, for example, 0.6 to 1.0 μm. The interval is the same as in the first embodiment.

The MOSFET configured as described above basically operates in the same manner as in the first embodiment, but the current flowing through the n-type channel layer 7 when turned on is a method for the side surface of the trench 6 in the n-type current distribution layer 30. Since it is expanded in the line direction, it flows in a wide range in the n ⁻ -type drift layer 2. For this reason, it becomes possible to reduce on-resistance as compared with the first embodiment.

  Next, a method for manufacturing the trench gate type MOSFET shown in FIG. 7 will be described. 9 to 10 are cross-sectional views showing a manufacturing process of the trench gate type MOSFET shown in FIG. 9 and 10, the left side is a cross-sectional view taken along the line EE in FIG. 7 in parallel with the xz plane (the place corresponding to FIG. 8A), and the right side is H- in FIG. 7. A sectional view taken along line H in parallel with the yz plane (location corresponding to FIG. 8D) is shown. Hereinafter, description will be given with reference to these drawings.

First, in the steps shown in FIGS. 9A and 9B, the same steps as those shown in FIGS. 5A and 5B described in the first embodiment are performed, so that the n ⁺ type substrate 1 has a back surface. The drain electrode 13 and the n ⁻ type drift layer 2 are formed on the surface side, and the p-type deep layer 10 is formed. 9C, after the n-type current spreading layer 30 is epitaxially grown on the surfaces of the n ⁻ type drift layer 2 and the p-type deep layer 10, the p-type is formed on the surface of the n-type current spreading layer 30. The base region 3 is epitaxially grown. Thereafter, in the steps shown in FIGS. 10A to 10C, the same steps as those in FIGS. 6A to 6C are performed. Further, the interlayer insulating film 12 is formed, the contact hole is formed, the source electrode is formed. 11 and the gate wiring forming process, the MOSFET shown in FIG. 7 is completed.

(Third embodiment)
A third embodiment of the present invention will be described. The SiC semiconductor device of the present embodiment is similar to the second embodiment in that the on-resistance is reduced compared to the first embodiment, and the basic structure is the same as that of the second embodiment. Only the parts different from the embodiment will be described.

  As described above, in the second embodiment, the n-type current distribution layer 30 is formed. However, since the p-type deep layer 10 is separated from the p-type base region 3 in the n-type current distribution layer 30, The p-type deep layer 10 is in a floating state. For this reason, compared with the case where the p-type deep layer 10 is in contact with the p-type base region 3 and fixed at the source potential, the electric field relaxation effect is weakened. The present embodiment has a structure capable of reducing the on-resistance as well as the second embodiment while solving this problem.

  FIG. 11 is a perspective sectional view of a MOSFET having a trench gate structure provided in the SiC semiconductor device according to the present embodiment. 12A to 12D are cross-sectional views of the MOSFET of FIG. 11, and FIG. 12A is a cross-sectional view taken along the line I-I in FIG. 11 parallel to the xz plane. 12-b is a cross section when cut in parallel with the xz plane in the line JJ in FIG. 11, and FIG. 12-c is a cross section when cut in parallel with the yz plane in the line KK in FIG. 12D is a cross-sectional view taken along line LL in FIG. 11 in parallel with the yz plane.

As shown in FIG. 11, the MOSFET provided in the SiC semiconductor device of this embodiment also has an n-type current distribution so as to be in contact with the n-type channel layer 7 between the n ⁻ -type drift layer 2 and the p-type base region 3. A layer 30 is provided. However, in the present embodiment, the p-type deep layer 10 is formed from the surface of the n-type current distribution layer 30, and the p-type deep layer 10 and the p-type base region 3 penetrate through the n-type current distribution layer 30. Are in contact with each other. The p-type deep layer 10 is formed so that the depth from the surface of the n-type current distribution layer 30 is, for example, 0.6 to 1.0 μm, and the impurity concentration, width, and interval are the same as those in the first embodiment. The same is said.

In the MOSFET configured as described above, basically, the same operation as that of the first embodiment is performed, and the current flowing through the n-type channel layer 7 at the time of ON is supplied to the n-type current distribution layer 30 as in the second embodiment. Therefore, since it is expanded in the direction normal to the side surface of the trench 6, it flows in a wide range in the n ⁻ -type drift layer 2, and the on-resistance can be reduced. Since the p-type deep layer 10 is in contact with the p-type base region 3, the p-type deep layer 10 can be fixed at the source potential. Accordingly, it is possible to prevent the electric field relaxation effect from being weakened.

  Next, a manufacturing method of the trench gate type MOSFET shown in FIG. 11 will be described. 13 to 14 are cross-sectional views showing a manufacturing process of the trench gate type MOSFET shown in FIG. 13 and 14, the left side shows a cross-sectional view taken along the line I-I in FIG. 11 in parallel with the xz plane (place corresponding to FIG. 12-a), and the right side shows L- in FIG. A cross-sectional view (a place corresponding to FIG. 12-d) cut in parallel with the yz plane in the L line is shown. Hereinafter, description will be given with reference to these drawings.

First, in the step shown in FIG. 13A, the drain electrode 13 is formed on the back surface side of the n ⁺ -type substrate 1 and the n side is formed on the front surface side by performing the same step as in FIG. 5A described in the first embodiment. ^- After -type drift layer 2, n ^- n on the surface of the type drift layer 2 ^- -type drift layer 2 an n-type current spreading layer 30 is epitaxially grown to have a higher impurity concentration than. 13B, the mask 20 is formed on the surface of the n-type current dispersion layer 30, and the p-type deep layer 10 is formed by performing the same process as in FIG. 5B. Thereafter, in the steps shown in FIGS. 13C and 14A to 14C, the same steps as those in FIGS. 5C and 6A to 6C are performed, and the interlayer insulating film is further processed. The MOSFET shown in FIG. 11 is completed by performing the film forming step 12, the contact hole forming step, the source electrode 11 and the gate wiring forming step, and the like.

(Fourth embodiment)
A fourth embodiment of the present invention will be described. The SiC semiconductor device of the present embodiment is an inversion type MOSFET having the same structure as in the first to third embodiments, and the basic structure is the same as in the first to third embodiments. Only the parts different from the third embodiment will be described.

  FIG. 15 is a perspective sectional view of a trench gate structure MOSFET provided in the SiC semiconductor device according to the present embodiment. Although FIG. 15 shows a structure in which the MOSFET is an inversion type with respect to the structure of the first embodiment, the MOSFET can also be an inversion type for the structures of the second and third embodiments.

As shown in FIG. 15, in this embodiment, the gate oxide film 8 is formed on the surface of the trench 6, and the n-type channel layer 7 shown in the first to third embodiments is not formed. Has been. Therefore, the gate oxide film 8, the p-type base region 3 and the n ⁺ -type source region 4 are in contact with each other on the sidewall of the trench 6.

  In the MOSFET configured as described above, when a gate voltage is applied to the gate electrode 9, a portion of the p-type base region 3 that is in contact with the gate oxide film 8 disposed on the side surface of the trench 6 becomes an inversion channel, and the source An operation of passing a current between the electrode 11 and the drain electrode 13 is performed.

Since the p-type deep layer 10 is also formed in such an inversion type MOSFET as described above, when a high voltage is applied as the drain voltage, as in the first to third embodiments, the p-type is used. The depletion layer at the PN junction between the deep layer 10 and the n ⁻ type drift layer 2 greatly extends to the n ⁻ type drift layer 2 side, and a high voltage due to the influence of the drain voltage hardly enters the gate oxide film 8. . For this reason, it is possible to alleviate electric field concentration in the gate oxide film 8, particularly electric field concentration at the bottom of the trench 6 in the gate oxide film 8. Thereby, it becomes possible to prevent the gate oxide film 8 from being destroyed.

  Note that the manufacturing method of such an inversion type MOSFET is basically the same as in the first to third embodiments, and the n-type channel layer 7 is different from the manufacturing method shown in the first to third embodiments. The gate oxide film 8 may be formed directly on the surface of the trench 6 without the formation step.

(Other embodiments)
(1) In each of the above embodiments, an n-channel type MOSFET in which the first conductivity type is n-type and the second conductivity type is p-type has been described as an example, but the conductivity type of each component is reversed. The present invention can also be applied to a p-channel type MOSFET. In the above description, a MOSFET having a trench gate structure has been described as an example. However, the present invention can also be applied to an IGBT having a similar trench gate structure. The IGBT only changes the conductivity type of the substrate 1 from n-type to p-type with respect to the first to fourth embodiments, and the other structures and manufacturing methods are the same as those of the first to fourth embodiments. .

(2) In the first to fourth embodiments, the p-type base region 3 and the n ⁺ -type source region 4 are formed before the trench 6 is formed. However, after the trench 6 is formed, the p-type base region 3 is formed. Alternatively, the n ⁺ -type source region 4 and the like may be formed by ion implantation. In the first to third embodiments, the n ⁺ type source region 4 may be in contact with the gate oxide film 8 as long as the n ⁺ type source region 4 is formed by ion implantation. Furthermore, if the p-type base region 3 is formed by ion implantation, the p-type base region 3 can be separated from the side surface of the trench 6, so that the n remaining between the side surface of the trench 6 and the p-type base region 3. It is also possible for the ⁻ type drift layer 2 to function as the n type channel layer 7. Of course, in this case as well, the p-type base region 3 and the n ⁺ -type source region 4 may be formed either before or after the trench 6 is formed.

(3) In each of the above embodiments, the case where the n ⁺ type source region 4 and the n ⁺ type body layer 5 are formed by ion implantation has been described. However, any one of these may be formed by epitaxial growth. You can also.

(4) The structures shown in the above embodiments are merely examples, and settings can be changed as appropriate. For example, the p-type base region 3 is electrically connected to the source electrode 11 via the p ⁺ -type body layer 5, but the p-type base region 3 is the source with the p ⁺ -type body layer 5 as a simple contact portion. A structure that is electrically connected to the electrode 11 may be used. In addition, the gate oxide film 8 by thermal oxidation has been described as an example of the gate insulating film, but an oxide film or nitride film not by thermal oxidation may be included. The drain electrode 13 may be formed after the source electrode 11 is formed.

(5) In the second embodiment, the case where the current distribution layer 30 has a higher concentration than the n ⁻ type drift layer 2 has been described, but the same concentration as the n ⁻ type drift layer may be used. The trench 6 is formed after the current spreading layer 30 is formed. However, the position of the bottom surface of the trench 6 is higher than that in the case where the current spreading layer 30 is not formed at least by the amount of the current spreading layer 30 formed. . For this reason, the position of the p-type deep layer 10 is deeper than the position of the bottom surface of the trench 6, and at least the effect that the electric field relaxation effect on the bottom surface of the trench 6 can be enhanced compared to the first embodiment is obtained. be able to.

  (6) In addition, when indicating the orientation of a crystal, a bar (-) should be attached above a desired number, but in this specification, there is a limitation in expression based on a personal computer application. , And a bar before the desired number.

1 is a cross-sectional view of a MOSFET having an accumulation type trench gate structure according to a first embodiment of the present invention. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is CC sectional drawing of FIG. It is DD sectional drawing of FIG. (A), (b) is the SiC semiconductor device which has the p-type deep layer 10 shown in FIG. 1, and the SiC semiconductor which does not have the p-type deep layer 10 conventionally, in the cross section corresponding to FIG. It is the figure which showed the electric potential distribution of an apparatus. FIG. 4 is a diagram showing a potential distribution in a cross section different from that of FIG. 3A regarding the SiC semiconductor device having the p-type deep layer 10 shown in FIG. 1. FIG. 3 is a cross-sectional view showing a manufacturing process of the trench gate type MOSFET shown in FIG. 1. FIG. 6 is a cross-sectional view showing the manufacturing process of the trench gate type MOSFET subsequent to FIG. 5. It is sectional drawing of MOSFET of the accumulation type trench gate structure concerning 2nd Embodiment of this invention. It is EE sectional drawing of FIG. It is FF sectional drawing of FIG. It is GG sectional drawing of FIG. It is HH sectional drawing of FIG. FIG. 8 is a cross-sectional view showing a manufacturing process of the trench gate type MOSFET shown in FIG. 7. FIG. 9 is a cross-sectional view showing the manufacturing process of the trench gate type MOSFET following FIG. 8. It is sectional drawing of MOSFET of the accumulation type trench gate structure concerning 3rd Embodiment of this invention. It is II sectional drawing of FIG. It is JJ sectional drawing of FIG. It is KK sectional drawing of FIG. It is LL sectional drawing of FIG. FIG. 12 is a cross-sectional view showing a manufacturing process of the trench gate type MOSFET shown in FIG. 11. FIG. 14 is a cross-sectional view showing the manufacturing process of the trench gate type MOSFET subsequent to FIG. 13. It is sectional drawing of MOSFET of the inversion type trench gate structure concerning 4th Embodiment of this invention.

Explanation of symbols

1 n ⁺ type substrate 2 n ⁻ type drift layer 3 p type base region 4 n ⁺ type source region 5 p ⁺ type body layer 6 trench 7 n type channel layer 8 gate oxide film 9 gate electrode 10 p type deep layer 11 source electrode 12 Interlayer insulating film 13 Drain electrode 20 Mask 30 N-type current spreading layer

Claims (15)

A first or second conductivity type substrate (1) made of silicon carbide;
A drift layer (2) made of silicon carbide of the first conductivity type formed on the substrate (1) and having a lower impurity concentration than the substrate (1);
A trench (6) formed from the surface of the drift region (2);
A gate insulating film (8) formed in the trench (6);
The second conductivity type silicon carbide formed on both sides of the trench (6) and spaced apart from the gate insulating film (8) located on the side surface of the trench (6). A base region (3)
A channel layer (7) of a first conductivity type made of silicon carbide formed between the base region (3) and the gate insulating film (8);
A first layer having a higher concentration than that of the drift layer (2) formed in the upper layer portion of the base region (3), in contact with the channel layer (7) and on both sides of the trench (6). A source region (4) made of silicon carbide of one conductivity type;
A gate electrode (9) formed on the gate insulating film (8) in the trench (6);
A source electrode (11) electrically connected to the source region (4) and the base region (3);
A drain electrode (13) formed on the back side of the substrate (1),
By controlling the voltage applied to the gate electrode (9), the storage channel formed in the channel layer (7) is controlled, and through the source region (4) and the drift layer (2), A silicon carbide semiconductor device comprising a storage MOSFET that allows current to flow between the source electrode (11) and the drain electrode (13),
The trench is disposed below the base region (3) and deeper than the trench (6), and extends in a direction normal to the side surface of the trench (6) where the channel region is formed. A silicon carbide semiconductor device comprising a deep layer (10) of the second conductivity type. A first or second conductivity type substrate (1) made of silicon carbide;
A drift layer (2) made of silicon carbide of the first conductivity type formed on the substrate (1) and having a lower impurity concentration than the substrate (1);
A trench (6) formed from the surface of the drift region (2);
A base region (3) made of silicon carbide of the second conductivity type formed on both sides of the trench (6) so as to be in contact with the side surface of the trench (6);
Higher concentration than the drift layer (2) formed in the upper layer part of the base region (3), in contact with the side surface of the trench (6) and on both sides of the trench (6) A source region (4) composed of silicon carbide of the first conductivity type;
A gate insulating film (8) formed on the surface of the trench (6);
A gate electrode (9) formed on the gate insulating film (8) in the trench (6);
A source electrode (11) electrically connected to the source region (4) and the base region (3);
A drain electrode (13) formed on the back side of the substrate (1),
By controlling the voltage applied to the gate electrode (9), an inversion channel region is formed on the surface of the base region (3) located on the side surface of the trench (6), and the source region (4) And a silicon carbide semiconductor device comprising an inversion type MOSFET for passing a current between the source electrode (11) and the drain electrode (13) via the drift layer (2),
The trench is disposed below the base region (3) and deeper than the trench (6), and extends in a direction normal to the side surface of the trench (6) where the channel region is formed. A silicon carbide semiconductor device comprising a deep layer (10) of the second conductivity type.   The silicon carbide semiconductor device according to claim 1, wherein the deep layer (10) has the same or higher impurity concentration as the base region (3).   The said deep layer (10) is provided with two or more, Each deep layer (10) is arrange | positioned at predetermined intervals, and is arrange | positioned, The one of Claim 1 thru | or 3 characterized by the above-mentioned. Silicon carbide semiconductor device.   Between the drift layer (2) and the base region (3), there is a current spreading layer (30) made of silicon carbide of the first conductivity type and having a higher impurity concentration than the drift layer (2). The silicon carbide semiconductor device according to claim 1, wherein the silicon carbide semiconductor device is formed.   The silicon carbide semiconductor device according to claim 5, wherein the current spreading layer (30) has the same or higher impurity concentration as the drift layer (2).   The silicon carbide semiconductor device according to claim 5 or 6, wherein said trench (6) is formed so as to penetrate said current distribution layer (30) and reach said drift layer (2).   The silicon carbide semiconductor according to claim 5, wherein the deep layer (10) is in contact with the base region (3) through the current spreading layer (30). apparatus.   The drift layer (2) has a lower impurity concentration as it approaches the base region (3) from the substrate (1). Silicon carbide semiconductor device. Forming a drift layer (2) made of silicon carbide of the first conductivity type having a lower impurity concentration than that of the substrate (1) on the first or second conductivity type substrate (1) made of silicon carbide; When,
After the mask (20) is disposed on the surface of the drift layer (2), ion implantation using the mask (20) is performed, so that the second conductivity type deep layer ( 10) forming,
Forming a second conductivity type base region (3) on the deep layer (10) and the drift layer (2);
By ion-implanting the first conductivity type impurity into the surface layer portion of the base region (3) in the base region (3), the first conductivity type silicon carbide having a higher concentration than the drift layer (2) is obtained. Forming a configured source region (4);
The deep layer (10) extends from the surface of the source region (4) to the drift layer (2) through the base region (3) and shallower than the deep layer (10). Forming a trench (6) having a longitudinal direction perpendicular to the extending direction;
Forming a channel layer (7) made of silicon carbide of the first conductivity type in the trench (6);
Forming a gate insulating film (8) on the surface of the channel layer (7) in the trench (6);
Forming a gate electrode (9) on the gate insulating film (8) in the trench (5);
Forming a source electrode (11) electrically connected to the source region (4) and the base region (3);
Forming a drain electrode (13) on the back side of the substrate (1). A method for manufacturing a silicon carbide semiconductor device, comprising: Before the step of forming the base region (3), the surface of the drift layer (2) including the surfaces of the deep layer (10) and the drift layer (2) is more than the drift layer (2). Forming a current spreading layer (30) made of silicon carbide of the first conductivity type having a high concentration,
In the step of forming the base region (3), the base region (3) is formed on the surface of the current spreading layer (30), thereby forming the base region (3) into the deep layer (10) and the drift layer. The method for manufacturing a silicon carbide semiconductor device according to claim 10, wherein the method is formed on the layer (2). Forming a drift layer (2) made of silicon carbide of the first conductivity type having a lower impurity concentration than the substrate (1) on the first or second conductivity type substrate (1) made of silicon carbide; When,
Forming a first conductivity type current spreading layer (30) having a higher concentration than the drift layer (2) on the surface of the drift layer (2);
After disposing a mask (20) on the surface of the current spreading layer (30), ion implantation using the mask (20) is performed, so that the second conductivity type deep layer extends in one direction. Forming (10);
Forming a base region (3) made of silicon carbide of the second conductivity type on the surfaces of the current spreading layer (30) and the deep layer (10);
By ion-implanting the first conductivity type impurity into the surface layer portion of the base region (3) in the base region (3), the first conductivity type silicon carbide having a higher concentration than the drift layer (2) is obtained. Forming a configured source region (4);
From the surface of the source region (4) through the base region (3) to the current spreading layer (30) or the drift layer (2), and shallower than the deep layer (10) Forming a trench (6) having a longitudinal direction perpendicular to the direction in which the deep layer (10) is extended;
Forming a first conductivity type channel layer (7) in the trench (6);
Forming a gate insulating film (8) on the surface of the channel layer (7) in the trench (6);
Forming a gate electrode (9) on the gate insulating film (8) in the trench (5);
Forming a source electrode (11) electrically connected to the source region (4) and the base region (3);
Forming a drain electrode (13) on the back side of the substrate (1). A method for manufacturing a silicon carbide semiconductor device, comprising: Forming a drift layer (2) made of silicon carbide of the first conductivity type having a lower impurity concentration than that of the substrate (1) on the first or second conductivity type substrate (1) made of silicon carbide; When,
After the mask (20) is disposed on the surface of the drift layer (2), ion implantation using the mask (20) is performed, so that the second conductivity type deep layer ( 10) forming,
Forming a base region (3) made of silicon carbide of the second conductivity type on the deep layer (10) and the drift layer (2);
By ion-implanting the first conductivity type impurity into the surface layer portion of the base region (3) in the base region (3), the first conductivity type silicon carbide having a higher concentration than the drift layer (2) is obtained. Forming a configured source region (4);
The deep layer (10) extends from the surface of the source region (4) through the base region (3) to the drift layer (2) and shallower than the deep layer (10). Forming a trench (6) having a longitudinal direction perpendicular to the extending direction;
Forming a gate insulating film (8) on the surface of the trench (6);
Forming a gate electrode (9) on the gate insulating film (8) in the trench (5);
Forming a source electrode (11) electrically connected to the source region (4) and the base region (3);
Forming a drain electrode (13) on the back side of the substrate (1). A method for manufacturing a silicon carbide semiconductor device, comprising: Before the step of forming the base region (3), the surface of the drift layer (2) including the surfaces of the deep layer (10) and the drift layer (2) is more than the drift layer (2). Forming a current spreading layer (30) made of silicon carbide of the first conductivity type having a high concentration,
In the step of forming the base region (3), the base region (3) is formed on the surface of the current spreading layer (30), thereby forming the base region (3) into the deep layer (10) and the drift layer. The method for manufacturing a silicon carbide semiconductor device according to claim 13, wherein the method is formed on the layer (2). Forming a drift layer (2) made of silicon carbide of the first conductivity type having a lower impurity concentration than the substrate (1) on the first or second conductivity type substrate (1) made of silicon carbide; When,
Forming a first conductivity type current spreading layer (30) having a higher concentration than the drift layer (2) on the surface of the drift layer (2);
After disposing a mask (20) on the surface of the current spreading layer (30), ion implantation using the mask (20) is performed, so that the second conductivity type deep layer extends in one direction. Forming (10);
Forming a base region (3) made of silicon carbide of the second conductivity type on the surfaces of the current spreading layer (30) and the deep layer (10);
By ion-implanting the first conductivity type impurity into the surface layer portion of the base region (3) in the base region (3), the first conductivity type silicon carbide having a higher concentration than the drift layer (2) is obtained. Forming a configured source region (4);
From the surface of the source region (4) through the base region (3) to the current spreading layer (30) or the drift layer (2), and shallower than the deep layer (10) Forming a trench (6) having a longitudinal direction perpendicular to the direction in which the deep layer (10) is extended;
Forming a gate insulating film (8) on the surface of the trench (6);
Forming a gate electrode (9) on the gate insulating film (8) in the trench (5);
Forming a source electrode (11) electrically connected to the source region (4) and the base region (3);
Forming a drain electrode (13) on the back side of the substrate (1). A method for manufacturing a silicon carbide semiconductor device, comprising:

Images