JP2009188114A5 - - Google Patents

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Publication number
JP2009188114A5
JP2009188114A5 JP2008025438A JP2008025438A JP2009188114A5 JP 2009188114 A5 JP2009188114 A5 JP 2009188114A5 JP 2008025438 A JP2008025438 A JP 2008025438A JP 2008025438 A JP2008025438 A JP 2008025438A JP 2009188114 A5 JP2009188114 A5 JP 2009188114A5
Authority
JP
Japan
Prior art keywords
circuit board
flexible printed
printed circuit
conductor wiring
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008025438A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009188114A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008025438A priority Critical patent/JP2009188114A/ja
Priority claimed from JP2008025438A external-priority patent/JP2009188114A/ja
Priority to PCT/US2009/033029 priority patent/WO2009100103A2/en
Priority to EP09707836A priority patent/EP2248400A4/en
Priority to CN2009801042456A priority patent/CN101940073A/zh
Priority to US12/865,433 priority patent/US20100321916A1/en
Priority to KR1020107019207A priority patent/KR20100114111A/ko
Priority to TW098103748A priority patent/TW200942115A/zh
Publication of JP2009188114A publication Critical patent/JP2009188114A/ja
Publication of JP2009188114A5 publication Critical patent/JP2009188114A5/ja
Withdrawn legal-status Critical Current

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JP2008025438A 2008-02-05 2008-02-05 フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器 Withdrawn JP2009188114A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2008025438A JP2009188114A (ja) 2008-02-05 2008-02-05 フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器
PCT/US2009/033029 WO2009100103A2 (en) 2008-02-05 2009-02-04 Method of connection of flexible printed circuit board and electronic device obtained thereby
EP09707836A EP2248400A4 (en) 2008-02-05 2009-02-04 METHOD FOR CONNECTING A FLEXIBLE CONDUCTOR PLATE AND ELECTRONIC ARRANGEMENT OBTAINED THEREFROM
CN2009801042456A CN101940073A (zh) 2008-02-05 2009-02-04 挠性印制电路板与由其获得的电子设备的连接方法
US12/865,433 US20100321916A1 (en) 2008-02-05 2009-02-04 Method of connection of flexible printed circuit board and electronic device obtained thereby
KR1020107019207A KR20100114111A (ko) 2008-02-05 2009-02-04 연성 인쇄 회로 기판의 접속 방법 및 이에 의해 얻어진 전자 소자
TW098103748A TW200942115A (en) 2008-02-05 2009-02-05 Method of connection of flexible printed circuit board and electronic device obtained thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008025438A JP2009188114A (ja) 2008-02-05 2008-02-05 フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器

Publications (2)

Publication Number Publication Date
JP2009188114A JP2009188114A (ja) 2009-08-20
JP2009188114A5 true JP2009188114A5 (enExample) 2011-03-24

Family

ID=40952665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008025438A Withdrawn JP2009188114A (ja) 2008-02-05 2008-02-05 フレキシブルプリント回路基板の接続方法及び当該方法で得られる電子機器

Country Status (7)

Country Link
US (1) US20100321916A1 (enExample)
EP (1) EP2248400A4 (enExample)
JP (1) JP2009188114A (enExample)
KR (1) KR20100114111A (enExample)
CN (1) CN101940073A (enExample)
TW (1) TW200942115A (enExample)
WO (1) WO2009100103A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10420215B2 (en) 2012-06-29 2019-09-17 3M Innovative Properties Company Flexible printed circuit and a method of fabricating a flexible printed circuit
CN103200788B (zh) * 2013-04-10 2016-08-03 合肥京东方光电科技有限公司 一种压接头和压接装置
CN114762543A (zh) * 2016-02-12 2022-07-19 东洋纺株式会社 服装型电子设备及服装型电子设备的制造方法
KR102750572B1 (ko) * 2017-01-06 2025-01-07 삼성디스플레이 주식회사 표시 장치
CN107072077B (zh) * 2017-03-21 2018-06-01 常州安泰诺特种印制板有限公司 5g通讯用高频多层印制线路板制作工艺及其制成的线路板
WO2019120583A1 (en) 2017-12-22 2019-06-27 Huawei Technologies Co., Ltd. Flex on board anisotropic conductive adhesive interconnection
JP7373703B2 (ja) * 2019-07-18 2023-11-06 パナソニックＩｐマネジメント株式会社 ケーブルの接合方法
TWI710295B (zh) * 2020-01-02 2020-11-11 峻立科技股份有限公司 塑膠元件與電路板的結合方法
KR20210094195A (ko) 2020-01-20 2021-07-29 삼성디스플레이 주식회사 접착 부재, 이를 포함한 표시장치, 및 표시장치의 제조 방법
US11991824B2 (en) * 2020-08-28 2024-05-21 Unimicron Technology Corp. Circuit board structure and manufacturing method thereof
CN114430626B (zh) * 2020-10-29 2024-07-19 鹏鼎控股(深圳)股份有限公司 印刷线路板对印刷线路板连接结构及其制作方法
TWI881025B (zh) * 2021-01-25 2025-04-21 優顯科技股份有限公司 電子裝置及其製造方法
EP4255129A1 (en) 2022-03-31 2023-10-04 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Interconnection of printed circuit boards with nanowires

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH055675Y2 (enExample) * 1988-05-24 1993-02-15
JPH08293656A (ja) * 1995-04-25 1996-11-05 Kyocera Corp 配線接続構造
JP2000012609A (ja) * 1998-06-17 2000-01-14 Shinko Electric Ind Co Ltd 回路基板への半導体チップの実装方法
US6527162B2 (en) * 2000-08-04 2003-03-04 Denso Corporation Connecting method and connecting structure of printed circuit boards
US6921869B2 (en) * 2001-09-26 2005-07-26 Fujikura Ltd. Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof
JP2004319703A (ja) * 2003-04-15 2004-11-11 Shin Etsu Polymer Co Ltd リジット基板とフレキシブル基板との電極接続構造
JP2006024751A (ja) * 2004-07-08 2006-01-26 Three M Innovative Properties Co 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
JP2007005640A (ja) * 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法

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