CN104342632B - 预清洗腔室及等离子体加工设备 - Google Patents
预清洗腔室及等离子体加工设备 Download PDFInfo
- Publication number
- CN104342632B CN104342632B CN201310341787.3A CN201310341787A CN104342632B CN 104342632 B CN104342632 B CN 104342632B CN 201310341787 A CN201310341787 A CN 201310341787A CN 104342632 B CN104342632 B CN 104342632B
- Authority
- CN
- China
- Prior art keywords
- cavity
- filter
- cleaning
- plasma
- load bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32871—Means for trapping or directing unwanted particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
- C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32422—Arrangement for selecting ions or species in the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
- H01J37/32495—Means for protecting the vessel against plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32651—Shields, e.g. dark space shields, Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/335—Cleaning
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (21)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310341787.3A CN104342632B (zh) | 2013-08-07 | 2013-08-07 | 预清洗腔室及等离子体加工设备 |
TW103126183A TW201519354A (zh) | 2013-08-07 | 2014-07-31 | 預清洗腔室及半導體加工裝置 |
KR1020167005569A KR101780013B1 (ko) | 2013-08-07 | 2014-08-05 | 전세정 챔버 및 반도체 가공 장치 |
JP2016532222A JP2016531436A (ja) | 2013-08-07 | 2014-08-05 | プレクリーニングチャンバおよび半導体処理装置 |
PCT/CN2014/083709 WO2015018316A1 (zh) | 2013-08-07 | 2014-08-05 | 预清洗腔室及半导体加工设备 |
SG11201600633WA SG11201600633WA (en) | 2013-08-07 | 2014-08-05 | Pre-cleaning chamber and semiconductor processing device |
US15/012,941 US20160148789A1 (en) | 2013-08-07 | 2016-02-02 | Pre-cleaning chamber and a semiconductor processing apparatus containing the same |
JP2018032208A JP2018117137A (ja) | 2013-08-07 | 2018-02-26 | プレクリーニングチャンバおよび半導体処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310341787.3A CN104342632B (zh) | 2013-08-07 | 2013-08-07 | 预清洗腔室及等离子体加工设备 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104342632A CN104342632A (zh) | 2015-02-11 |
CN104342632B true CN104342632B (zh) | 2017-06-06 |
Family
ID=52460654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310341787.3A Active CN104342632B (zh) | 2013-08-07 | 2013-08-07 | 预清洗腔室及等离子体加工设备 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20160148789A1 (zh) |
JP (2) | JP2016531436A (zh) |
KR (1) | KR101780013B1 (zh) |
CN (1) | CN104342632B (zh) |
SG (1) | SG11201600633WA (zh) |
TW (1) | TW201519354A (zh) |
WO (1) | WO2015018316A1 (zh) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
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GB201502453D0 (en) * | 2015-02-13 | 2015-04-01 | Spts Technologies Ltd | Plasma producing apparatus |
CN104878361B (zh) * | 2015-06-24 | 2017-05-31 | 安徽纯源镀膜科技有限公司 | 磁控溅射镀膜设备 |
CN106601579B (zh) * | 2015-10-19 | 2019-02-19 | 北京北方华创微电子装备有限公司 | 上电极机构及半导体加工设备 |
EP3385978B1 (en) * | 2015-12-02 | 2021-01-27 | Fujikura Ltd. | Ion filter and method for manufacturing ion filter |
US9761410B2 (en) * | 2016-02-01 | 2017-09-12 | Varian Semiconductor Equipment Associates, Inc. | Apparatus and method for in-situ cleaning in ion beam apparatus |
CN107295738B (zh) * | 2016-04-11 | 2020-02-14 | 北京北方华创微电子装备有限公司 | 一种等离子体处理装置 |
KR102570269B1 (ko) | 2016-07-22 | 2023-08-25 | 삼성전자주식회사 | 전세정 장치 및 기판 처리 시스템 |
US10730082B2 (en) * | 2016-10-26 | 2020-08-04 | Varian Semiconductor Equipment Associates, Inc. | Apparatus and method for differential in situ cleaning |
US10604841B2 (en) * | 2016-12-14 | 2020-03-31 | Lam Research Corporation | Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition |
CN108668422B (zh) * | 2017-03-30 | 2021-06-08 | 北京北方华创微电子装备有限公司 | 一种等离子体产生腔室和等离子体处理装置 |
CN108666538A (zh) * | 2017-04-01 | 2018-10-16 | 清华大学 | 锂离子电池 |
CN108882494B (zh) * | 2017-05-08 | 2022-06-17 | 北京北方华创微电子装备有限公司 | 等离子体装置 |
CN109390197B (zh) * | 2017-08-08 | 2023-04-14 | 北京北方华创微电子装备有限公司 | 预清洗腔室和半导体加工设备 |
CN107552392A (zh) * | 2017-09-29 | 2018-01-09 | 江苏云端重工科技有限公司 | 一种尾砂提炼过滤基座 |
CN108807127B (zh) * | 2018-06-01 | 2020-03-31 | 北京北方华创微电子装备有限公司 | 上电极组件、反应腔室以及原子层沉积设备 |
KR102590963B1 (ko) * | 2018-07-27 | 2023-10-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 개선된 이온 블로커를 갖는 원격 용량성 결합 플라즈마 소스 |
CN110055514B (zh) * | 2019-06-11 | 2021-04-27 | 厦门乾照光电股份有限公司 | 气相沉积设备及其控制方法、腔体清洁方法 |
CN110335802B (zh) * | 2019-07-11 | 2022-03-22 | 北京北方华创微电子装备有限公司 | 预清洗腔室及其过滤装置 |
CN110349830B (zh) * | 2019-09-09 | 2020-02-14 | 北京北方华创微电子装备有限公司 | 等离子体系统以及应用于等离子体系统的过滤装置 |
CN111261554A (zh) * | 2020-01-19 | 2020-06-09 | 长江存储科技有限责任公司 | 清洗装置及方法 |
JP7537846B2 (ja) | 2021-02-02 | 2024-08-21 | 東京エレクトロン株式会社 | 処理容器とプラズマ処理装置、及び処理容器の製造方法 |
US11955322B2 (en) * | 2021-06-25 | 2024-04-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Device for adjusting position of chamber and plasma process chamber including the same for semiconductor manufacturing |
CN113903649B (zh) * | 2021-09-23 | 2024-04-12 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
CN114078685B (zh) * | 2021-11-17 | 2024-05-17 | 北京北方华创微电子装备有限公司 | 半导体工艺设备 |
KR102453704B1 (ko) | 2022-04-07 | 2022-10-12 | 주식회사 세미노바 | 웨이퍼 pvd 공정용 프리 크린 장치 |
CN115613140B (zh) * | 2022-12-16 | 2023-03-21 | 江苏邑文微电子科技有限公司 | 横向等离子体发生室和多功能高温反应装置 |
KR20240128193A (ko) * | 2023-02-17 | 2024-08-26 | 피에스케이 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
CN117524866B (zh) * | 2024-01-05 | 2024-04-05 | 上海谙邦半导体设备有限公司 | 一种碳化硅沟槽表面的修复方法、修复设备及半导体器件 |
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CN103035468A (zh) * | 2011-09-29 | 2013-04-10 | 东京毅力科创株式会社 | 自由基选择装置和基板处理装置 |
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-
2013
- 2013-08-07 CN CN201310341787.3A patent/CN104342632B/zh active Active
-
2014
- 2014-07-31 TW TW103126183A patent/TW201519354A/zh unknown
- 2014-08-05 KR KR1020167005569A patent/KR101780013B1/ko active IP Right Grant
- 2014-08-05 JP JP2016532222A patent/JP2016531436A/ja active Pending
- 2014-08-05 SG SG11201600633WA patent/SG11201600633WA/en unknown
- 2014-08-05 WO PCT/CN2014/083709 patent/WO2015018316A1/zh active Application Filing
-
2016
- 2016-02-02 US US15/012,941 patent/US20160148789A1/en not_active Abandoned
-
2018
- 2018-02-26 JP JP2018032208A patent/JP2018117137A/ja active Pending
Patent Citations (4)
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CN1807681A (zh) * | 2005-01-20 | 2006-07-26 | 三星Sdi株式会社 | 蒸镀装置及利用该蒸镀装置的蒸镀方法 |
TW201214522A (en) * | 2010-09-27 | 2012-04-01 | Beijing Nmc Co Ltd | Sputtering chamber, pre-clean chamber and plasma processing apparatus |
CN103035468A (zh) * | 2011-09-29 | 2013-04-10 | 东京毅力科创株式会社 | 自由基选择装置和基板处理装置 |
CN103035466A (zh) * | 2011-10-08 | 2013-04-10 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种预清洗方法及等离子体设备 |
Also Published As
Publication number | Publication date |
---|---|
KR101780013B1 (ko) | 2017-09-19 |
US20160148789A1 (en) | 2016-05-26 |
SG11201600633WA (en) | 2016-02-26 |
KR20160040649A (ko) | 2016-04-14 |
JP2016531436A (ja) | 2016-10-06 |
CN104342632A (zh) | 2015-02-11 |
WO2015018316A1 (zh) | 2015-02-12 |
TW201519354A (zh) | 2015-05-16 |
JP2018117137A (ja) | 2018-07-26 |
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