JP2009176787A5 - - Google Patents
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- Publication number
- JP2009176787A5 JP2009176787A5 JP2008011036A JP2008011036A JP2009176787A5 JP 2009176787 A5 JP2009176787 A5 JP 2009176787A5 JP 2008011036 A JP2008011036 A JP 2008011036A JP 2008011036 A JP2008011036 A JP 2008011036A JP 2009176787 A5 JP2009176787 A5 JP 2009176787A5
- Authority
- JP
- Japan
- Prior art keywords
- etching
- coating
- sealed
- processing apparatus
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims 9
- 210000002381 Plasma Anatomy 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000005507 spraying Methods 0.000 claims 2
- 238000010894 electron beam technology Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000001020 plasma etching Methods 0.000 claims 1
- 238000003980 solgel method Methods 0.000 claims 1
- 238000007751 thermal spraying Methods 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008011036A JP2009176787A (ja) | 2008-01-22 | 2008-01-22 | エッチング処理装置及びエッチング処理室用部材 |
| KR1020080018539A KR100927209B1 (ko) | 2008-01-22 | 2008-02-28 | 에칭 처리장치 및 에칭 처리실용 부재 |
| US12/040,058 US20090183835A1 (en) | 2008-01-22 | 2008-02-29 | Etching process apparatus and member for etching process chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008011036A JP2009176787A (ja) | 2008-01-22 | 2008-01-22 | エッチング処理装置及びエッチング処理室用部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009176787A JP2009176787A (ja) | 2009-08-06 |
| JP2009176787A5 true JP2009176787A5 (fr) | 2011-03-31 |
Family
ID=40875506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008011036A Pending JP2009176787A (ja) | 2008-01-22 | 2008-01-22 | エッチング処理装置及びエッチング処理室用部材 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20090183835A1 (fr) |
| JP (1) | JP2009176787A (fr) |
| KR (1) | KR100927209B1 (fr) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5452905B2 (ja) * | 2008-10-31 | 2014-03-26 | 株式会社日本セラテック | 耐食性部材 |
| JP5651848B2 (ja) * | 2012-01-18 | 2015-01-14 | トーカロ株式会社 | フッ化物サーメット複合皮膜被覆部材およびその製造方法 |
| US9212099B2 (en) * | 2012-02-22 | 2015-12-15 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics |
| CN104342632B (zh) * | 2013-08-07 | 2017-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 预清洗腔室及等离子体加工设备 |
| US20150079370A1 (en) * | 2013-09-18 | 2015-03-19 | Applied Materials, Inc. | Coating architecture for plasma sprayed chamber components |
| US9869013B2 (en) | 2014-04-25 | 2018-01-16 | Applied Materials, Inc. | Ion assisted deposition top coat of rare-earth oxide |
| CN105428195B (zh) * | 2014-09-17 | 2018-07-17 | 东京毅力科创株式会社 | 等离子体处理装置用的部件和部件的制造方法 |
| KR101670457B1 (ko) * | 2014-11-28 | 2016-10-31 | 세메스 주식회사 | 지지 유닛 및 이를 포함하는 기판 처리 장치 |
| US11572617B2 (en) | 2016-05-03 | 2023-02-07 | Applied Materials, Inc. | Protective metal oxy-fluoride coatings |
| US10563303B2 (en) | 2017-05-10 | 2020-02-18 | Applied Materials, Inc. | Metal oxy-flouride films based on oxidation of metal flourides |
| JP6924618B2 (ja) * | 2017-05-30 | 2021-08-25 | 東京エレクトロン株式会社 | 静電チャック及びプラズマ処理装置 |
| JP7358655B2 (ja) | 2021-08-23 | 2023-10-10 | 株式会社日立ハイテク | プラズマ処理装置用保護皮膜の洗浄方法 |
| KR20240032700A (ko) | 2022-08-30 | 2024-03-12 | 주식회사 히타치하이테크 | 플라스마 처리 장치, 플라스마 처리 장치의 내부 부재, 및 플라스마 처리 장치의 내부 부재의 제조 방법 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4042006A (en) * | 1973-01-05 | 1977-08-16 | Siemens Aktiengesellschaft | Pyrolytic process for producing a band-shaped metal layer on a substrate |
| JPH11351546A (ja) * | 1998-06-08 | 1999-12-24 | Tokuyama Corp | 塩素含有量が低減された焼却飛灰の回収方法 |
| JP2003224077A (ja) * | 2002-01-30 | 2003-08-08 | Tokyo Electron Ltd | プラズマ処理装置、電極部材、バッフル板の製造方法、処理装置、および、表面処理方法 |
| US20080011421A1 (en) * | 2002-04-26 | 2008-01-17 | Accretech Usa, Inc. | Processing chamber having labyrinth seal |
| JP4503270B2 (ja) * | 2002-11-28 | 2010-07-14 | 東京エレクトロン株式会社 | プラズマ処理容器内部材 |
| JP4051351B2 (ja) * | 2004-03-12 | 2008-02-20 | トーカロ株式会社 | 熱放射性および耐損傷性に優れるｙ２ｏ３溶射皮膜被覆部材およびその製造方法 |
| JP2006199545A (ja) * | 2005-01-21 | 2006-08-03 | Toshiba Ceramics Co Ltd | イットリウム系セラミックス被覆材およびその製造方法 |
| AT503377B1 (de) * | 2006-02-02 | 2008-09-15 | Eiselt Primoz | Verfahren und vorrichtung zur plasmabehandlung von materialien |
| KR100819530B1 (ko) * | 2006-03-03 | 2008-04-04 | 가부시키가이샤 히다치 하이테크놀로지즈 | 플라즈마 에칭장치 및 플라즈마 처리실 내 부재의 형성방법 |
| KR20070094412A (ko) * | 2006-03-17 | 2007-09-20 | 코스텍시스템(주) | 이 중 열 차단 보호벽을 갖는 플라즈마 화학 증착 챔버 |
| JP4643478B2 (ja) * | 2006-03-20 | 2011-03-02 | トーカロ株式会社 | 半導体加工装置用セラミック被覆部材の製造方法 |
| JP4563966B2 (ja) * | 2006-05-31 | 2010-10-20 | トーカロ株式会社 | 半導体加工装置用部材およびその製造方法 |
| JP2009161846A (ja) * | 2007-12-10 | 2009-07-23 | Densho Engineering Co Ltd | プラズマ処理容器内部材の製造方法 |
-
2008
- 2008-01-22 JP JP2008011036A patent/JP2009176787A/ja active Pending
- 2008-02-28 KR KR1020080018539A patent/KR100927209B1/ko not_active IP Right Cessation
- 2008-02-29 US US12/040,058 patent/US20090183835A1/en not_active Abandoned
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