JP2009158561A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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Abstract
【解決手段】第1の方向に沿って一列に配置された複数のボンディングパッド4からなるボンディングパッドセット(第1の列L1)と第1の方向に沿って一列に配置された複数のボンディングパッド5からなるボンディングパッドセット(第2の列L2)とが、第1の方向と直交する第2の方向に沿って設けられており、第1の列L1を構成する各々のボンディングパッド4と第2の列L2を構成する各々のボンディングパッド5とは第2の方向と同一線上に並んで設けられており、第1の列L1を構成する複数のボンディングパッド4または第2の列L2を構成する複数のボンディングパッド5の全部または一部にボンディングワイヤを接続する。
【選択図】図1
Description
本発明の実施の形態1による半導体装置に設けられたボンディングパッドの配置の一例を図1〜図3に示す。図1はボンディングパッドの配置の一例を説明する半導体装置全体の平面図、図2は図1の一部を拡大した要部平面図、図3(a)、(b)、(c)および(d)はそれぞれ図2のA−A′線、B−B′線、C−C′線およびD−D′線における要部断面図である。
に沿う周辺部3および第2辺S2に対向する第4辺S4に沿う周辺部3にも、それぞれ第2の方向に沿って複数のボンディングパッドからなる第1の列L1および第2の列L2の2列を配置してもよい。
本発明の実施の形態2による半導体装置に設けられたボンディングパッドの配置の一例を図5に示す。図5はボンディングパッドの配置の一例を説明する半導体装置の一部を拡大した要部平面図である。
2 製品部
3 周辺部
4,5,6,7 ボンディングパッド
IS 絶縁膜
L1 第1の列
L2 第2の列
L3 第1の千鳥状の列
L4 第2の千鳥状の列
M1 1層目のパッド用配線
M2 2層目のパッド用配線
M3 3層目のパッド用配線
M4 4層目のパッド用配線
S1 第1の辺
S2 第2の辺
S3 第3の辺
S4 第4の辺
Sub 半導体基板
Claims (10)
- 第1の方向に沿って配置された複数のボンディングパッドからなるボンディングパッドセットが、前記第1の方向と直交する第2の方向に沿って複数設けられており、
一のボンディングパッドセットを構成する各々のボンディングパッドが他のボンディングパッドセットを構成する各々のボンディングパッドと前記第2の方向と同一線上に並んで設けられており、
前記一のボンディングパッドセットは、前記他のボンディングパッドセットを構成し、前記第2の方向と同一線上に並んで配置されていないボンディングパッドとパッド用配線を介して電気的に接続されたボンディングパッドを含むことを特徴とする半導体装置。 - 請求項1記載の半導体装置において、前記一のボンディングパッドセットは、さらに前記他のボンディングパッドセットを構成し、前記第2の方向と同一線上に並んで配置されたボンディングパッドとパッド用配線を介して電気的に接続されたボンディングパッドを含むことを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記一のボンディングパッドセットを構成する複数のボンディングパッドの全部または一部にボンディングワイヤが接続されることを特徴とする半導体装置。
- 請求項5記載の半導体装置において、前記ボンディングワイヤが接続されない前記一のボンディングセットを構成するボンディングパッドおよび前記他のボンディングセットを構成するボンディングパッドは、検査時に検査用のプローブ針を接触させる検査用パッドに用いられることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記ボンディングパッドセットが前記第2の方向に沿って3セット以上設けられていることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記ボンディングパッドセットを構成する複数のボンディングパッドは最上層配線を用いて形成され、前記パッド用配線は前記最上層配線よりも下層の配線を用いて形成されていることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記ボンディングパッドセットを構成する複数のボンディングパッドは種々の回路が形成された製品部に最上層配線を用いて形成されていることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記ボンディングパッドセットを構成する複数のボンディングパッドは、種々の回路が形成された製品部以外の領域に最上層配線を用いて形成されていることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記ボンディングパッドセットを構成する複数のボンディングパッドは、前記第1の方向に沿って一例に配置されていることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記ボンディングパッドセットを構成する複数のボンディングパッドは、前記第1の方向に沿って千鳥状に配置されていることを特徴とする半導体装置。
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JP2007332195A JP5113509B2 (ja) | 2007-12-25 | 2007-12-25 | 半導体装置 |
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JP2015023159A (ja) * | 2013-07-19 | 2015-02-02 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1065103A (ja) * | 1996-08-19 | 1998-03-06 | Nec Corp | 半導体集積回路 |
JP2007149809A (ja) * | 2005-11-25 | 2007-06-14 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP2007165567A (ja) * | 2005-12-14 | 2007-06-28 | Matsushita Electric Ind Co Ltd | 半導体チップとその制御方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1065103A (ja) * | 1996-08-19 | 1998-03-06 | Nec Corp | 半導体集積回路 |
JP2007149809A (ja) * | 2005-11-25 | 2007-06-14 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP2007165567A (ja) * | 2005-12-14 | 2007-06-28 | Matsushita Electric Ind Co Ltd | 半導体チップとその制御方法 |
Cited By (1)
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JP2015023159A (ja) * | 2013-07-19 | 2015-02-02 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
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