JP2009158633A - 不揮発性半導体記憶装置およびその製造方法 - Google Patents
不揮発性半導体記憶装置およびその製造方法 Download PDFInfo
- Publication number
- JP2009158633A JP2009158633A JP2007333612A JP2007333612A JP2009158633A JP 2009158633 A JP2009158633 A JP 2009158633A JP 2007333612 A JP2007333612 A JP 2007333612A JP 2007333612 A JP2007333612 A JP 2007333612A JP 2009158633 A JP2009158633 A JP 2009158633A
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- Prior art keywords
- floating gate
- diffusion layer
- memory device
- semiconductor memory
- impurity diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 96
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 23
- 239000012535 impurity Substances 0.000 claims abstract description 90
- 238000009792 diffusion process Methods 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000000926 separation method Methods 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract description 2
- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- 229920005591 polysilicon Polymers 0.000 abstract description 2
- 239000012212 insulator Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 70
- 230000008569 process Effects 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 238000009825 accumulation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000002784 hot electron Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007333612A JP2009158633A (ja) | 2007-12-26 | 2007-12-26 | 不揮発性半導体記憶装置およびその製造方法 |
US12/341,209 US8189385B2 (en) | 2007-12-26 | 2008-12-22 | Nonvolatile semiconductor memory device, method for manufacturing the same, and nonvolatile memory array |
CN200810185251.6A CN101471383B (zh) | 2007-12-26 | 2008-12-24 | 非易失性半导体存储装置,其制造方法以及非易失性存储器阵列 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007333612A JP2009158633A (ja) | 2007-12-26 | 2007-12-26 | 不揮発性半導体記憶装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009158633A true JP2009158633A (ja) | 2009-07-16 |
Family
ID=40828627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007333612A Pending JP2009158633A (ja) | 2007-12-26 | 2007-12-26 | 不揮発性半導体記憶装置およびその製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2009158633A (zh) |
CN (1) | CN101471383B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102222646B (zh) * | 2011-04-25 | 2015-08-19 | 上海华虹宏力半导体制造有限公司 | 分栅式存储器制造方法以及分栅式存储器 |
KR102415409B1 (ko) * | 2015-09-09 | 2022-07-04 | 에스케이하이닉스 주식회사 | 이피롬 셀 및 그 제조방법과, 이피롬 셀 어레이 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57160166A (en) * | 1981-03-27 | 1982-10-02 | Seiko Instr & Electronics Ltd | Non-volatile semiconductor memory |
JP2007067428A (ja) * | 2002-05-10 | 2007-03-15 | Toshiba Corp | 不揮発性半導体記憶置 |
JP2007251183A (ja) * | 2006-03-13 | 2007-09-27 | Silicon Storage Technology Inc | 単一ゲートの不揮発性フラッシュメモリセル |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4335659B2 (ja) * | 2003-12-19 | 2009-09-30 | 株式会社ルネサステクノロジ | 不揮発性半導体記憶装置 |
-
2007
- 2007-12-26 JP JP2007333612A patent/JP2009158633A/ja active Pending
-
2008
- 2008-12-24 CN CN200810185251.6A patent/CN101471383B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57160166A (en) * | 1981-03-27 | 1982-10-02 | Seiko Instr & Electronics Ltd | Non-volatile semiconductor memory |
JP2007067428A (ja) * | 2002-05-10 | 2007-03-15 | Toshiba Corp | 不揮発性半導体記憶置 |
JP2007251183A (ja) * | 2006-03-13 | 2007-09-27 | Silicon Storage Technology Inc | 単一ゲートの不揮発性フラッシュメモリセル |
Also Published As
Publication number | Publication date |
---|---|
CN101471383A (zh) | 2009-07-01 |
CN101471383B (zh) | 2013-06-26 |
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